Circuit World: Volume 30 Issue 2

Impedance modelling on multiple dielectric builds

As printed circuit board (PCB) track geometries shrink, sometimes it becomes necessary to look deeper than the material data sheet when modelling electrical properties of…

Preventing whiskers in electrodeposited tin for semiconductor lead frame applications

A new pure tin process is described which produces a deposit with a crystal orientation combination that minimises whisker growth, particularly when used with a specific…

Aqueous base compatible waveguide materials for optical interconnect applications

There are a number of organic, inorganic and hybrid inorganic waveguide materials that are currently being used for a wide variety of optical interconnect applications. Depending…

Alternative surface finishes – options and environmental considerations

Printed circuit boards (PCBs) requiring component attachment, whether leaded or surface mount technology, must have the exposed copper land areas coated with a protective finish…

Questions concerning the migration to lead‐free solder

Eliminating lead in electronics is an environmentally considerate approach that is made prior to manufacture. Recently enacted legislation encourages increased recycling of…

End‐of‐life electronics legislation – an industry perspective

Increasing awareness of man's impact on the environment and pressure to behave in a more sustainable manner are encouraging both the recycling and reuse of materials and the…

Assessing lead‐free intellectual property

This paper presents the analysis of information collected from numerous patent searches on lead‐free alloys. The significance of claim structure and content is discussed in view…

Reaching out? – an overview of the European Commission's proposed chemicals policy

The European Commission (EC) has drafted a proposal for reforming the European Union's (EU) chemicals policy. The chemical industry has welcomed the broad political objectives of…

AT&S – Total success in China

Editorial

Park Electrochemical announces a new dielectric offering for the N9000-13 RF materials

Message from the Associate Editor

HMS Höllmüller and Ormecon International – two pioneers of immersion tin surfaces enter into co-operation

Invotec wins Supplier Excellence award from BAE SYSTEMS

Nanomix and DuPont Electronic Technologies sign exclusive licensing agreement for the use of carbon nanotubes in field emission displays

Gore introduces new low loss microvia material

Invotec

Understanding Automotive Electronics

Interactive Guide to Flexible Circuit Technology produced by Teknoflex

Gore introduces new low loss microvia material

EIPC Technology seminar UK

MICROTECH 2003

IPC testifies before congress on EPA's toxic release inventory programme

Enthone awarded Patent on ENTEK® PLUS organic solderability preservative

Note from the publisher

Westwind Air Bearings, China, receives quality accolade

Contamination effects from component finishes in lead-free soldering

Polar Instruments to represent PWB Interconnect solutions PCB reliability test systems in Europe

Eternal Chemical to form strategic alliance with Nichigo-Morton

Internet commentary

Lights in the sky

Chip Scale Packaging for Modern Electronics

Bebop to the Boolean Boogie

Polar Si8000m – an enhanced field solving controlled impedance design system designed especially for single and multiple dielectric PCB substrates

Frontline announces the release of InPlan version 1.7

ICT Evening Seminar – laser direct imaging

Intellect's 20th PCIF annual conference Cheltenham, 15 October 2003

IPC professional development courses to elevate potential of entire industry

International diary