Assessing lead‐free intellectual property

Abstract

This paper presents the analysis of information collected from numerous patent searches on lead‐free alloys. The significance of claim structure and content is discussed in view of the growing number of lead‐free patents. Patent analysis software was developed to effectively compare over 350 lead‐free alloy patents. A case study was conducted to assess Sn‐Ag‐Cu and special purpose lead‐free candidate alloy intellectual property. The results show that there are a number of patents and patent applications that may affect the use of “popular” Sn‐Ag‐Cu formulations.

Citation

Casey, P. and Pecht, M. (2004), "Assessing lead‐free intellectual property", Circuit World, Vol. 30 No. 2, pp. 46-51. https://doi.org/10.1108/03056120410512244