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The purpose of this study is to reveal the effect of nano-Al₂O₃ particle addition on the nucleation/growth kinetics, microhardness, wear resistance and corrosion resistance of Co–P–xAl₂O₃ nanocomposite plating.

The kinetics and properties of Co–P–xAl₂O₃ nanocomposite plating prepared by electroplating were investigated by electrochemical measurements, scanning electron microscopy, X-ray diffraction, X-ray photoelectron spectroscopy, Vickers microhardness measurement, SRV5 friction and wear tester and atomic force microscopy.

A 12 g/L nano-Al₂O₃ addition in the plating solution can transform the nucleation/growth kinetics of the plating from the 3D progressive model to the 3D instantaneous model. The microhardness of the plating increased with the increase of nano-Al₂O₃ content in plating. The wear resistance of the plating did not adhere strictly to Archard’s law. An even and denser corrosion product film was generated due to the finer grains, with a high corrosion resistance.

The effect of different nano-Al₂O₃ addition on the nucleation/growth kinetics and properties of Co–P–xAl₂O₃ nanocomposite plating was investigated, and an anticorrosion mechanism of Co–P–xAl₂O₃ nanocomposite plating was proposed.

This study aims to assess the efficacy of nano-alumina (nano-Al₂O₃) in improving the performance of epoxy adhesives used to assemble archaeological glass. The conservators face a significant problem in assembling this type of artifact. Therefore, the assembling process is considered one of the important stages that must be taken care of to preserve these artifacts from damage and loss.

To evaluate the stability of adhesives, the samples were subjected to artificial aging under varying environmental conditions. Some investigative techniques and mechanical testing were used in this study to evaluate the selected materials. It includes a transmission electron microscope, X-ray diffraction, visual assessment, digital microscope, scanning electron microscopy (SEM), color change and tensile strength test.

The visual evaluation and the digital microscope results showed that the epoxy/nano-Al₂O₃ greatly resisted artificial aging. Although slight yellowing was present, it did not significantly affect the general appearance of the samples. On the other hand, the pure epoxy sample showed cracks of different sizes on its surface due to aging, as evidenced by SEM examination. Furthermore, epoxy/nano-Al₂O₃ has a better tensile strength (11.27 MPa) and slight color change (ΔE = 2.06).

The main objective of the experimental study was to identify appropriate adhesive materials that possess key properties such as non-yellowing and improved tensile strength by conducting various tests and evaluations. Ultimately, the goal was to identify materials that could serve as effective adhesives for assembling the archaeological glass.

This study aims to summarize the effects of minor addition of Ho REE on the structure, mechanical strength and thermal stability of binary Sn- Ag solder alloys for high-performance applications.

This study investigates the effect of a small amount of holmium addition on the microstructure, thermal stability, mechanical behaviour and wettability of environmentally friendly eutectic melt-spun process Sn – Ag solder alloys. Dynamic resonance technique, X-ray diffraction (XRD) and scanning electron microscopy were carried to study stiffness, identification of the phases and the morphology features of the solder. Structure and microstructure analysis indicated that presence of rhombohedral ß-Sn phase in addition to orthorhombic IMC Ag₃Sn phase dispersed in Sn-matrix. Also, the results showed that Ho rare earth addition at a small trace amount into Sn-Ag system reduces and improves the particle size of both rhombohedral ß-Sn and orthorhombic IMC Ag₃Sn based on the adsorption effect of the active RE element. The adsorption of Ho at grain boundaries resulted in Ag₃Sn more uniform needle-like which is distributed in the ß-Sn matrix. The fine and uniform microstructure leads to improvement of mechanical strength. The microstructure refinement is due to the high surface free energy of IMC Ag₃Sn grains, and it prevents the dislocation slipping. This maybe enhance the micro-hardness and micro-creep hence delays the breaking point of the solder. Ho (RE) trace addition could enhance the melting temperature and contact angle up to 215°C and 31°, Respectively, compared with plain solder. All results showed that Ho trace addition element has an effective method to enhance new solder joints.

Effect of rare earth element Ho particles on the microstructure and mechanical behavior of eutectic Sn-3.5Ag solder alloy was studied. Some important conclusions are summarized in the following: microstructure investigations revealed that the addition of Ho particles to eutectic Sn-3.5Ag inhibited in reducing and refines the crystallite size as well as the Ag3Sn IMC which reinforced the strength of plain solder alloy. The mechanical properties values such as Young’s modulus, Vickers microhardness of Sn-3.5Ag solder alloy can be significantly improved by adding a trace amount of Ho particles compared with plain solder due to the existence of finer and higher volume fraction of Ag3SnIMC. These variations can be understood by considering the plastic deformation. The strengthening mechanism of the Sn-3.5Ag-Ho solder alloy could be explained in terms of Ho harden particles and finer IMC, which are distributed within eutectic regions because they act as pinning centres which inhibited the mobility of dislocation that concentrated around the grain boundaries. The results show that the best creep resistance is obtained when the addition of Ho 0.5 is compared to plain solder. The addition of Ho on Sn-3.5Ag lead-free solder alloy decreases the melting temperature to few degrees.

Development of holmium-doped eutectic Sn-Ag lead-free solder for electronic packaging.

The purpose of this paper is to study the effect of nano alumina (Al₂O₃) on the properties of fresh concrete, hardened concrete and microstructure of concrete incorporated with high range water reducer (HRWR). This initiative was taken to improve characteristic properties of concrete using nano alumina because nano alumina can be easily be manufactured from a scrap of industrial aluminum products, so its incorporation in concrete will not only reduce industrial aluminum waste but will also change the morphology of concrete at the microstructural level.

To accomplish the objectives of the research, four different concrete mixes with the constant water–cement ratio (W/C) and superplasticizer (SP) content 0.4 and 0.6% by weight of cement, respectively, were prepared, whereas nano alumina content was altered by 0.3% and 0.4% by weight of cement. Fresh property of concrete was analyzed by using slump cone test, whereas hardened properties of concrete were analyzed through compression test and flexural strength test. The interaction of nano alumina with concrete composite was evaluated using an X-ray diffraction test.

It was observed that 0.6% superplasticizer by weight of cement increased workability by 22% but with the addition of 0.3%, nano alumina by weight of cement workability decreased by 31%. Compressive strength increased by 4.88% with the addition of 0.6% superplasticizer but with the addition of 0.3% nano alumina by weight of cement compressive strength increased by 18.60%. Also, flexural strength increased by 1.21% with the addition of 0.6% superplasticizer by weight of cement but with the addition of 0.3% nano alumina by weight of cement flexural strength increased by 8.76%. With the addition of superplasticizer, alite and belite phases remained un-hydrated but with the addition of nano alumina alite phase was hydrated while belite phase was un-hydrated. The size of belite crystals in mixes having nano alumina was less than that of mix having 0.6% superplasticizer. Also with the addition of nano alumina, a calcium aluminum silicate phase was formed which was responsible for the increment of strength in mixes having nano alumina.

Incorporation nano alumina (Al₂O₃) in concrete will not only reduce industrial aluminum waste but will also reduce CO₂ emission. Nano alumina (Al₂O₃) also changes morphology of concrete at micro structural level.

The purpose of this paper is to manufacture an aluminium square cross-sectional bar by using conventional lathe machine from aluminium scraps through friction stir back extrusion (FSBE) process and study the viability of the process to produce the square bar.

The important tasks involved in this work are as follows: designing and manufacturing the chamber and plunger components used for experimental work, experimentally studying the thermo-mechanical progression of FSBE process on adapted conventional lathe machine and analyzing the relation between controlled parameter (like rotational speed and consolidation time) and response parameter (like extrusion time, extrusion rate, grain structure and hardness).

Preliminary results show that increasing or decreasing rotational speeds results in defects. Cold crack and twisting defect were shown on square bar fabricated using low rotational speed, and hot crack defects were observed on surface of the bars produced by higher rotational speed. The manufactured square bars were tested using optical microscope and Vickers hardness tester. Microstructural studies reveal that initial grains of aluminium wire undergo significant refinement and result in equiaxed and recrystallized grains in the square bar fabricated through FSBE method. The hardness tests show almost even distribution of hardness in the specimen, but hardness was lower than parent aluminium; in comparison, uneven distribution of hardness was seen in parent aluminium.

FSBE process is the new method to produce the bars and rods with better mechanical properties. The ambition of this work is to convert the existing scrap materials to useful products. Based on the literature review, the work has planned to perform extrusion process with the minimum effort and limited sources. In this manner, the work is highly original and under scientific mandate.

This paper aims to summarise the effects of ZnO nanoparticles (0.1, 0.3, 0.5, 0.7 and 1.0 Wt.%) on the structure, mechanical, electrical and thermal stability of Sn–3.5Ag–0.5Cu (SAC355) solder alloys for high-performance applications.

The phase identification and morphology of the solders were studied using X-ray diffraction and scanning electron microscopy. Thermal parameters were investigated using differential scanning calorimetry. The elastic parameters such as Young's modulus (E) and internal friction (Q⁻¹) were investigated using the dynamic resonance technique, whereas the Vickers hardness (Hv) and creep indentation (n) were examined using a Vickers microhardness tester.

Microstructural analysis revealed that ZnO nanoparticles (NPs) were distributed uniformly throughout the Sn matrix. Furthermore, addition of 0.1, 0.3 and 0.7 Wt.% of ZnO NPs to the eutectic (SAC355) prevented crystallite size reduction, which increased the strength of the solder alloy. Mechanical parameters such as Young's modulus improved significantly at 0.1, 0.3 and 0.7 Wt.% ZnO NP contents compared to the ZnO-free alloy. This variation can be understood by considering the plastic deformation. The Vickers hardness value (Hv) increased to its maximum as the ZnO NP content increased to 0.5. A stress exponent value (n) of approximately two in most composite solder alloys suggested that grain boundary sliding was the dominant mechanism in this system. The electrical resistance (ρ) increased its maximum value at 0.5 Wt.% ZnO NPs content. The addition of ZnO NPs to plain (SAC355) solder alloys increased the melting temperature (T_m) by a few degrees.

Development of eutectic (SAC355) lead-free solder doped with ZnO NPs use for electronic packaging.

This research outlines the development and characterization of advanced composite materials and their potential applications in the aerospace industry for interior applications. Advanced composites, such as carbon-fiber-reinforced polymers and ceramic matrix composites, offer significant advantages over traditional metallic materials in terms of weight reduction, stiffness and strength. These materials have been used in various aerospace applications, including aircraft, engines and thermal protection systems.

The development of design of experiment–based hybrid aluminum composites using the stir-casting technique has further enhanced the performance and cost-effectiveness of these materials. The design of the experiment was followed to fabricate hybrid composites with nano cerium oxide (nCeO₂) and graphene nanoplatelets (GNPs) as reinforcements in the Al-6061 matrix.

The Al6061 + 3% nCeO2 + 3% GNPs exhibited a high hardness of 119.6 VHN. The ultimate tensile strength and yield strength are 113.666 MPa and 73.08 MPa, respectively. A uniform distribution of reinforcement particulates was achieved with 3 Wt.% of each reinforcement in the matrix material, which is analyzed using scanning electron microscopy. Fractography revealed that brittle and ductile fractures caused the failure of the fractured specimens in the tensile test.

The manufactured aluminum composite can be applied in a range of exterior and interior structural parts like wings, wing boxes, motors, gears, engines, antennas, floor beams, etc. The fan case material of the GEnx engine (currently using carbon-fiber reinforcement plastic) for the Boeing 7E7 can be another replacement with manufactured hybrid aluminum composite, which predicts weight savings per engine of close to 120 kg.

The development of hybrid reinforcements, where two or more types of reinforcements are used in combination, is also a novel approach to improving the properties of these composites. Advanced composite materials are known for their high strength-to-weight ratio. If the newly developed composite material demonstrates superior properties, it can potentially be used to replace traditional materials in aircraft manufacturing. By reducing the weight of aircraft structures, fuel efficiency can be improved, leading to reduced operating costs and environmental impact. This allows for a more customized solution for specific application requirements and can lead to further advancements in materials science and technology.

This study aims to explore the feasibility of adding Si₃N₄ nanoparticles to Sn58Bi and provides a theoretical basis for designing and applying new lead-free solder materials for the electronic packaging industry.

In this paper, Sn58Bi-xSi₃N₄ (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 Wt.%) was prepared for bonding Cu substrate, and the changes in thermal properties, wettability, microstructure, interfacial intermetallic compound and mechanical properties of the composite solder were systematically studied.

The experiment results demonstrate that including Si₃N₄ nanoparticles does not significantly impact the melting point of Sn58Bi solder, and the undercooling degree of solder only fluctuates slightly. The molten solder spreading area reached a maximum of 96.17 mm², raised by 19.41% relative to those without Si₃N₄, and the wetting angle was the smallest at 0.6 Wt.% of Si₃N₄, with a minimum value of 8.35°. When the Si₃N₄ nanoparticles reach 0.6 Wt.%, the solder joint microstructure is significantly refined. Appropriately adding Si₃N₄ nanoparticles will slightly increase the solder alloy hardness. When the concentration of Si₃N₄ reaches 0.6 Wt.%, the joints shear strength reached 45.30 MPa, representing a 49.85% increase compared to those without additives. A thorough examination indicates that legitimately incorporating Si₃N₄ nanoparticles into Sn58Bi solder can enhance its synthetical performance, and 0.6 Wt.% is the best addition amount in our test setting.

In this paper, Si₃N₄ nanoparticles were incorporated into Sn58Bi solder, and the effects of different contents of Si₃N₄ nanoparticles on Sn58Bi solder were investigated from various aspects.

Aluminium is the most preferred material in engineering structural components because of its excellent properties. Furthermore, the properties of aluminium may be enhanced through metal matrix composites and an in-depth investigation on the evolved properties is needed in view of metallurgical, mechanical and tribological aspects. The purpose of this study is to explore the effect of TiC addition on the tribological behavior of aluminium composites.

Aluminium metal matrix composites at different weight percentage of titanium carbide were produced through powder metallurgy. Produced composites were subjected to sliding wear test under dry condition through Taguchi’s L9 orthogonal design.

Optimal process condition to achieve the minimum wear rate was identified though the main effect plot. Sliding velocity was identified as the most dominating factor in the wear resistance.

The production of components with improved properties is promoted efficiently and economically by synthesizing the composite via powder metallurgy.

Though the investigations on the wear behavior of aluminium composites are analyzed, reinforcement types and the mode of fabrication have their significance in the metallurgical and mechanical properties. Thus, the produced component needs an in-detail study on the property evolution.

This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO₂ nanoparticles in an electronic assembly.

This study focused on the microstructure and quality of solder joints. Various percentages of TiO₂ nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine.

The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO₂ content of 0.05 Wt.%. Increasing the TiO₂ content to 0.15 Wt.% led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards.

This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry.

The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO₂ on the microstructure and the fillet height of ultra-fine capacitors.