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Creation and verification of dynamic compact thermal model of a BGA package

F. Mohammadi (Department of Electrical and Computer Engineering, Ryerson University, Toronto, Canada)
M. Marami (Department of Electrical and Computer Engineering, Ryerson University, Toronto, Canada)

Microelectronics International

ISSN: 1356-5362

Article publication date: 25 July 2008

Abstract

Purpose

The purpose of this paper is to develop a dynamic compact thermal model (DCTM) of electronic packages. This model is a necessary tool for rapid thermal analysis of the systems which we exposed to boundary condition variation and/or power switching mode such as mobile systems and battery powered systems.

Design/methodology/approach

The methodology of compact model generation used was based on generating the transient dynamic detailed finite element thermal model of a package, designing a resistor/capacitor network topology representative of the dynamic detailed model, calculating the resistors'/capacitors' value by optimization method and validation efforts. The method is demonstrated for a ball grid array (BGA) package, a commonly used modern electronic package.

Findings

Based on the obtained results, it can be concluded that the dynamic thermal behavior of a BGA package can be accurately described by a generated dynamic compact model in terms of predicted junction temperature response and heat flux of the desired locations of the package.

Originality/value

This model is capable of calculating the temperatures and heat fluxes at desired locations which can help the designer to perform the thermal analysis much faster and easier with the required accuracy.

Keywords

Citation

Mohammadi, F. and Marami, M. (2008), "Creation and verification of dynamic compact thermal model of a BGA package", Microelectronics International, Vol. 25 No. 3, pp. 3-13. https://doi.org/10.1108/13565360810889566

Publisher

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Emerald Group Publishing Limited

Copyright © 2008, Emerald Group Publishing Limited