Search results

The purpose of this paper is to investigate the effects of electric current stressing on damping properties of Sn5Sb solder.

Uniformly shaped Sn5Sb solders were prepared as samples. The length, width and thickness of the samples were 60.0, 5.0 and 0.5 mm, respectively. The damping properties of the samples were tested by dynamic mechanical analyzer with a cooling system to control the test temperature in the range of −100 to 100°C. Simultaneously, electric current was imposed to the tested samples using a direct current supply. After tests, the samples were characterized using scanning electron microscope, electron backscatter diffraction and transmission electron microscope, which was aimed to figure out the damping mechanism in terms of electric current stressing induced microstructure evolution.

It is confirmed experimentally that the increase in damping properties is due to Joule heating and athermal effects of current stressing, in which Joule heating should make a higher contribution. G–L theory can be used to explain the damping properties of strain amplitude under current stressing by quantitative description of geometrically necessary dislocation density. While the critical strain amplitude and high temperature activation energy decrease with increasing electric current.

These results provide a new method for vibration reliability evaluation of high-temperature lead-free solders in serving electronics. Notably, this method should be also inspiring for the mechanical performance evaluation and reliability assessment of conductive materials and structures serving under electric current stressing.

This study aims to assess the efficacy of nano-alumina (nano-Al₂O₃) in improving the performance of epoxy adhesives used to assemble archaeological glass. The conservators face a significant problem in assembling this type of artifact. Therefore, the assembling process is considered one of the important stages that must be taken care of to preserve these artifacts from damage and loss.

To evaluate the stability of adhesives, the samples were subjected to artificial aging under varying environmental conditions. Some investigative techniques and mechanical testing were used in this study to evaluate the selected materials. It includes a transmission electron microscope, X-ray diffraction, visual assessment, digital microscope, scanning electron microscopy (SEM), color change and tensile strength test.

The visual evaluation and the digital microscope results showed that the epoxy/nano-Al₂O₃ greatly resisted artificial aging. Although slight yellowing was present, it did not significantly affect the general appearance of the samples. On the other hand, the pure epoxy sample showed cracks of different sizes on its surface due to aging, as evidenced by SEM examination. Furthermore, epoxy/nano-Al₂O₃ has a better tensile strength (11.27 MPa) and slight color change (ΔE = 2.06).

The main objective of the experimental study was to identify appropriate adhesive materials that possess key properties such as non-yellowing and improved tensile strength by conducting various tests and evaluations. Ultimately, the goal was to identify materials that could serve as effective adhesives for assembling the archaeological glass.

The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the transmission frequency increases from Sub-6 GHz in previous generations to millimeter (mm) wave in fifth-generation (5G) communication technology.

The approach involves theoretical analysis and actual case study by various characterization techniques, such as a stereo microscope, metallographic microscope, scanning electron microscope, energy dispersive spectroscopy, focused ion beam, high-frequency structure simulator, stripline resonator and mechanical test.

To meet PCB signal integrity demands in mm-wave frequency bands, the improving proposals on copper profile, resin system, reinforcement fabric, filler, electromagnetic interference-reducing design, transmission line as well as via layout, surface treatment, drilling, desmear, laminating and electroplating were discussed. And the failure causes and effects of typical reliability issues, including complex permittivity fluctuation at different frequencies or environments, weakening of peel strength, conductive anodic filament, crack on microvias, the effect of solder joint void on signal transmission performance and soldering anomalies at ball grid array location on high-speed PCBs, were demonstrated.

The PCB reliability problem is the leading factor to cause failures of PCB assemblies concluded from statistical results on the failure cases sent to our laboratory. The PCB reliability level is very essential to guarantee the reliability of the entire equipment. In this paper, the summarized technical demands and reliability issues that are rarely reported in existing articles were discussed systematically with new perspectives, which will be very critical to identify potential reliability risks for PCB in 5G mm-wave applications and implement targeted improvements.

This study aims to evaluate the state of preservation of one of the most famous manuscripts dated back to the 15th century using some analytical techniques to identify the manuscript components, explain its deterioration mechanisms and produce some solutions for conservation processes in future studies.

The analytical techniques used were visual assessment, digital microscope, scanning electron microscope (SEM) with EDX, pH measurement, attenuated total reflection – Fourier transform infrared spectroscopy (ATR/FTIR) and cellulose crystallinity.

Stains, missed parts and scratching were the most common aspects of deterioration. Some insects were observed by digital microscope. The SEM showed that linen fibers and goat skin were used to manufacture paper sheets and leather binding. Energy dispersive X-ray analysis proved that niobium and tantalum were added during the manufacture of paper sheets. Carbon black ink was the main writing material. The other pigments used were cinnabar in red ink, gold color from brass and blue color from lapis lazuli. FTIR analysis proved that some chemical changes were noticed. Low crystallinity of the historical paper was obtained. There was a reduction in the pH value of the historical bookbinding.

The importance of the analytical techniques used to detect the main components, forms and mechanism of deterioration of the studied manuscript. The elements of niobium and tantalum were added to paper sheets, which protected them from deterioration. The insects such as house flies and Sitophilus granarius were found in the manuscripts.

This study aims to offer an effective nanocomposite for potential use to consolidate and protect deteriorated archaeological pottery.

Three nanocomposites were used in the experimental study. This study used nano Primal AC33, silicon dioxide (SiO₂) and montmorillonite (MMT) nanoparticles to protect and consolidate pottery specimens. Pottery specimens were made at 800°C for this investigation. Consolidation materials were applied with a brush. The properties of the treated pottery specimens were assessed using several methods such as digital and scanning electron microscopes, static water contact angle, color alteration, physical properties and compressive strength.

Microscopic examination indicated the ability of the nano Primal AC33/MMT nanocomposites to cover the outer surface well and bind the inner granules. Concerning specimens with code F treated with nano Primal AC33 5%/MMT 3% nanocomposites, it achieved an increase in contact angle (120°), density (1.23 g/cm³) and compressive strength (561 kg/cm²), as well as a decrease in color change (ΔE = 2.62), water absorption (4.45%) and porosity (5.46%). The novelty of the results is due to the characteristics of nano Primal AC33 5%/MMT 3% nanocomposites used in the current study.

This study describes the significant results of the analytical methods used for evaluating consolidation materials used in this study. The findings offer useful information for the protection of archaeological pottery. The investigation indicated that nano Primal AC33 5%/MMT 3% nanocomposites gave the best results. Therefore, it is recommended to use this nanocomposite to consolidate archaeological pottery. As a result, the current work provides a promising first step in conserving archaeological pottery for future studies.

This study aims to get rid of non-degradable polyvinyl chloride (PVC) waste as well as sunflower seed cake (SSC) waste by preparing eco-friendly composites from both in different proportions to reach good mechanical and insulating properties for antimicrobial and antistatic applications.

Eco-friendly composite films based on waste polyvinylchloride (WPVC) and SSC of concentrations (0, 10, 20, 30 and 40 Wt.%) were prepared using solution casting method. Further, the effect of sunflower seed oil (SSO) on the biophysical properties of the prepared composites is also investigated. Fourier transform infrared spectroscopy, X-ray diffraction (XRD), scanning electron microscope, mechanical, thermal, dielectric properties were assessed. Besides, the antimicrobial and biodegradation tests were also studied.

The crystallinity increases by rising SSC concentration as revealed by XRD results. Additionally, the permittivity (ε′) increases by increasing SSC filler and SSO as well. A remarkable increase in dc conductivity was attained after the addition of SSO. While raw WPVC has very low bacterial activity. The composite films are found to be very effective against staphylococcus epidermidis, staphylococcus aureus bacteria and against candida albicans as well. On the other hand, the weight loss of WPVC increases by adding of SSC and SSO, as disclosed by biodegradation studies.

The study aims to reach the optimum method for safe and beneficial disposal of PVC waste as well as SSC for antistatic and antimicrobial application.

Gourd fibres (GF) are a natural biodegradable fibre material with excellent mechanical properties and high tensile strength. The use of natural fibres in composite materials has gained popularity in recent years due to their various advantages, including renewability, low cost, low density and biodegradability. Gourd fibre is one such natural fibre that has been identified as a potential reinforcement material for composites. However, it has low surface energy and hydrophobic nature, which makes it difficult to bond with matrix materials such as polyester. To overcome this problem, chemically adapted gourd fibre has been proposed as a solution. Chemical treatment is one of the most widely used methods to improve the properties of natural fibres. This research evaluates the feasibility and effectiveness of incorporating chemically adapted gourd fibre into polyester composites for industrial fabrication. The purpose of this study is to examine the application of chemically modified GF in the production of polyester composite engineering materials.

This work aims to evaluate the effectiveness of chemically adapted gourd fibre in improving the adhesion of gourd fibre with polyester resin in composite fabrication by varying the GF from 5 to 20 wt.%. The study involves the preparation of chemically treated gourd fibre through surface modification using sodium hydroxide (NaOH), permanganate (KMnO₄) and acetic acid (CH₃COOH) coupling agents. The mechanical properties of the modified fibre and composites were investigated. It was then characterized using scanning electron microscopy (SEM) and Fourier transform infrared spectroscopy (FTIR) to determine the changes in surface morphology and functional groups.

FTIR characterization showed that NaOH treatment caused cellulose depolymerization and caused a significant increase in the hydroxyl and carboxyl groups, showing improved surface functional groups; KMnO₄ treatment oxidized the fibre surface and caused the formation of surface oxide groups; and acetic acid treatment induced changes that primarily affected the ester and hydroxyl groups. SEM study showed that NaOH treatment changed the surface morphology of the gourd fibre, introduced voids and reduced hydrophilic tendencies. The tensile strength of the modified gourd fibres increased progressively as the concentration of the modification chemicals increased compared to the untreated fibres.

This work presents the designed composite with density, mechanical properties and microstructure, showing remarkable improvements in the engineering properties. An 181.5% improvement in tensile strength and a 56.63% increase in flexural strength were got over that of the unreinforced polyester. The findings from this work will contribute to the understanding of the potential of chemically adapted gourd fibre as a reinforcement material for composites and provide insights into the development of sustainable composite materials.

Bales of cotton run through the gins and textile mill instruments, stick to them and make it cumbersome for the ginning mill workers. This is so because more time and money have to be invested in cleaning these instruments. The stickiness of cotton causes health hazards to the workers, decreases the yarn quality and economic loss to the textile industry. The effect of cotton stickiness on textile ginning, various methods for cotton stickiness detection and the steps for reduction are discussed.

The different methods that are available for detecting and measuring cotton stickiness are described. The sugars that cause stickiness are either of plant origin (physiological sugars) or from the feeding insects (entomological origin). The methods for stickiness detection and reduction are discussed under physical, chemical and biological categories.

This review suggests possible ways to mitigate cotton stickiness.

One of the major issues of the textile industry is honeydew-contaminated cotton stickiness. However, there are few papers on detection methods for analyzing honeydew cotton stickiness along with the approaches to reduce stickiness. This paper summarizes different methods along with a study for detection as well as reduction of cotton stickiness.

This paper aims to present the fabrication of 6061 aluminum alloy (AA6061) using a promising laser additive manufacturing process, called the laser-foil-printing (LFP) process. The process window of AA6061 in LFP was established to optimize process parameters for the fabrication of high strength, dense and crack-free parts even though AA6061 is challenging for laser additive manufacturing processes due to hot-cracking issues.

The multilayers AA6061 parts were fabricated by LFP to characterize for cracks and porosity. Mechanical properties of the LFP-fabricated AA6061 parts were tested using Vicker’s microhardness and tensile testes. The electron backscattered diffraction (EBSD) technique was used to reveal the grain structure and preferred orientation of AA6061 parts.

The crack-free AA6061 parts with a high relative density of 99.8% were successfully fabricated using the optimal process parameters in LFP. The LFP-fabricated parts exhibited exceptional tensile strength and comparable ductility compared to AA6061 samples fabricated by conventional laser powder bed fusion (LPBF) processes. The EBSD result shows the formation of cracks was correlated with the cooling rate of the melt pool as cracks tended to develop within finer grain structures, which were formed in a shorter solidification time and higher cooling rate.

This study presents the pioneering achievement of fabricating crack-free AA6061 parts using LFP without the necessity of preheating the substrate or mixing nanoparticles into the melt pool during the laser melting. The study includes a comprehensive examination of both the mechanical properties and grain structures, with comparisons made to parts produced through the traditional LPBF method.

The purpose of this study is the development of sustainable and low-formaldehyde emission wood adhesive formulations.

Three-step urea formaldehyde (UF) resin has been in situ modified with calcium lignosulfonate (LS) and/or 1,4 butanediol diglycidyl ether (GE). The structural, chemical, thermal and morphological characterizations were carried out on resin samples. These resins have been applied for particleboard pressing, and UF, UF-LS and UF-GE were evaluated as P2 classes according to EN 312.

The results show that the improved LS- or diglycidyl ether-modified UF wood adhesives were successful in their adhesive capacity, and the formaldehyde content of the final product was obtained as low as 8 mg/100 g. This paper highlights that the presented adhesive formulations could be a potential eco-friendly and cost-effective alternative to formaldehyde-based wood adhesives for interior particleboard production.

Combination of LS and GE resulted in weaker mechanical properties and fulfilled P1 class particleboards due to temperature and duration conditions. Therefore, in situ usage of LS or GE in UF resins is highly recommended for particleboard pressing. Formaldehyde content of particleboards was determined with the perforator method according to EN 12460-5 and all of the particleboards exhibited E1 class. LS was more efficient in decreasing formaldehyde content than GE.

This study provides the application of particleboards with low formaldehyde emission.

The developed LS- and diglycidyl ether-modified UF resins made it possible to obtain boards with significantly low formaldehyde content compared with commercial resins.

The developed formaldehyde-based resin formulation made it possible to produce laboratory-scale board prototypes using LS or GE without sacrificing of press factors and panel quality.