Eco-friendly polymer composite films based on waste polyvinyl chloride/sunflower seed cake for antimicrobial and antistatic applications

Abstract

Purpose

This study aims to get rid of non-degradable polyvinyl chloride (PVC) waste as well as sunflower seed cake (SSC) waste by preparing eco-friendly composites from both in different proportions to reach good mechanical and insulating properties for antimicrobial and antistatic applications.

Design/methodology/approach

Eco-friendly composite films based on waste polyvinylchloride (WPVC) and SSC of concentrations (0, 10, 20, 30 and 40 Wt.%) were prepared using solution casting method. Further, the effect of sunflower seed oil (SSO) on the biophysical properties of the prepared composites is also investigated. Fourier transform infrared spectroscopy, X-ray diffraction (XRD), scanning electron microscope, mechanical, thermal, dielectric properties were assessed. Besides, the antimicrobial and biodegradation tests were also studied.

Findings

The crystallinity increases by rising SSC concentration as revealed by XRD results. Additionally, the permittivity (ε′) increases by increasing SSC filler and SSO as well. A remarkable increase in dc conductivity was attained after the addition of SSO. While raw WPVC has very low bacterial activity. The composite films are found to be very effective against staphylococcus epidermidis, staphylococcus aureus bacteria and against candida albicans as well. On the other hand, the weight loss of WPVC increases by adding of SSC and SSO, as disclosed by biodegradation studies.

Originality/value

The study aims to reach the optimum method for safe and beneficial disposal of PVC waste as well as SSC for antistatic and antimicrobial application.

Citation

Saied, M., Reffaee, A., Hamieda, S., Abd- El- Messieh, S.L. and Shafik, E.S. (2022), "Eco-friendly polymer composite films based on waste polyvinyl chloride/sunflower seed cake for antimicrobial and antistatic applications", Pigment & Resin Technology, Vol. ahead-of-print No. ahead-of-print. https://doi.org/10.1108/PRT-10-2021-0126