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This study aims to investigate the fatigue crack propagation behavior of SiC particle-reinforced 2124 Al alloy composites under constant amplitude axial loading at a stress ratio of R = 0.1. For this purpose, it is performed experiments and comparatively analyze the results by producing 5, 10, 15 Vol.% SiCp-reinforced composites and unreinforced 2124 Al alloy billets with powder metallurgy (PM) production technique.

With the PM production technique, SiCp-reinforced composite and unreinforced 2124 Al alloy billets were produced at 5%, 10%, 15% volume ratios. After the produced billets were extruded and 5 mm thick plates were formed, tensile and fatigue crack propagation compact tensile (CT) samples were prepared. Optical microscope examinations were carried out to determine the microstructural properties of billet and samples. To determine the SiC particle–matrix interactions due to the composite microstructure, unlike the Al alloy, which affects the crack initiation life and crack propagation rate, detailed scanning electron microscopy (SEM) studies have been carried out.

Optical microscope examinations for the determination of the microstructural properties of billet and samples showed that although SiC particles were rarely clustered in the Al alloy matrix, they were generally homogeneously dispersed. Fatigue crack propagation rates were determined experimentally. While the highest crack initiation resistance was achieved at 5% SiC volume ratio, the slowest crack propagation rate in the stable crack propagation region was found in the unreinforced 2124 Al alloy. At volume ratios greater than 5%, the number of crack initiation cycles decreases and the propagation rate increases.

As a requirement of damage tolerance design, the fatigue crack propagation rate and fatigue behavior of materials to be used in high-tech vehicles such as aircraft structural parts should be well characterized. Therefore, safer use of these materials in critical structural parts becomes widespread. In this study, besides measuring fatigue crack propagation rates, the mechanisms causing crack acceleration or deceleration were determined by applying detailed SEM examinations.

This paper aims to study the interfacial delamination found in the boundary of the copper/copper-epoxy layers of a multi-layer ceramic capacitor.

The thermal reflow process of the capacitor assembly and the crack propagation from the initial micro voids presented in the boundary, and later manifested into delamination, were numerically simulated. Besides, the cross section of the capacitor assembly was inspected for delamination cracks and voids using a scanning electronic microscope.

Interfacial delamination in the boundary of copper/copper-epoxy layers was caused by the thermal mismatch and growth of micro voids during the thermal reflow process. The maximum deformation on the capacitor during reflow was 2.370 µm. It was found that a larger void would induce higher vicinity stress, mode I stress intensity factor, and crack elongation rate. Moreover, the crack extension increased with the exerted deformation until 0.3 µm, before saturating at the peak crack extension of around 0.078 µm.

The root cause of interfacial delamination issues in capacitors due to thermal reflow has been identified, and viable solutions proposed. These can eliminate the additional manufacturing cost and lead time incurred in identifying and tackling the issues; as well as benefit end-users, by promoting the electronic device reliability and performance.

To the best of the authors’ knowledge, the mechanism of delamination occurrence in a capacitor during has not been reported to date. The parametric variation analysis of the void size and deformation on the crack growth has never been conducted.

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Specimens of the capacitor assembly were subjected to JEDEC level 1 preconditioning (85 °C/85%RH/168 h) with 5× reflow at 270°C peak temperature. Then, they were inspected using a 2 µm scanning electron microscope to investigate the evidence of defects. The reliability test was also numerically simulated and analyzed using the extended finite element method implemented in ABAQUS.

Excellent agreements were observed between the SEM inspections and the simulation results. The findings showed evidence of discontinuities along the Cu and the Cu-epoxy layers and interfacial delamination crack at the Cu/Cu-epoxy interface. The possible root causes are thermal mismatch between the Cu and Cu-epoxy layers, moisture contamination and weak Cu/Cu-epoxy interface. The maximum crack length observed in the experimentally reflowed capacitor was measured as 75 µm, a 2.59% difference compared to the numerical prediction of 77.2 µm.

This work's contribution is expected to reduce the additional manufacturing cost and lead time in investigating reliability issues in MLCCs.

Despite the significant number of works on the reliability assessment of surface mount capacitors, work on crack growth in soft-termination MLCC is limited. Also, the combined experimental and numerical investigation of reflow-induced reliability issues in soft-termination MLCC is limited. These cited gaps are the novelties of this study.

This paper comprehensively addresses the influence of chopped strand mat glass fiber-reinforced polymer (GFRP) patch configurations such as geometry, dimensions, position and the number of layers of patches, whether a single or double patch is used and how well debonding the area under the patch improves the strength of the cracked aluminum plates with different crack lengths.

Single-edge cracked aluminum specimens of 150 mm in length and 50 mm in width were tested using the tensile test. The cracked aluminum specimens were then repaired using GFRP patches with various configurations. A three-dimensional (3D) finite element method (FEM) was adopted to simulate the repaired cracked aluminum plates using composite patches to obtain the stress intensity factor (SIF). The numerical modeling and validation of ABAQUS software and the contour integral method for SIF calculations provide a valuable tool for further investigation and design optimization.

The width of the GFRP patches affected the efficiency of the rehabilitated cracked aluminum plate. Increasing patch width WP from 5 mm to 15 mm increases the peak load by 9.7 and 17.5%, respectively, if compared with the specimen without the patch. The efficiency of the GFRP patch in reducing the SIF increased as the number of layers increased, i.e. the maximum load was enhanced by 5%.

This study assessed repairing metallic structures using the chopped strand mat GFRP. Furthermore, it demonstrated the superiority of rectangular patches over semicircular ones, along with the benefit of using double patches for out-of-plane bending prevention and it emphasizes the detrimental effect of defects in the bonding area between the patch and the cracked component. This underlines the importance of proper surface preparation and bonding techniques for successful repair.

Automation of detecting cracked surfaces on buildings or in any industrially manufactured products is emerging nowadays. Detection of the cracked surface is a challenging task for inspectors. Image-based automatic inspection of cracks can be very effective when compared to human eye inspection. With the advancement in deep learning techniques, by utilizing these methods the authors can create automation of work in a particular sector of various industries.

In this study, an upgraded convolutional neural network-based crack detection method has been proposed. The dataset consists of 3,886 images which include cracked and non-cracked images. Further, these data have been split into training and validation data. To inspect the cracks more accurately, data augmentation was performed on the dataset, and regularization techniques have been utilized to reduce the overfitting problems. In this work, VGG19, Xception and Inception V3, along with Resnet50 V2 CNN architectures to train the data.

A comparison between the trained models has been performed and from the obtained results, Xception performs better than other algorithms with 99.54% test accuracy. The results show detecting cracked regions and firm non-cracked regions is very efficient by the Xception algorithm.

The proposed method can be way better back to an automatic inspection of cracks in buildings with different design patterns such as decorated historical monuments.

The long-span continuous rigid-frame bridges are commonly constructed by the section-by-section symmetrical balance suspension casting method. The deflection of these bridges is increasing over time. Wet joints are a typical construction feature of continuous rigid-frame bridges and will affect their integrity. To investigate the sensitivity of shear surface quality on the mechanical properties of long-span prestressed continuous rigid-frame bridges, a large serviced bridge is selected for analysis.

Its shear surface is examined and classified using the damage measuring method, and four levels are determined statistically based on the core sample integrity, cracking length and cracking depth. Based on the shear-friction theory of the shear surface, a 3D solid element-based finite element model of the selected bridge is established, taking into account factors such as damage location, damage number and damage of the shear surface. The simulated results on the stress distribution of the local segment, the shear surface opening and the beam deflection are extracted and analyzed.

The findings indicate that the main factors affecting the ultimate shear stress and shear strength of the shear surface are size, shear reinforcements, normal stress and friction performance of the shear surface. The connection strength of a single or a few shear surfaces decreases but with little effect on the local stress. Cracking and opening mainly occur at the 1/4 span. Compared with the rigid “Tie” connection, the mid-span deflection of the main span increases by 25.03% and the relative deflection of the section near the shear surface increases by 99.89%. However, when there are penetrating cracks and openings in the shear surface at the 1/2 span, compared with the 1/4 span position, the mid-span deflection of the main span and the relative deflection of the cross-section increase by 4.50%. The deflection of the main span increases with the failure of the shear surface.

These conclusions can guide the analysis of deflection development in long-span prestressed continuous rigid-frame bridges.

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

Theoretical investigations have been performed on slowly propagating cracks in T‐junctions and cross bars using computer procedures developed to analyse the amount and direction of crack growth using automatic mesh modification and the finite element stress analysis program, BERSAFE. The procedures may be used in a linear or non‐linear material. The crack growth for the linear elastic case is calculated to be in the direction of the maximum energy release rate. For the non‐linear case, the direction is taken to be that of Jwi. These procedures have been applied to fatigue crack growth calculations in this paper.

Zirconia ceramics exhibit high strength and fracture toughness. The purpose of this paper is to research a possibility of crack healing in zirconia ceramics.

ZrO₂/SiC composite ceramics are sintered and subjected to three‐point bending. A surface crack of 100 μm in diameter is formed on each specimen. The cracks are healed and the specimens are tested under bending.

The paper finds that ZrO₂/SiC composite ceramic material had a high crack‐healing ability at a considerably low temperature. For example, a crack of 100 μm in diameter is healed even at 600°C.

The paper provides a low temperature healing and a new mechanism of crack healing.

The paper shows the healing temperature and the minimum time required to heal showed a good proportional relation on the Arrhenius plot at temperatures of 600‐800°C. Moreover, the crack healing is caused by SiO₂ cristobalite produced during the healing.

Since the most of structures and structural components suffers from cyclic loadings, the study on the fatigue failure due to the crack growth has a great importance. The purpose of this paper is to present a three-dimensional fatigue crack growth simulation of embedded cracks using s-version finite element method (SFEM). Using the numerical results, the validity of the fitness-for-service (FFS) code evaluation method is verified.

In this paper, three-dimensional fatigue crack propagation analysis of embedded cracks is performed using the SFEM. SFEM is a numerical analysis method in which the shape of the structure is represented by a global mesh, and cracks are modeled by local meshes independently. The independent global and local meshes are superimposed to obtain the displacement solution of the problem simultaneously.

The fatigue crack growth of arbitrary shape of cracks is slow compared to that of the simplified circular crack and the crack approximated based on the FFS code of the Japan Society of Mechanical Engineers (JSME). The results tell us that the FFS code of JSME can provide a conservative evaluation of the fatigue crack growth and the residual life time.

This paper presents a three-dimensional fatigue crack growth simulation of embedded cracks using SFEM. Using this method, it is possible to apply mixed mode loads to complex shaped cracks that are closer to realistic conditions.