Alternative Solders for Electronics Assemblies: Part 1: Materials Selection

Abstract

This is the first of two papers reporting work carried out under a programme sponsored by the Department of Trade and Industry (DTI), involving collaboration between the International Tin Research Institute, GEC‐Marconi Ltd, BNR (Europe) Ltd and Multicore Solders Ltd. Part 1 describes the methodology used to select a number of candidate alloys as possible suitable lead‐free alternatives to tin‐lead solder.

Citation

Harris, P.G. and Whitmore, M.A. (1993), "Alternative Solders for Electronics Assemblies: Part 1: Materials Selection", Circuit World, Vol. 19 No. 2, pp. 25-27. https://doi.org/10.1108/eb046199