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Assessing lead‐free intellectual property

Paul Casey (CALCE Electronic Products and Systems Center, University of Maryland, College Park, Maryland, USA)
Michael Pecht (CALCE Electronic Products and Systems Center, University of Maryland, College Park, Maryland, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 June 2004

Abstract

This paper presents the analysis of information collected from numerous patent searches on lead‐free alloys. The significance of claim structure and content is discussed in view of the growing number of lead‐free patents. Patent analysis software was developed to effectively compare over 350 lead‐free alloy patents. A case study was conducted to assess Sn‐Ag‐Cu and special purpose lead‐free candidate alloy intellectual property. The results show that there are a number of patents and patent applications that may affect the use of “popular” Sn‐Ag‐Cu formulations.

Keywords

Citation

Casey, P. and Pecht, M. (2004), "Assessing lead‐free intellectual property", Circuit World, Vol. 30 No. 2, pp. 46-51. https://doi.org/10.1108/03056120410512244

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited