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The purpose of this paper is to design novel tunnel field effect transistor (TFET) using graphene nanoribbons (GNRs).

To design the proposed TFET, the bilayer GNRs (BLGNRs) have been used as the channel material. The BLGNR-TFET is designed in QuantumATK, depending on 2-D Poisson’s equation and non-equilibrium Green’s function (NEGF) formalism.

The performance of the proposed BLGNR-TFET is investigated in terms of current and voltage (I-V) characteristics and transconductance. Moreover, the proposed device performance is compared with the monolayer GNR-TFET (MLGNR-TFET). From the simulation results, it is investigated that the BLGNR-TFET shows high current and gain over the MLGNR-TFET.

This paper presents a new technique to design GNR-based TFET for future low power very large-scale integration (VLSI) devices.

Tunnel field effect transistors (TFETs) have significantly steeper sub-threshold slope (24–30 mv/decade), as compared with the conventional metal–oxide–semiconductor field-effect transistors (MOSFETs), which have a sub-threshold slope of 60 mv/decade at room temperature. The steep sub-threshold slope of TFETs enables a much faster switching, making TFETs a better option than MOSFETs for low-voltage VLSI applications. The purpose of this paper is to present a novel hetero-junction TFET-based Schmitt triggers, which outperform the conventional complementary metal oxide semiconductor (CMOS) Schmitt triggers at low power supply voltage levels.

The conventional Schmitt trigger has been implemented with both MOSFETs and HTFETs for operation at a low-voltage level of 0.4 V and a target hysteresis width of 100 mV. Simulation results have indicated that the HTFET-based Schmitt trigger not only has significantly lower delays but also consumes lesser power as compared to the CMOS-based Schmitt trigger. The limitations of the conventional Schmitt trigger design have been analysed, and improved CMOS and CMOS–HTFET hybrid Schmitt trigger designs have been presented.

The conventional Schmitt trigger implemented with HTFETs has 99.9% lower propagation delay (29ps) and 41.2% lesser power requirement (4.7 nW) than the analogous CMOS Schmitt trigger, which has a delay of 36 ns and consumes 8 nW of power. An improved Schmitt trigger design has been proposed which has a transistor count of only six as compared to the eight transistors required in the conventional design. The proposed improved Schmitt trigger design, when implemented with only CMOS devices enable a reduction of power delay product (PDP) by 98.4% with respect to the CMOS conventional Schmitt trigger design. The proposed CMOS–HTFET hybrid Schmitt trigger further helps in decreasing the delay of the improved CMOS-only Schmitt trigger by 70% and PDP by 21%.

The unique advantage of very steep sub-threshold slope of HTFETs has been used to improve the performance of the conventional Schmitt trigger circuit. Novel CMOS-only and CMOS–HTFET hybrid improved Schmitt trigger designs have been proposed which requires lesser number of transistors (saving 70% chip area) for implementation and has significantly lower delays and power requirement than the conventional designs.

The purpose of this paper is to present an improved model based on center potential instead of surface potential which is physically more relevant and accurate. Also, additional analytic insights have been provided to make the model independent and robust so that it can be extended to a full range compact model.

The design methodology used is center potential based analytical modeling using Psuedo-2D Poisson equation, with ingeniously developed boundary conditions, which help achieve reasonably accurate results. Also, the depletion width calculation has been suitably remodeled, to account for proper physical insights and accuracy.

The proposed model has considerable accuracy and is able to correctly predict most of the physical phenomena occurring inside the broken gate Tunnel FET structure. Also, a good match has been observed between the modeled data and the simulation results. I_on/I_ambipolar ratio of 10^(−8) has been achieved which is quintessential for low power SOCs.

The modeling approach used is different from the previously used techniques and uses indigenous boundary conditions. Also, the current model developed has been significantly altered, using very simple but intuitive technique instead of complex mathematical approach.

High packaging density in the present VLSI era builds an acute power crisis, which limits the use of MOSFET device as a constituent block in CMOS technology. This leads researchers in looking for alternative devices, which can replace the MOSFET in CMOS VLSI logic design. In a quest for alternative devices, tunnel field effect transistor emerged as a potential alternative in recent times. The purpose of this study is to enhance the performances of the proposed device structure and make it compatible with circuit implementation. Finally, the performances of that circuit are compared with CMOS circuit and a comparative study is made to find the superiority of the proposed circuit with respect to conventional CMOS circuit.

Silicon–germanium heterostructure is currently one of the most promising architectures for semiconductor devices such as tunnel field effect transistor. Analytical modeling is computed and programmed with MATLAB software. Two-dimensional device simulation is performed by using Silvaco TCAD (ATLAS). The modeled results are validated through the ATLAS simulation data. Therefore, an inverter circuit is implemented with the proposed device. The circuit is simulated with the Tanner EDA tool to evaluate its performances.

The proposed optimized device geometry delivers exceptionally low OFF current (order of 10^−18 A/um), fairly high ON current (5x10^−5 A/um) and a steep subthreshold slope (20 mV/decade) followed by excellent ON–OFF current ratio (order of 10^13) compared to the similar kind of heterostructures. With a very low threshold voltage, even lesser than 0.1 V, the proposed device emerged as a good replacement of MOSFET in CMOS-like digital circuits. Hence, the device is implemented to construct a resistive inverter to study the circuit performances. The resistive inverter circuit is compared with a resistive CMOS inverter circuit. Both the circuit performances are analyzed and compared in terms of power dissipation, propagation delay and power-delay product. The outcomes of the experiments prove that the performance matrices of heterojunction Tunnel FET (HTFET)-based inverter are way ahead of that of CMOS-based inverter.

Germanium–silicon HTFET with stack gate oxide is analytically modeled and optimized in terms of performance matrices. The device performances are appreciable in comparison with the device structures published in contemporary literature. CMOS-like resistive inverter circuit, implemented with this proposed device, performs well and outruns the circuit performances of the conventional CMOS circuit at 45-nm technological node.

This work is proposed for low power energy-efficient applications like laptops, mobile phones, and palmtops. In this study, P-channel metal–oxide–semiconductor (PMOS)’s are used as access transistor in 7 transistors (7 T) Static Random Access Memory (SRAM) cell, and the theoretical Static Noise Margin (SNM) analysis for the proposed cell is also performed. A cell is designed using 7 T which consists of 4 PMOS and 3 NMOS. In this paper write and hold SNM is addressed and read SNM is also calculated for the proposed 7 T SRAM cell.

The authors have replaced N-channel metal–oxide–semiconductor (NMOS) access transistors with the PMOS access transistors, which results in proper data line recovery and provides the desired coupling. An error is likely to occur, if the read operation is performed too often probably by using the NMOS pass gate. It results in an improper recovery of the data line. Instead, by using PMOS as a pass gate, the time required for read operation can be brought down. As we know the mobility (µ) of the PMOS transistor is low, so the authors have used this property into the proposed design. When a low signal is applied to its control gate, the PMOS transistor come up with the desired coupling, when working as a pass gate.

Feedback switched transistor is used in the proposed circuit, which plays an important role in the write operation. This transistor is in OFF state and PMOS’s work as access transistor, when the proposed cell operating in read mode. This helps in the reduction of power. This work is simulated using UMC 40 nm technology node in the cadence virtuoso environment. The simulated result shows that, write power saving of 51.54% and 61.17%, hold power saving of 25.68% and 48.93% when compared with reported 7 T and 6 T, respectively.

The proposed 7 T SRAM cell provides proper data line recovery at a lower voltage when PMOS works as the access transistor. Power consumption is very less in this technique and it is best suitable for low power applications.

The purpose of this paper is to design novel hardened flip-flop using carbon nanotube field effect transistors (CNTFETs).

To design the proposed flip-flop, the Schmitt trigger-based soft error masking and unhardened latches have been used. In the proposed design, the novel mechanism, i.e. hysteresis property is used to enhance the hardness of the single event upset.

To obtain the simulation results, all the proposed circuits are extensively simulated in Hewlett simulation program with integrated circuit emphasis software. Moreover, the results of the proposed latches are compared to the conventional latches to show performance improvements. It is noted that the proposed latch shows the performance improvements up to 25.8%, 51.2% and 17.8%, respectively, in terms of power consumption, area and power delay product compared to the conventional latches. Additionally, it is observed that the simulation result of the proposed flip-flop confirmed the correctness with its respective functions.

The novel hardened flip-flop utilizing ST based SEM latch is presented. This flip-flop is significantly improves the performance and reliability compared to the existing flip-flops.