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This study aims to investigate the influence of different solder alloy materials on passive devices during laser soldering process. Solder alloy material has been found to significantly influence the solder joint’s quality, such as void formation that can lead to cracks, filling time that affects productivity and fillet shape that determines the solder joint’s reliability.

Finite volume method (FVM)-based simulation that was validated using real laser soldering experiment is used to evaluate the effect of various solder alloy materials, including SAC305, SAC387, SAC396 and SAC405 in laser soldering. These solders are commonly used to assemble the pin-through hole (PTH) capacitor onto the printed circuit board.

The simulation results show how the void ratio, filling time and flow characteristics of different solder alloy materials affect the quality of the solder joint. The optimal solder alloy is SAC396 due to its low void ratio of 1.95%, fastest filling time (1.3 s) to fill a 98% PTH barrel and excellent flow characteristics. The results give the ideal setting for the parameters that can increase the effectiveness of the laser soldering process, which include reducing filling time from 2.2 s to less than 1.5 s while maintaining a high-quality solder joint with a void ratio of less than 2%. Industries that emphasize reliable soldering and effective joint formation gain the advantage of minimal occurrence of void formation, quick filling time and exceptional flowability offered by this solution.

This research is expected not only to improve solder joint reliability but also to drive advancements in laser soldering technology, supporting the development of efficient and reliable microelectronics assembly processes for future electronic devices. The optimized laser soldering material will enable the production of superior passive devices, meeting the growing demands of the electronics market for smaller, high-performance electronic products.

The comparison of different solder alloy materials for PTH capacitor assembly during the laser soldering process has not been reported to date. Additionally, volume of fluid numerical analysis of the quality and reliability of different solder alloy joints has never been conducted on real PTH capacitor assemblies.

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

Adoption of integrated MOS based pseudo-resistor (PR) structures instead of using off-chip passive poly resistors for analog circuits in complementary metal oxide semiconductor technology (CMOS) is an area-efficient way for realizing larger time constants. However, issue of common-mode voltage shifting and excess dependency on the process and temperature variations introduce nonlinearity in such structures. So there is dire need to not only closely look for the origin of the problem with the help of a thorough mathematical analysis but also suggest the most suitable PR structure for the purpose catering broadly to biomedical analog circuit applications.

In this work, incremental resistance (IR) expressions and IR range for balanced PR (BPR) structures operating in the subthreshold region have been closely analyzed for broader range of process-voltage-temperature variations. All the post-layout simulations have been obtained using BSIM3V3 device models in 0.18 µm standard CMOS process.

The obtained results show that the pertinent problem of common-mode voltage shifting in such PR structures is completely resolved in scaled gate linearization and bulk-driven quasi-floating gate (BDQFG) BPR structures. Among all BPR structures, BDQFG BPR remarkably shows constant IR value of 1 TΩ over −1 V to 1 V voltage swing for wider process and temperature variations.

Various balanced PR design techniques reported in this work will help the research community in implementing larger time constants for analog-mixed signal circuits.

The PR design techniques presented in the present piece of work is expected to be used in developing tunable and accurate biomedical prosthetics.

The BPR structures thoroughly analyzed and reported in this work may be useful in the design of analog circuits specifically for applications such as neural signal recording, cardiac electrical impedance tomography and other low-frequency biomedical applications.

This paper aims to present a low-cost, edge-fed, windmill-shaped, notch-band eliminator, circular monopole antenna which is practically loaded with a complementary split ring resonator (CSRR) in the middle of the radiating conductor and also uses a partial ground to obtain wide-band performance.

To compensate for the reduced value of gain and reflection coefficient because of the full (complete) ground plane at the bottom of the substrate, the antenna is further loaded with a partial ground and a CSRR. The reduction in the length of ground near the feed line improves the impedance bandwidth, and introduced CSRR results in improved gain with an additional resonance spike. This results in a peak gain 3.895dBi at the designed frequency 2.45 GHz. The extending of three arms in the circular patch not only led to an increase of peak gain by 4.044dBi but also eliminated the notch band and improved the fractional bandwidth 1.65–2.92 GHz.

The work reports a –10dB bandwidth from 1.63 GHz to 2.91 GHz, which covers traditional coverage applications and new specific uses applications such as narrow LTE bands for future internet of things (NB-IoT) machine-to-machine communications 1.8/1.9/2.1/2.3/2.5/2.6 GHz, industry, automation and business-critical cases (2.1/2.3/2.6 GHz), industrial, society and medical applications such as Wi-MAX (3.5 GHz), Wi-Fi3 (2.45 GHz), GSM (1.9 GHz), public safety band, Bluetooth (2.40–2.485 GHz), Zigbee (2.40–2.48Ghz), industrial scientific medical (ISM) band (2.4–2.5 GHz), WCDMA (1.9, 2.1 GHz), 3 G (2.1 GHz), 4 G LTE (2.1–2.5 GHz) and other personal communication services applications. The estimated RLC electrical equivalent circuit is also presented at the end.

Because of full coverage of Bluetooth, Zigbee, WiFi3 and ISM band, the proposed fabricated antenna is suitable for low power, low data rate and wireless/wired short-range IoT-enabled medical applications.

The antenna is fabricated on a piece (66.4 mm × 66.4 mm × 1.6 mm) of low-cost low profile FR-4 epoxy substrate (0.54 λ_g × 0.54 λ_g) with a dielectric constant of 4.4, a loss tangent of 0.02 and a thickness of 1.6 mm. The antenna reflection coefficient, impedance and VSWR are tested on the Keysight technology (N9917A) vector network analyzer, and the radiation pattern is measured in an anechoic chamber.

Compact and wideband antennas are the need of modern wireless systems that preferably work with compact, low-profile and easy-to-install devices that provide a wider coverage of operating frequencies. The purpose of this paper is to propose a novel compact and ultrawideband (UWB) microstrip patch antenna intended for high frequency wireless applications.

A square microstrip patch antenna was initially modeled on finite element method-based electromagnetic simulation tool high frequency structure simulator. It was then loaded with a rectangular slit and Koch snowflake-shaped fractal notches for bandwidth enhancement. The fabricated prototype was tested by using vector network analyzer from Agilent Technologies, N5247A, Santa Clara, California, United States (US).

The designed Koch fractal patch antenna is highly compact with dimensions of 10 × 10 mm only and possesses UWB characteristics with multiple resonances in the operating band. The −10 dB measured impedance bandwidth was observed to be approximately 13.65 GHz in the frequency range (23.20–36.85 GHz).

Owing to its simple and compact structure, positive and substantial gain values, high radiation efficiency and stable radiation patterns throughout the frequency band of interest, the proposed antenna is a suitable candidate for high frequency wireless applications in the K (18–27 GHz) and Ka (26.5–40 GHz) microwave bands.

This paper aims to present the design development and measurement of two aerodynamic slotted X-bands back-to-back planer substrate-integrated rectangular waveguide (SIRWG/SIW) to Microstrip (MS) line transition for satellite and RADAR applications. It facilitates the realization of nonplanar (waveguide-based) circuits into planar form for easy integration with other planar (microstrip) devices, circuits and systems. This paper describes the design of a SIW to microstrip transition. The transition is broadband covering the frequency range of 8–12 GHz. The design and interconnection of microwave components like filters, power dividers, resonators, satellite dishes, sensors, transmitters and transponders are further aided by these transitions. A common planar interconnect is designed with better reflection coefficient/return loss (RL) (S₁₁/S₂₂ ≤ 10 dB), transmission coefficient/insertion loss (IL) (S₁₂/S₂₁: 0–3.0 dB) and ultra-wideband bandwidth on low profile FR-4 substrate for X-band and Ku-band functioning to interconnect modern era MIC/MMIC circuits, components and devices.

Two series of metal via (6 via/row) have been used so that all surface current and electric field vectors are confined within the metallic via-wall in SIW length. Introduced aerodynamic slots in tapered portions achieve excellent impedance matching and tapered junctions with SIW are mitered for fine tuning to achieve minimum reflections and improved transmissions at X-band center frequency.

Using this method, the measured IL and RLs are found in concord with simulated results in full X-band (8.22–12.4 GHz). RLC T-equivalent and p-equivalent electrical circuits of the proposed design are presented at the end.

The measurement of the prototype has been carried out by an available low-cost X-band microwave bench and with a Keysight E4416A power meter in the microwave laboratory.

The transition is fabricated on FR-4 substrate with compact size 14 mm × 21.35 mm × 1.6 mm and hence economical with IL lie within limits 0.6–1 dB and RL is lower than −10 dB in bandwidth 7.05–17.10 GHz. Because of such outstanding fractional bandwidth (FBW: 100.5%), the transition could also be useful for Ku-band with IL close to 1.6 dB.

This paper aims to propose a single element, dual feed, polarisation diversity antenna. The proposed antenna operates from 2.9 to 10.6 GHz for covering the entire ultra-wideband (UWB) frequency range. The antenna is designed for usage in massive multiple input multiple output (MIMO) and closed packaging applications.

The size of the antenna is 24 × 24 × 1.6 mm³. The radiating element of the antenna is derived from the Sierpinski–Knopp (SK) fractal geometry for miniaturization of the antenna size. The antenna has a single reflecting stub placed between the two orthogonal feeds, to improve isolation.

The proposed antenna system exhibits S₁₁ < −10 dB, S₂₁ < −15 dB and stable radiation characteristics in the entire operating region. It also offers an envelope correlation coefficient < 0.01, a diversity gain > 9.9 dB and a capacity loss < 0.4 bps/Hz. The simulated and measured outputs were compared and results were found to be in similarity.

The proposed UWB-MIMO antenna has significant size reduction through usage of SK fractal geometry for radiating element. The antenna uses a single radiating element with dual feed. The stub is between the antenna elements which provide a compact and miniaturized MIMO solution for high density packaging applications. The UWB-MIMO antenna provides an isolation better than −20 dB in the entire UWB operating band.

This paper aims to propose a two-element dual fed ultra-wideband (UWB) multiple input multiple output (MIMO) antenna system with no additional decoupling structures. The antenna operates from 3.1 to 10.6 GHz. The antenna finds its usage in on-body wearable device applications.

The antenna system measures 63.80 × 29.80 × 0.7 mm. The antenna radiating element is designed by using a modified dumbbell-shaped structure. Jean cloth material is used as substrate. The isolation improvement is achieved through spacing between two elements.

The proposed antenna has a very low mutual coupling of S₂₁ < −20 dB and impedance matching of S₁₁ < −10 dB. The radiation characteristics are stable in the antenna operating region. It provides as ECC < 0.01, diversity gain >9.9 dB. The antenna offers low average specific absorption rate (SAR) of 0.169 W/kg. The simulated and measured results are found to be in reasonable match.

The MIMO antenna is proposed for on-body communication, hence, a very thin jean cloth material is used as substrate. This negates the necessity of additional material usage in antenna design and the result range indicates good diversity performance and with a low SAR of 0.169 W/kg for on-body performance. This makes it a suitable candidate for textile antenna application.

This paper aims to concentrate on recent innovations in flexible wearable sensor technology tailored for monitoring vital signals within the contexts of wearable sensors and systems developed specifically for monitoring health and fitness metrics.

In recent decades, wearable sensors for monitoring vital signals in sports and health have advanced greatly. Vital signals include electrocardiogram, electroencephalogram, electromyography, inertial data, body motions, cardiac rate and bodily fluids like blood and sweating, making them a good choice for sensing devices.

This report reviewed reputable journal articles on wearable sensors for vital signal monitoring, focusing on multimode and integrated multi-dimensional capabilities like structure, accuracy and nature of the devices, which may offer a more versatile and comprehensive solution.

The paper provides essential information on the present obstacles and challenges in this domain and provide a glimpse into the future directions of wearable sensors for the detection of these crucial signals. Importantly, it is evident that the integration of modern fabricating techniques, stretchable electronic devices, the Internet of Things and the application of artificial intelligence algorithms has significantly improved the capacity to efficiently monitor and leverage these signals for human health monitoring, including disease prediction.

Nanotechnology (NT) advancements in personal protective textiles (PPT) or personal protective equipment (PPE) have alleviated spread and transmission of this highly contagious viral disease, and enabled enhancement of PPE, thereby fortifying antiviral behavior.

Review of a series of state of the art research papers on the subject matter.

This paper expounds on novel nanotechnological advancements in polymeric textile composites, emerging applications and fight against COVID-19 pandemic.

As a panacea to “public droplet prevention,” textiles have proven to be potentially effective as environmental droplet barriers (EDBs).

PPT in form of healthcare materials including surgical face masks (SFMs), gloves, goggles, respirators, gowns, uniforms, scrub-suits and other apparels play critical role in hindering the spreading of COVID-19 and other “oral-respiratory droplet contamination” both within and outside hospitals.

When used as double-layers, textiles display effectiveness as SFMs or surgical-fabrics, which reduces droplet transmission to <10 cm, within circumference of ∼0.3%.

NT advancements in textiles through nanoparticles, and sensor integration within textile materials have enhanced versatile sensory capabilities, robotics, flame retardancy, self-cleaning, electrical conductivity, flexibility and comfort, thereby availing it for health, medical, sporting, advanced engineering, pharmaceuticals, aerospace, military, automobile, food and agricultural applications, and more. Therefore, this paper expounds on recently emerging trends in nanotechnological influence in textiles for engineering and fight against COVID-19 pandemic.