Alternative Solders for Electronics Assemblies: Part 1: Materials Selection
P.G. Harris
(International Tin Research Institute, Uxbridge, Middlesex, England)
M.A. Whitmore
(International Tin Research Institute, Uxbridge, Middlesex, England)
37
Abstract
This is the first of two papers reporting work carried out under a programme sponsored by the Department of Trade and Industry (DTI), involving collaboration between the International Tin Research Institute, GEC‐Marconi Ltd, BNR (Europe) Ltd and Multicore Solders Ltd. Part 1 describes the methodology used to select a number of candidate alloys as possible suitable lead‐free alternatives to tin‐lead solder.
Citation
Harris, P.G. and Whitmore, M.A. (1993), "Alternative Solders for Electronics Assemblies: Part 1: Materials Selection", Circuit World, Vol. 19 No. 2, pp. 25-27. https://doi.org/10.1108/eb046199
Publisher
:MCB UP Ltd
Copyright © 1993, MCB UP Limited