Enthone awarded Patent on ENTEK® PLUS organic solderability preservative

Circuit World

ISSN: 0305-6120

Article publication date: 1 June 2004

Keywords

Citation

(2004), "Enthone awarded Patent on ENTEK® PLUS organic solderability preservative", Circuit World, Vol. 30 No. 2. https://doi.org/10.1108/cw.2004.21730bab.004

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited


Enthone awarded Patent on ENTEK® PLUS organic solderability preservative

Enthone awarded Patent on ENTEK® PLUS organic solderability preservative

Keywords: Patents, Solder, Preservative

Enthone, Inc. has been awarded US Patent 6,524,644 for its ENTEK® PLUS CU-106A(X) organic solderability preservative (OSP). The OSP is part of the ENTEK PLUS gold copper protective coating system that is used as an alternative to hot air solder leveling and other metallic printed wiring board (PWB) final finishes. The process is specifically formulated for mixed metal finishes, such as selective nickel- gold features on PWBs.

As part of the ENTEK PLUS gold copper protective coating system, the ENTEK Precoat PC-1030 preconditioner is applied to the copper surface prior to applying the ENTEK PLUS CU-106A(X) OSP to the PCB. The final aqueous coating provides excellent solderability and withstands exposure to multiple heat cycles during SMT and mixed technology PCB assembly. The surface finish offers no-clean assembly compatibility, co- planarity and superior bond strength for flip chip applications.

PCBs with mixed metal surfaces contain designs with copper features for soldering and secondary metals such as gold (e.g. edge connectors, key contacts or wire bonding pads). The ENTEK PLUS gold system is specifically engineered to selectively deposit on copper while ensuring that the secondary metal surface remains contaminate-free. The process eliminates expensive masking and cleaning of selective metals.

"The ENTEK CU-106A(X) OSP is a significant advancement versus existing OSPs on the market today. The patented process enables our customers to meet the most demanding PWB surface finish requirements posed by PWB assemblers and OEMs. The technology will provide a pivotal foundation for Cookson Electronics to further introduce and advance OSP and other lead-free alternatives to the electronics marketplace", said Dr Joseph Abys, Enthone Vice-President and Chief Technology Officer.

Dr Abys noted, "Only through a steady investment and commitment to innovation are we able to meet the changing needs of our customers. I commend Enthone R&D manager Karl Wengenroth and everyone who contributed to obtaining this patent."