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Laser soldering has attracted attention as an alternative soldering process for microsoldering due to its localized and noncontact heating, a rapid rise and fall in temperature, fluxless and easy automation compared to reflow soldering.

In this study, the metallurgical and mechanical properties of the Sn3.0Ag0.5Cu/Ni-P joints after laser and reflow soldering and isothermal aging were compared and analyzed.

In the as-soldered Sn3.0Ag0.5Cu/Ni-P joints, a small granular and loose (Cu,Ni)6Sn5 intermetallic compound (IMC) structure was formed by laser soldering regardless of the laser energy, and a long and needlelike (Cu,Ni)6Sn5 IMC structure was generated by reflow soldering. During aging at 150°C, the growth rate of the IMC layer was faster by laser soldering than by reflow soldering. The shear strength of as-soldered joints for reflow soldering was similar to that of laser soldering with 7.5 mJ, which sharply decreased from 0 to 100 h for both cases and then was maintained at a similar level with increasing aging time.

Laser soldering with certain energy is effective for reducing the thickness of IMCs, and ensuring the mechanical property of the joints was similar to reflow soldering.

The high specific strength makes magnesium alloys have a wide range of applications in aerospace, military, automotive, marine and construction industries. However, its poor corrosion resistance and weldability have limited its development and application. Friction stir welding (FSW) can effectively avoid the defects of fusion welding. However, the microstructure, mechanical properties and corrosion behavior of FSW joints in magnesium alloys vary among different regions. The purpose of this paper is to review the corrosion of magnesium alloy FSW joints, and to summarize the protection technology of welded joints.

The corrosion of magnesium alloy FSW joints includes electrochemical corrosion and stress corrosion. This paper summarizes corrosion protection techniques for magnesium alloys FSW joints, focusing on composition, microstructure changes and surface treatment methods.

Currently, this research is mainly focused on enhancing the corrosion resistance of magnesium alloy FSW joints by changing compositions, structural modifications and surface coating technologies. Refinement of the grains can be achieved by adjusting welding process parameters, which in turn minimizes the effects of the second phase on the alloy’s corrosion resistance.

This paper presents a comprehensive review on the corrosion and protection of magnesium alloys FSW joints, covering the latest research advancements and practical applications. It aims to equip researchers with a better insight into the field and inspire new studies on this topic.

The purpose of this study is to reveal the effect of nano-Al₂O₃ particle addition on the nucleation/growth kinetics, microhardness, wear resistance and corrosion resistance of Co–P–xAl₂O₃ nanocomposite plating.

The kinetics and properties of Co–P–xAl₂O₃ nanocomposite plating prepared by electroplating were investigated by electrochemical measurements, scanning electron microscopy, X-ray diffraction, X-ray photoelectron spectroscopy, Vickers microhardness measurement, SRV5 friction and wear tester and atomic force microscopy.

A 12 g/L nano-Al₂O₃ addition in the plating solution can transform the nucleation/growth kinetics of the plating from the 3D progressive model to the 3D instantaneous model. The microhardness of the plating increased with the increase of nano-Al₂O₃ content in plating. The wear resistance of the plating did not adhere strictly to Archard’s law. An even and denser corrosion product film was generated due to the finer grains, with a high corrosion resistance.

The effect of different nano-Al₂O₃ addition on the nucleation/growth kinetics and properties of Co–P–xAl₂O₃ nanocomposite plating was investigated, and an anticorrosion mechanism of Co–P–xAl₂O₃ nanocomposite plating was proposed.

This paper aims to comprehensively review the preparation methods of superhydrophobic surfaces (SHPS) for corrosion protection of Mg alloy in recent years.

The preparation methods, wettability and corrosion resistance of SHPS on Mg alloy in the past three years are systematically described in this paper.

Two types of SHPS, including single-layer and multilayer coatings for corrosion protection of Mg alloy are summarized. Preparing multilayered coatings with multifunction is the current trend in developing SHPS on Mg alloy.

This paper reviewed the preparation methods and corrosion resistance of SHPS on Mg alloys. It provides a valuable reference for researchers to develop highly durable SHPS with excellent corrosion resistance for Mg alloys.

The purpose of this paper is to present current state of understanding on jet electrodeposition manufacturing; to compare various experimental parameters and their implication on as deposited features; and to understand the characteristics of jet electrodeposition deposition defects and its preventive procedures through available research articles.

A systematic review has been done based on available research articles focused on jet electrodeposition and its characteristics. The review begins with a brief introduction to micro-electrodeposition and high-speed selective jet electrodeposition (HSSJED). The research and developments on how jet electrochemical manufacturing are clustered with conventional micro-electrodeposition and their developments. Furthermore, this study converges on comparative analysis on HSSJED and recent research trends in high-speed jet electrodeposition of metals, their alloys and composites and presents potential perspectives for the future research direction in the final section.

Edge defect, optimum nozzle height and controlled deposition remain major challenges in electrochemical manufacturing. On-situ deposition can be used as initial structural material for micro and nanoelectronic devices. Integration of ultrasonic, laser and acoustic source to jet electrochemical manufacturing are current trends that are promising enhanced homogeneity, controlled density and porosity with high precision manufacturing.

This paper discusses the key issue associated to high-speed jet electrodeposition process. Emphasis has been given to various electrochemical parameters and their effect on deposition. Pros and cons of variations in electrochemical parameters have been studied by comparing the available reports on experimental investigations. Defects and their preventive measures have also been discussed. This review presented a summary of past achievements and recent advancements in the field of jet electrochemical manufacturing.

The purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and practical implementation of innovative lead-free solder materials in the electronic packaging industry.

This study investigates the effect of adding Si₃N₄ NWs to Sn58Bi solder in various mass fractions (0, 0.1, 0.2, 0.4, 0.6 and 0.8 Wt.%) for modifying the solder and joining the Cu substrate. Meanwhile, the melting characteristics and wettability of solder, as well as the microstructure, interfacial intermetallic compound (IMC) and mechanical properties of joint were evaluated.

The crystal plane spacing and lattice constant of Sn and Bi phase increase slightly. A minor variation in the Sn58Bi solder melting point was caused, while it does not impact its functionality. An appropriate Si₃N₄ NWs content (0.2∼0.4 Wt.%) significantly improves its wettability, and modifies the microstructure and interfacial IMC layer. The shear strength increases by up to 10.74% when adding 0.4 Wt.% Si₃N₄ NWs, and the failure mode observed is brittle fracture mainly. However, excessive Si₃N₄ will cause aggregation at the junction between the solder matrix and IMC layer, this will be detrimental to the joint.

The Si₃N₄ NWs were first used for the modification of lead-free solder materials. The relative properties of composite solder and joints were evaluated from different aspects, and the optimal ratio was obtained.

This paper aims to investigate the competitive potential of different classes of municipalities within larger metropolitan areas, considering three dimensions of place competitiveness, associated to contemporary economic recovery agendas: the “dual transition” (green and digital) and socio-economic resilience.

The proposed methodology is divided in two stages, the first aiming at developing a new Index of Urban Competitiveness, based on three key dimensions of place development, by using principal component analysis and hierarchical cluster analysis; the second intends to identify municipalities’ main competitive assets, throughout the examination of the existing links between the overall competitiveness index and intra-metropolitan place conditions in each dimension. This methodology is applied to the metropolitan areas of Porto and Lisbon.

The analysis shows a weak link between population size and urban competitiveness, suggesting that economic recovery investments primarily targeting larger municipalities will not necessarily lead to greater metropolitan competitive advantages. On the contrary, taking into consideration place-based interventions for different “clubs” of municipalities would more likely contribute to enhance competitive performance and valorise territorial assets. Furthermore, while the relationship between competitiveness and environmental performance appears to be non-linear, digitalization and economic and social resilience prove to be key for urban competitive potential.

By drawing on contemporary notions of urban competitiveness, the work proposes a revised method to evaluate competitiveness, latent qualities and intrinsic features of places, constituting an initial step to conceive suitable metropolitan development and investment strategies for economic recovery.

In the era of artificial intelligence (AI), algorithms have gained unprecedented importance. Scientific studies have shown that algorithms are frequently mentioned in papers, making mention frequency a classical indicator of their popularity and influence. However, contemporary methods for evaluating influence tend to focus solely on individual algorithms, disregarding the collective impact resulting from the interconnectedness of these algorithms, which can provide a new way to reveal their roles and importance within algorithm clusters. This paper aims to build the co-occurrence network of algorithms in the natural language processing field based on the full-text content of academic papers and analyze the academic influence of algorithms in the group based on the features of the network.

We use deep learning models to extract algorithm entities from articles and construct the whole, cumulative and annual co-occurrence networks. We first analyze the characteristics of algorithm networks and then use various centrality metrics to obtain the score and ranking of group influence for each algorithm in the whole domain and each year. Finally, we analyze the influence evolution of different representative algorithms.

The results indicate that algorithm networks also have the characteristics of complex networks, with tight connections between nodes developing over approximately four decades. For different algorithms, algorithms that are classic, high-performing and appear at the junctions of different eras can possess high popularity, control, central position and balanced influence in the network. As an algorithm gradually diminishes its sway within the group, it typically loses its core position first, followed by a dwindling association with other algorithms.

To the best of the authors’ knowledge, this paper is the first large-scale analysis of algorithm networks. The extensive temporal coverage, spanning over four decades of academic publications, ensures the depth and integrity of the network. Our results serve as a cornerstone for constructing multifaceted networks interlinking algorithms, scholars and tasks, facilitating future exploration of their scientific roles and semantic relations.

This study aims to explore the feasibility of adding Si₃N₄ nanoparticles to Sn58Bi and provides a theoretical basis for designing and applying new lead-free solder materials for the electronic packaging industry.

In this paper, Sn58Bi-xSi₃N₄ (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 Wt.%) was prepared for bonding Cu substrate, and the changes in thermal properties, wettability, microstructure, interfacial intermetallic compound and mechanical properties of the composite solder were systematically studied.

The experiment results demonstrate that including Si₃N₄ nanoparticles does not significantly impact the melting point of Sn58Bi solder, and the undercooling degree of solder only fluctuates slightly. The molten solder spreading area reached a maximum of 96.17 mm², raised by 19.41% relative to those without Si₃N₄, and the wetting angle was the smallest at 0.6 Wt.% of Si₃N₄, with a minimum value of 8.35°. When the Si₃N₄ nanoparticles reach 0.6 Wt.%, the solder joint microstructure is significantly refined. Appropriately adding Si₃N₄ nanoparticles will slightly increase the solder alloy hardness. When the concentration of Si₃N₄ reaches 0.6 Wt.%, the joints shear strength reached 45.30 MPa, representing a 49.85% increase compared to those without additives. A thorough examination indicates that legitimately incorporating Si₃N₄ nanoparticles into Sn58Bi solder can enhance its synthetical performance, and 0.6 Wt.% is the best addition amount in our test setting.

In this paper, Si₃N₄ nanoparticles were incorporated into Sn58Bi solder, and the effects of different contents of Si₃N₄ nanoparticles on Sn58Bi solder were investigated from various aspects.

The purpose of this paper was prepared a Ni-based superhydrophobic coating on the surface of copper to enhence its corrosion resistance. The superhydrophobic coating (SHPC) has proven to be an effective surface treatment in corrosion protection. In this paper, a Ni-based SHPC was prepared on the surface of copper (Cu) to enhance its corrosion resistance.

The coating was prepared through a two-step electrodeposition process. The first step involves the formation of a micro-nano structure Ni layer formed by an electrodeposition process. Subsequently, the polysiloxane layer was deposited on the Ni surface to create an SHPC. The morphology, composition, structure, wettability and corrosion resistance of the coating were characterized and discussed.

The results show that the water contact angle of the as-prepared coating reaches 155.5°±1.0°. The corrosion current density (i_corr = 3.90 × 10⁻⁹ A·cm⁻²) decreased by three orders of magnitude compared to the substrate, whereas |Z|_{f = 0.01 Hz} (2.40 × 10⁶ Ω·cm²) increased by three orders of magnitude. It indicated that the prepared coating has excellent superhydrophobicity and high corrosion resistance, which can provide better protection for the substrate.

The prepared coating provides long-lasting protection for Cu and other metals and offers valuable data for developing SHPCs.