ThermPaq from Flomerics accelerates thermal characterisation of semiconductor packages

Microelectronics International

ISSN: 1356-5362

Article publication date: 25 July 2008

Citation

(2008), "ThermPaq from Flomerics accelerates thermal characterisation of semiconductor packages", Microelectronics International, Vol. 25 No. 3. https://doi.org/10.1108/mi.2008.21825cad.001

Publisher

:

Emerald Group Publishing Limited

Copyright © 2008, Emerald Group Publishing Limited


ThermPaq from Flomerics accelerates thermal characterisation of semiconductor packages

Article Type: New products From: Microelectronics International, Volume 25, Issue 3

Flomerics has released a unique new software product, ThermPaq, that revolutionizes the process of semiconductor thermal characterization and design. ThermPaq provides a fast, simple, proven, automated process that reduces the number of distinct steps required to be performed by thermal experts, reducing the risk of modelling errors to enhance the quality, reliability, and availability of package thermal models.

ThermPaq is built upon Flomerics’ FLOPACK SmartPart technology and FLOTHERM’s CFD solver. The web-based tool is entirely wizard-driven which makes it attractive for engineers who are not thermal specialists. The result is a fully automated process for generating accurate package models and computing the complete set of JEDEC-compatible thermal characterization data. These include all θ and ψ metrics under various environmental conditions and industry-standard compact thermal models (for example, DELPHI compact modeling standards that are being currently adopted by the industry standards body JEDEC). Interfacing with Cadence APD, ThermPaq can take advantage of existing BGA layouts to capture metallization and via placement detail.

ThermPaq also serves as a powerful design tool for thermal specialists. Changes in thermal performance can be investigated through parametric variation of key package parameters to optimise the package thermal design. A comprehensive search function on all key package parameters and metric values allows the user to optimize the starting point for a new design. Package sub-elements such as substrates and leadframes are stored as separate libraries, facilitating the use of data from third-party vendors. Direct interfaces to semiconductor manufacturer packaging databases can also be created with minimal customization.

For further information, please visit the web site: www.thermpaq.com