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Aqueous base compatible waveguide materials for optical interconnect applications

Jim Shelnut (Shipley Company L.L.C., Marlborough, Massachusetts, USA)
Matt Moynihan (Shipley Company L.L.C., Marlborough, Massachusetts, USA)
Luke Little (Shipley Company L.L.C., Marlborough, Massachusetts, USA)
Nick Pugliano (Shipley Company L.L.C., Marlborough, Massachusetts, USA)
Bruno Sicard (Shipley Company L.L.C., Marlborough, Massachusetts, USA)
Henry Zheng (Shipley Company L.L.C., Marlborough, Massachusetts, USA)
Tuan Ho (Shipley Company L.L.C., Marlborough, Massachusetts, USA)
Craig Allen (Shipley Company L.L.C., Marlborough, Massachusetts, USA)
Garo Khanarian (Rohm and Haas Company, Spring House, Pennsylvania, USA)
Nathan Pawlowski (Shipley Company L.L.C., Marlborough, Massachusetts, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 June 2004

Abstract

There are a number of organic, inorganic and hybrid inorganic waveguide materials that are currently being used for a wide variety of optical interconnect applications. Depending upon the approach, waveguide formation is performed using a combination of lithographic and/or reactive ion etch techniques. Often the processes involved with waveguide formation require unique processing conditions, hazardous process chemicals and specialized pieces of capital equipment. In addition, many of the materials have been optimized for silicon substrates but are not compatible with printed wire board (PWB) substrates and processes.

Keywords

Citation

Shelnut, J., Moynihan, M., Little, L., Pugliano, N., Sicard, B., Zheng, H., Ho, T., Allen, C., Khanarian, G. and Pawlowski, N. (2004), "Aqueous base compatible waveguide materials for optical interconnect applications", Circuit World, Vol. 30 No. 2, pp. 25-29. https://doi.org/10.1108/03056120410512145

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited