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The purpose of this study is to develop a testing method for tin pest in tin – copper (SnCu) alloys. Tin pest is the allotropic transformation of white β-tin (body-centered tetragonal structure) into gray α-tin (diamond cubic structure) at temperatures < 13.2°C.

Bulk samples of Sn99Cu1 weight per cent (purity, 99.9 weight per cent) were cast in the form of roller-shaped ingots with a diameter of 1.0 cm and a height of 0.7 cm. The samples were then divided into four groups. The first group included samples artificially inoculated with α-tin powder. The second group was inoculated in the same way as the samples from the first group but additionally subjected to mechanical pressing. The third group of ingots was only subjected to mechanical pressing. The fourth group of samples consisted of as-received roller-shaped ingots.All samples were divided into two groups and kept either at −18°C or at −30°C for the low-temperature storage test. For tin pest identification, a visual inspection was made, using a Hirox digital microscope over 156 days at intervals not longer than 14 days. The plot of the transformation rate, presented as the average increase in the area of α-tin warts in time, was also determined. To demonstrate the differences between regions of β- and α-tin, scanning ion microscopy observations using the focused ion beam technique was performed.

The first symptoms of tin pest were observed for the inoculated, mechanically pressed samples stored at −18°C, as well as those at −30°C, after less than 14 days. In the first stage of transformation, the rate was higher at −30°C for some time but, after about 75 days of storage at sub-zero temperatures, the rate at −30°C became lower compared to the rate at −18°C. Inoculation via the application of substances which are structurally similar to α-tin was efficient for the proposed new approach of rapid testing only when applied with simultaneous mechanical pressing. Infection from pressed-in seeds, leading to conventional seeded growth, was more rapid than infection in contact with seeds (without mechanical pressing), where the transition mechanism was induced by the epitaxial growth of metastable ice.

The new rapid method for the diagnostic testing of the susceptibility of different SnCu alloys to tin pest in a period much shorter than 14 days (within single days for storage at −30°C) is proposed and described. The test procedure described in this paper produced results several times quicker than conventional procedures, which may take years. In effect, the behavior of tin alloys in the face of tin pest may be predicted much more easily and much earlier. The same procedure can be applied to other SnCu alloys used in electronics (and in other areas), if the test samples are prepared in a similar manner.

The purpose of this paper is to investigate tin pest formation in lead‐free alloys.

Samples of Sn99.5Ag3.0Cu0.5, Sn99Cu1 and Sn98Cu2 alloys were prepared in four different forms. The first group was prepared using traditional PCB technology and a hand soldering method. The next group of samples was composed of as‐received ingots of these alloys. To check the impact of mechanical treatment on the transformation process, additional cold‐worked and cold‐rolled samples were prepared (30 kN). All samples were placed initially either at −18°C or at −65°C for low temperature storage testing. Visual observations, scanning electron microscopy observations and X‐ray diffraction analysis were performed to identify the transformation process. Additional samples were prepared using a force of 75 kN and placed in a chamber at a temperature of −30°C for long‐term testing.

The detectable symptoms of tin pest in samples subjected to mechanical processing with 1 and 2 wt.% of Cu addition stored at −18°C were observed at the edges of the samples after 17 months of storage. Further aging at −18°C showed the progress of α/β transformation with time under low‐temperature stress, but only in these specimens. With the application of greater force to the pressing process (75 kN instead of 30 kN) and at a temperature of storage close to the maximal transformation rate (−30°C), there was a significant acceleration of the α/β transformation, and this dependence can be used in predicting the risk of tin pest occurrence in various lead‐free alloys.

The paper shows that the degree of mechanical processing had a great influence on the α/β transformation rate. Based on these observations, it is proposed that such mechanically processed samples can be used for accelerated testing of tin‐rich lead‐free alloys at low temperatures. Such tests would be appropriate for a practical estimation of the tin pest risk when the design life of some electronic equipment ranges from 15 to 25 years.

The role of intermetallics in soldered joints is ambivalent. They are an essential part of joints to common basis materials and at low levels they have a strengthening effect on solder alloys. At higher levels, however, it is well known that they can cause joint embrittlement. In this paper three aspects of their role have been studied: the microstructure of intermetallic containing solder alloys, the effects of soldering parameters on the quantity of intermetallic formed and, finally, the rates of growth of intermetallic compounds in the solid state. The results suggest that alloys which are pre‐doped with copper tend to form slightly more interfacial intermetallic during soldering than those which are not. In the solid state the rates of growth appear to be a function of the melting point of the alloy, with the higher melting point lead‐free alloys exhibiting lower rates than lower melting point alloys such as 63Sn37Pb (183∞C) or 42Sn58Bi (138∞C).

The purpose of this paper is to present the results from work on a project aimed at evaluating six different copper alloy substrates coated with pure tin for tin whisker growth. The influence of intermetallic growth between the copper alloy substrate and the tin‐plating on the growth of tin whiskers has been investigated.

The experiment consisted of six substrates of different alloys of copper, plated with bright tin including copper beryllium, cartridge brass, phosphor bronze, Cu‐Ni‐Si “7025” and Cu‐Ni‐Sn “spinodal”. The samples were mechanically stressed and then subjected to temperature humidity storage conditions for 1,000 h. These samples were then evaluated for tin whisker growth and intermetallic layer thickness.

Of the six samples five showed tin whisker growth. For these samples the intermetallic layer thickness has little effect on tin whisker growth. Sample with Cu‐Ni‐Sn “spinodal” alloy substrate showed very low whisker density and comparatively lower maximum whisker length than the other tested substrate material.

More samples per condition should be evaluated to bolster the conclusions. For the sample without tin whisker growth, holes on the surface of the plating were observed. The holes in the plating provide an opportunity for stress relaxation after the plating process. Since stress in the plating layer is low, tin whiskers are not formed on the sample surface.

The paper details the tin whisker growth on six tin plated copper substrate samples. The intermetallic layer thickness for each copper alloy substrate is calculated. The relationship between the intermetallic layer thickness and tin whisker growth for the six substrates are discussed.

Tin addition to Cu‐7% Al in presence of 1% Fe and 1% Mn increases the corrosion resistance in HCl, H2SO4, NaCl and Sea Water. Tin addition in the absence of Fe and Mn causes embrittlement of the Cu‐7% Al alloy. However, in presence of Fe and Mn the alloy shows outstanding mechanical properties. Tin addition retards the anodic dissolution of oxide film and retards dealuminification. The corrosion resistance of the alloy could be increased by various heat treatments. Quenching from 650°C appears to be the most effective treatment. A high proportion of alpha phase and a greater dispersion of beta improves the corrosion resistance. The alloy developed could be used with advantage in heat exchange equipment and in various other marine applications.

The aim of this paper is to present a review of the tin whisker growth phenomena. The study focuses mainly on whisker growth in a corrosive climate when the main inducing factor of the whisker growth is oxidation. The tin whisker phenomenon is still a big challenge in lead-free reflow soldering technology. Modern lead-free alloys and surface finishes with high tin content are considered to be possible sources of whisker development, also the evolution of electronic devices towards further complexity and miniaturization points to an escalation of the reliability risks.

The present work was based on a worldwide literature review of the substantial previous works in the past decade, as well as on the results and experience of the authors in this field.

The effect of corrosion on tin whisker growth has been under-represented in reports of mainstream research; however, in the past five years, significant results were obtained in the field which raised the corrosion phenomena from being a side effect category into one of the main inducing factors. This paper summarizes the most important findings of this field.

This literature review provides engineers and researchers with a better understanding of the role of corrosion in tin whisker growth and the current challenges in tin whisker mitigation.

The unique challenges and future research directions about the tin whisker phenomenon were shown to highlight rarely discussed risks and problems in lead-free soldering reliability.

This is the first of two papers reporting work carried out under a programme sponsored by the Department of Trade and Industry (DTI), involving collaboration between the International Tin Research Institute, GEC‐Marconi Ltd, BNR (Europe) Ltd and Multicore Solders Ltd. Part 1 describes the methodology used to select a number of candidate alloys as possible suitable lead‐free alternatives to tin‐lead solder.

The purpose of this article is to establish why the wetting on PCBs with SnCu (HASL) and Snimm finishes in the presence of a flux is better than the wetting of those on a copper substrate. The practical aspect of the obtained results is the main goal of these investigations.

The authors applied the wetting balance method for the wetting measurements at 230 and 250°C, in nitrogen atmosphere, in the presence of the ORM0 type flux. The PCBs with the SnCu (HASL) and Snimm finishes were investigated in the state “as received”. To establish the wetting properties of the SnCu (HASL) and Snimm finishes on the PCBs, wetted by the investigated SnZnBiIn alloys, the SEM and EDX analyses were performed.

The authors obtained very good wetting results of the PCBs with the SnCu and Snimm finishes, wetted by the SnZn7Bi3In4 alloys. By applying the SEM and EDX methods, it was possible to establish that the barrier layer which was created during the HASL process between the copper and the SnCu solder is efficient enough to protect the copper against the influence of the Zn atoms from the SnZn7Bi3In4 solder. This is the reason for an improvement of the wetting properties. An immersion tin finish does not create such barrier layer with the copper. It results in a worse wetting than for the SnCu finishes but a better one than that for the copper. Immersion tin dissolves in the alloys during the soldering and this process delays the reaction between the copper and the Zn atoms from the SnZn7Bi3In4 solder.

It is suggested that further studies are necessary for the confirmation of the practical application, but they should be limited to the reliability of the solder joint performance.

The best wetting results of the PCBs with “tin finishes”, especially with SnCu, wetted by the SnZn7Bi3In4 alloy, at 230 and 250°C and in nitrogen atmosphere, suggest a possibility of a practical usage of the tin‐zinc‐bismuth‐indium alloys for soldering in electronics.

The wetting balance method combined with the SEM and EDX analyses were used as the quickest way to determine the mechanism of the better wettability properties in the case of the PCBs with the SnCu and Snimm finishes, wetted by the SnZn7Bi3In4 alloy, compared to those of the PCBs on the Cu substrate.

Results for reflow soldering are presented from a three‐year EC funded project “IDEALS” to develop lead‐free soldering solutions. On the basis of fundamental data from the literature, a shortlist of candidate lead‐free solders was selected, and results from tests on physical and soldering characteristics, and wetting balance testing, led to the choice of SnAg3.8Cu0.7, melting at 217°C. Implications for solder paste medium development are discussed. Differences in alloy density, melting point, and surface tension relative to conventional solders were found to give higher levels of internal voids, reduced spread on copper, and rougher, duller joints. Reflow process window studies showed that sound reliable joints could be obtained with a peak temperature as low as 225°C. Reliability was tested on soldered test boards using thermal shock cycling, power cycling, and vibration. Overall the SnAg3.8Cu0.7 gave results approximately equivalent to conventional solders, and different board finishes had no significant effect. The effects of Sb and Bi were also evaluated. No justification was found for minor additions of Sb, but 2‐5 per cent Bi was found to allow a reduction of the peak reflow temperature, though at the cost of reduced reliability if any Pb was present.

To review the literatures, and to consider the latest results regarding the formation of tin pest in lead‐free solders and interconnections.

Previous work, over almost a century, on tin pest formation in tin and its alloy has been critically analysed. Samples of the new generation of lead‐free solders, which have experienced long term storage at −18 and −40°C, have been examined.

Tin pest has been observed in bulk samples of tin −0.5 (wt%) copper solder after exposure at −18°C although not at −40°C. Other lead‐free alloys (Sn‐3.5Ag, Sn‐3.8Cu‐0.7Cu and Sn‐Zn‐Bi) have been immune to date. Large‐scale model joints exhibit tin pest but actual joints may be resistant due to the limited free solder surface available and the constraint of intermetallic compounds and components.

The possibility of tin pest formation in joints remains. It seems that impurities are essential protection against it, but for long term applications there is no certainty that tin pest and joint deterioration will never occur.

The paper considers the various factors that may affect tin pest formation and demonstrates its existence in one of the more popular new lead‐free alloys.