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The aim of this paper is to present a review of the tin whisker growth phenomena. The study focuses mainly on whisker growth in a corrosive climate when the main inducing factor of the whisker growth is oxidation. The tin whisker phenomenon is still a big challenge in lead-free reflow soldering technology. Modern lead-free alloys and surface finishes with high tin content are considered to be possible sources of whisker development, also the evolution of electronic devices towards further complexity and miniaturization points to an escalation of the reliability risks.

The present work was based on a worldwide literature review of the substantial previous works in the past decade, as well as on the results and experience of the authors in this field.

The effect of corrosion on tin whisker growth has been under-represented in reports of mainstream research; however, in the past five years, significant results were obtained in the field which raised the corrosion phenomena from being a side effect category into one of the main inducing factors. This paper summarizes the most important findings of this field.

This literature review provides engineers and researchers with a better understanding of the role of corrosion in tin whisker growth and the current challenges in tin whisker mitigation.

The unique challenges and future research directions about the tin whisker phenomenon were shown to highlight rarely discussed risks and problems in lead-free soldering reliability.

An overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot‐dipped, plated, and plated‐and‐fused 100Sn and Sn‐Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all‐around best options in terms of solderability protection and wire bondability. Nickel/Pd finishes offer a slightly reduced level of performance in these areas which is most likely due to variable Pd surface conditions. It is necessary to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that include thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non‐Pb bearing solders are discussed.

The paper provides a brief survey of the various aspects of soft soldering, in as far as they are relevant to the manufacture of soldered printed boards. The intention is that only a few lines will be devoted to each subject. It is mainly intended for those who only indirectly enter into contact with soldering, and who want a quick introduction to this field. Next, it may be of interest to those who occupy themselves in depth with soldering, because most aspects come under discussion, if only briefly. Soldering experts are not likely to find anything new, but they may still appreciate the overall survey provided here.

A new high performance immersion tin incorporating a co‐deposited organic provides a highly solderable PWB surface finish. The process is described and includes solderability data after accelerated aging and extended processing. Studies of SIR, metallic dendritic growth and ionic contamination are included. A final section shows the benefits for fine pitch assembly, including the yield improvements seen at reflow, ICT and final inspection. The reliability questions are answered and conclude that the flat solderable tin process provides a cost‐effective and yield‐enhancing planar alternative to Nickel‐Gold, HASL and OSPs.

To present a methodology, including the algorithms, to quantify the risk of failure from tin whiskers and to present a dynamic risk trend based on the distribution of each of the whisker growth parameters, generated from experiments over a period of time. This paper also aims to demonstrate the practical application of the methodology developed.

This paper has been written to provide a methodology to assess tin whisker risk due to fixed whiskers in electronic products. The risk assessment process has been detailed in the paper. To demonstrate the usefulness of the methodology, a tin whisker risk assessment was conducted for a printed circuit board (PCB) in operation.

Based on the experimental tin whisker growth data it is observed that growth rates of mean length and average density decrease with time. Based on the risk assessment, it was estimated that for the common matte tin over copper finish, the failure risk for the circuit card assembly was 4 per cent over 20 years. It was recommended that, for this product, components with bright tin lead finish should not be used. It was also found that the effectiveness of the conformal coating on this PCB is limited by the relative risk of the components on the board.

The paper provides a new methodology to assess fixed tin whisker risk in electronic products. The methodology provides a dynamic risk trend with time because the algorithm incorporates distributional data of whisker growth and the distributional data as a function of time. This type of assessment was lacking in the previous studies.

A novel tin electrodeposition chemistry and process has been developed at Bell Laboratories, Lucent Technologies, New Jersey, USA. This process produces smooth, satin bright tin deposits which have stable, large grain structures. The deposits contain very low organic content and, as a consequence, exhibit excellent ductility, solderability and reflowability. The chemistry is capable of operating at elevated temperatures over a wide range of current densities, and is, thus, applicable to rack, barrel and reel‐to‐reel operations. All chemical components, including breakdown products are fully analyzable with conventional analytical methods. Extensive bath life studies show that the deposit appearance and material properties, including grain structures, are stable in relation to the age of the electroplating chemistry. In addition, the grain refiners used are highly stable, and have few breakdown products as the chemistry ages. All these features imply a robust process which has been confirmed in various manufacturing environments. This tin electroplating process has been utilized in plating coatings for connectors, solder bumps, PWBs and components for semiconductor applications.

Nickel, as a barrier to the dissolution of termination materials, requires a solderable coating to prevent nickel oxidation and preserve solderability of surface mount devices. Most multilayer capacitors (MLCs) are supplied with tin or tin/lead coatings electrodeposited over the nickel barrier layer. There is general disagreement in the electronics industry about preferred solderable finishes and solderability test methods of component leads. Tin and tin/lead finishes have typically been compared on leaded devices. The results of these studies are not necessarily applicable to leadless surface mount chip components. This study compares 100% tin and 60/40 tin/lead electroplated coatings on nickel barrier terminated, multilayer chip capacitors (MLCs). Various thicknesses of tin and tin/lead were compared for solderability after steam‐age, solder joint strength, and chemical and physical composition of the reflowed termination surface. The results show no significant difference between the solderability and joint strength under vapour phase reflow conditions using 60/40 solder paste. The termination surfaces were reflowed at 215°C in the case of both pure tin and 60/40 tin/lead. The tin/lead finish reflowed to a composition of 60% tin/40% lead. The 100% tin finish reflowed to a composition of 90% tin/10% lead. Reflow was caused by diffusion of lead and tin.

This paper aims to present the results of a 32-year-old laboratory study of whisker growth from tin electrodeposits that was originally undertaken to gain an increased understanding of the phenomenon of tin whisker growth.

Whisker growth was evaluated using electroplated C-rings (both stressed and un-stressed) that were stored throughout in a desiccator at room temperature. Analysis has recently been undertaken to evaluate whisker growth and intermetallic growth after 32 years of storage. Scanning electron microscopy analysis has been performed to investigate whisker length and, using polished cross-sections, the morphology, thickness and type of intermetallic formation.

Normal tin-plated deposits on brass and steel with a copper barrier layer nucleated whiskers within five months, and in each case, these grew to lengths between 1 and 4.5 mm. For normal tin electroplated onto brass, a one- or two-month nucleation period was needed before whiskers developed. They reached a maximum length of about 1.5 mm after six months, and little or no further growth occurred during the subsequent 32 years. Very few whiskers grew on the tin-plated steel samples and no intermetallic formation was observed. None of the fused tin plating samples nucleated whiskers during the 32-year period.

Knowledge about vintage whiskers is important to take steps to increase the resiliency of space missions. Similarly, such knowledge is important to engineers engaged in products reaching their nominal end-of-life, but where, for reasons of economy, these products cannot be replaced.

This study represents a unique insight into whisker growth and intermetallic formation over an extremely long time period.