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Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering

Y. Wu (Xi’an Microelectronics Technology Institute, Xi’an, China)
Z.J. Zhang (School of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang, China)
L.D. Chen (Xi’an Microelectronics Technology Institute, Xi’an, China)
X. Zhou (School of Materials Science and Engineering, Jiangsu University of Science and Technology, Xi’an, China)

Microelectronics International

ISSN: 1356-5362

Article publication date: 27 March 2023

Issue publication date: 2 January 2024

126

Abstract

Purpose

Laser soldering has attracted attention as an alternative soldering process for microsoldering due to its localized and noncontact heating, a rapid rise and fall in temperature, fluxless and easy automation compared to reflow soldering.

Design/methodology/approach

In this study, the metallurgical and mechanical properties of the Sn3.0Ag0.5Cu/Ni-P joints after laser and reflow soldering and isothermal aging were compared and analyzed.

Findings

In the as-soldered Sn3.0Ag0.5Cu/Ni-P joints, a small granular and loose (Cu,Ni)6Sn5 intermetallic compound (IMC) structure was formed by laser soldering regardless of the laser energy, and a long and needlelike (Cu,Ni)6Sn5 IMC structure was generated by reflow soldering. During aging at 150°C, the growth rate of the IMC layer was faster by laser soldering than by reflow soldering. The shear strength of as-soldered joints for reflow soldering was similar to that of laser soldering with 7.5 mJ, which sharply decreased from 0 to 100 h for both cases and then was maintained at a similar level with increasing aging time.

Originality/value

Laser soldering with certain energy is effective for reducing the thickness of IMCs, and ensuring the mechanical property of the joints was similar to reflow soldering.

Keywords

Acknowledgements

This work was supported by the National Natural Science Foundation of China (Grant No. 51801079) and the Natural Science Foundation for Young Scientists of Jiangsu Province (Grant No. BK20180987).

Citation

Wu, Y., Zhang, Z.J., Chen, L.D. and Zhou, X. (2024), "Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering", Microelectronics International, Vol. 41 No. 1, pp. 41-47. https://doi.org/10.1108/MI-11-2022-0185

Publisher

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Emerald Publishing Limited

Copyright © 2023, Emerald Publishing Limited

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