To read the full version of this content please select one of the options below:

Prediction of microwave permittivity of leafy vegetation using Ag thick film microstripline

P.D. Kamble (Thick and Thin Film Device Laboratory, Department of Physics, Shivaji University, Kolhapur, India)
Vijaya Puri (Thick and Thin Film Device Laboratory, Department of Physics, Shivaji University, Kolhapur, India)

Microelectronics International

ISSN: 1356-5362

Article publication date: 25 July 2008

Abstract

Purpose

The purpose of this paper is to predict permittivity of leafy vegetation using overlay technique.

Design/methodology/approach

The paper studies X band moisture dependent microwave permittivity of the stem and leaf of Ficus Bengalensis using overlay on Ag thick film microstripline. The perturbation obtained in the transmission and reflectance of the thick film microstripline due to the leafy vegetation overlay has been used to obtain the permittivity.

Findings

The paper finds that the permittivities obtained are in the range expected of leafy vegetation with moisture. Only the amplitude data have been used here. As the moisture content decreases, the dielectric constant and dielectric loss decrease. The return loss characteristics show interesting frequency dependent behaviour due to both stem and leaf overlay.

Originality/value

The paper is original in that a non‐resonant microstrip component has been used for the first time for such studies. The thick film component along with overlay can be a cost‐effective dielectric sensor especially for biomaterials, since any size and shape of the overlay can be used.

Keywords

Citation

Kamble, P.D. and Puri, V. (2008), "Prediction of microwave permittivity of leafy vegetation using Ag thick film microstripline", Microelectronics International, Vol. 25 No. 3, pp. 37-40. https://doi.org/10.1108/13565360810889610

Publisher

:

Emerald Group Publishing Limited

Copyright © 2008, Emerald Group Publishing Limited