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The purpose of this paper was to investigate how variations in the geometry of silicon chips and the presence of surface defects affect their static bending properties. By comparing the bending radius and strength across differently sized and treated chips, the study sought to understand the underlying mechanics that contribute to the flexibility of silicon-based electronic devices. This understanding is crucial for the development of advanced, robust and adaptable electronic systems that can withstand the rigors of manufacturing and everyday use.

This study explores the impact of silicon chip geometry and surface defects on flexibility through a multifaceted experimental approach. The methodology included preparing silicon chips of three distinct dimensions and subjecting them to thinning processes to achieve a uniform thickness verified via scanning electron microscopy (SEM). Finite element method (FEM) simulations and a series of four-point bending tests were used to analyze the bending flexibility theoretically and experimentally. The approach was comprehensive, examining both the intrinsic geometric factors and the extrinsic influence of surface defects induced by manufacturing processes.

The findings revealed a significant deviation between the theoretical predictions from FEM simulations and the experimental outcomes from the four-point bending tests. Rectangular-shaped chips demonstrated superior flexibility, with smaller dimensions leading to an increased bending strength. Surface defects, identified as critical factors affecting flexibility, were analyzed through SEM and atomic force microscopy, showing that etching processes could reduce defect density and enhance flexibility. Notably, the study concluded that surface defects have a more pronounced impact on silicon chip flexibility than geometric factors, challenging initial assumptions and highlighting the need for defect minimization in chip manufacturing.

This research contributes valuable insights into the design and fabrication of flexible electronic devices, emphasizing the significant role of surface defects over geometric considerations in determining silicon chip flexibility. The originality of the work lies in its holistic approach to dissecting the factors influencing silicon chip flexibility, combining theoretical simulations with practical bending tests and surface defect analysis. The findings underscore the importance of optimizing manufacturing processes to reduce surface defects, thereby paving the way for the creation of more durable and flexible electronic devices for future technologies.

The purpose of this paper is to investigate effects of the multiple rework of ball grid array (BGA) components on mechanical strength of BGA balls, as well as any possible intermetallic (IMC) embrittlement, and obtain data correlated with possible estimation on the maximum permitted limits of BGA rework.

In this paper, mechanical strength of BGA components assemblies with multiple numbers of rework operations was evaluated. Mechanical evaluation was conducted using BGA ball shear tests and four‐point bending tests of BGA assemblies. Test samples were prepared under the following conditions: virgin, one, two, three and five BGA reworks. Failure mechanism was evaluated using cross‐section and SEM analysis.

The results show that both ball shearing tests and four‐point bending tests indicates that strength of BGA solder ball itself was not reduced significantly after repair/rework operation from one to five cycles. The IMC structure layer after rework is a mixture of IMC, Sn‐rich and Pb‐rich phases. This mixture layers with thickness even more than 10 μm in thickness does not show reduction of strength of BGA solder balls and do not cause premature embrittlement. However, the bonding strength of the copper pads to the laminates is reduced with rework/repair operation, with the great reduction coming from the first and second rework operation.

In general, the industry recommends two rework cycles for BGA components on the same spot. This study indicates that further rework (up to five) causes little degradation, therefore there is room to increase the total rework cycle limit beyond recommended two for plastic BGA components.

Presented test results shows that in most cases industry overestimates risks associated with increased embritlement of the BGA solder joints due to the intermetallics growth after multiple BGA rework operations. Strength reduction of BGA assemblies is mostly associated with reduction of bonding strength of the copper pads to the laminates is reduced with rework/repair operation and number of reworks could be increased in most cases.

The overall aim of this research work was the improvement of the failure behavior of printed circuit boards (PCBs). In order to describe the mechanical behavior of PCBs under cyclic thermal loads, thin copper layers were characterized. The mechanical properties of these copper layers were determined in cyclic four-point bend tests and in cyclic tensile-compression tests, as their behavior under changing tensile and compression loads needed to be evaluated.

Specimens for the four-point bend tests were manufactured by bonding 18-μm-thick copper layers on both sides of 10-mm-thick silicone plates. The silicone was characterized in tensile, shear and blow-up tests to provide input data for a hyperelastic material model. Specimens for the cyclic tensile-compression tests were produced in a compression molding process. Four layers of glass fiber-reinforced epoxy resin (thickness 90 μm) and five layers of copper (thickness 60 μm) were applied.

The results showed that, due to the hyperelastic material behavior of silicone, the four-point bend tests were applicable only for small strains, while the cyclic tensile-compression tests could successfully be applied to characterize thin copper foils in tensile and compression up to 1 percent strain.

Thin copper layers (foils) could be characterized successfully under cyclic tensile and compression loads.

The purpose of this paper was twofold: first, to determine if rotating bending could be used as an effective way of determining the fatigue behaviour of laser-sintered nylon, and second, to examine whether the fatigue behaviour of laser-sintered PA12 showed any significant anisotropy.

Specimens were measured to obtain dimensional accuracy, density and surface roughness levels. Then, uniaxial tensile and rotating-bending fatigue tests were performed. A purpose-built test-jig has been used to subject hourglass-shaped specimens to reversed bending at two frequencies: 50 and 30 Hz. Additionally, thermal and microstructural analyses were performed to understand the underlying mechanisms of failure.

The experiments suggest PA12 specimens will fail in fatigue following the conventional fatigue mechanisms observed in previous research with ductile polymers. Although high-frequency loading caused a heat build-up in the specimen, temperatures stabilised between 20 and 30°C, suggesting that rotating-bending fatigue at frequencies of up to 50 Hz is a valid way of determining the fatigue behaviour of laser-sintered PA12 specimens. Stresses below 20 MPa led to fatigue lives above 1 million cycles. Some anisotropic behaviour was observed in the fatigue test results, with specimens made orientated with the Z axis showing the lowest fatigue lives on average, but an endurance limit of approximately 15 MPa seems to be common for all specimens regardless of their build orientation.

The observed endurance limit of 15 MPa did not depend significantly on the orientation at which a part was built – meaning that it may be possible to guarantee a service life for a part which does not depend on part orientation within a build. Clearly, good-quality control will also be required to ensure performance, but this has important implications for the design of laser-sintered PA12 parts for realistic service conditions.

To our knowledge, this is the first paper to present rotating-bending fatigue data for laser-sintered PA12 parts, and the first to identify an endurance limit which is independent of part orientation.

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

Delamination is a common and crucial damage mode which occurs during manufacturing of layered composites or their service life. Its existence leads to degradation in mechanical properties or even structural failure of composites. Hence, the purpose of this article is to study the effect of induced delamination on flexural performance of CFRP composites.

In this article, the flexural behaviors of intact and delaminated carbon/epoxy laminates were investigated under pure bending. A circular PTFE film was introduced during fabrication to create artificial delamination. Moreover, finite element models were developed for intact and delaminated composites using ANSYS. The created models were discretized using 3D structural eight node solid elements.

The delamination influenced considerably flexural properties of composite. The composite exhibited a linear elastic nature prior to the damage of top ply on the compression side. The flexural strength and stiffness of the composite reduced to 44.5% and 18.2% respectively due to the existence of artificial delamination. The results of four point bending experiments and finite element analysis agreed for both intact and delaminated composites within acceptable error. Finally for same composites, first ply failure analysis was carried out using Tsai-Hill, Tsai-Wu and Hashin failure criteria.

In pure bending, beam section of the middle portion is free from shear. It is not so in case of three-point bending. Hence, the effect of embedded artificial defect on bending performance of CFRP composite due to pure bending has been investigated.

Multi‐layer surface finish, from the bottom to top, of electroless Ni, electroless Pd, and immersion Au (Ni/Pd/Au) have been introduced in the printed circuit board (PCB) industry recently. This paper reports an evaluation of this surface finish from the perspective of solder joint attachment reliability, especially to see if the Ni/Pd/Au could be immune from the brittle interfacial fracture of PBGA on electroless Ni/immersion Au, recently observed and reported by us. PCBs with Ni/Pd/Au finishes, made from two vendors with varied Pd layer thickness were attached with PBGA packages, and tested in four‐point bending. When joint strength is strong, bending tests resulted in peeling off the PCB pads; otherwise, brittle fractures occurred at the interface between solder balls and PCB pads. After aging, solder joints on all Ni/Pd/Au and reference metal finishes failed by the same brittle fracture at the interface between Ni‐Sn and Au‐Sn intermetallic compounds. It is concluded that the interfacial fracture was controlled by something other than the Pd, and the existence of the Pd did not prevent the interfacial fracture. Also, the presence of Pd could not prevent the Au migration and subsequent fracture.

This study aims to reveal that fatigue life is improved using heat treatment in the rotational bending fatigue test, which determines the fatigue behavior closest to service conditions.

It is essential to know the mechanical behavior of the parts produced by additive manufacturing under service conditions. In general, axial stress and plane bending tests are used by many researchers because they are practical: the service conditions cannot be sufficiently stimulated. For this reason, the rotating bending fatigue test, which represents the conditions closest to the service conditions of a load-bearing machine element, was chosen for the study. In this study, the rotational bending fatigue behavior of X3NiCoMoTi18-9–5 (MS1) maraging steel specimens produced by the selective laser melting (SLM) technique was experimentally investigated under various heat treatments conditions.

As a result of the study, MS1 produced by additive manufacturing is a material suitable for heat treatment that has enabled the heat treatment to affect fatigue strength positively. Cracks generally initiate from the outer surface of the sample. Fabrication defects have been determined to cause all cracks on the sample surface or regions close to the surface.

While producing the test sample, printing was vertical to the print bed, and various heat treatments were applied. The rotating bending fatigue test was performed on four sample groups comprising as-fabricated, age-treated, solution-treated and solution + age-treated conditions.

Most literature studies have focused on the axial fatigue strength, printing orientation and heat treatment of maraging steels produced with Direct Metal Laser Sintering (DMLS); many studies have also investigated crack propagation behaviors. There are few studies in the literature covering conditions of rotating bending fatigue. However, the rotating bending loading state is the service condition closest to modern machine element operating conditions. To fill this gap in the literature, the rotating bending fatigue behavior of the alloy, which was maraging steel (X3NiCoMoTi18-9–5, 1.2709) produced by SLM, was investigated under a variety of heat treatment conditions in this study.

At this moment, there is substantial anxiety surrounding the fire safety of huge reinforced concrete (RC) constructions. The limitations enforced by test facilities, technology, and high costs have significantly limited both full-scale and scaled-down structural fire experiments. The behavior of an individual structural component can have an impact on the entire structural system when it is connected to it. This paper addresses the development and testing of a self-straining preloading setup that is used to perform thermomechanical action in RC beams and slabs.

Thermomechanical action is a combination of both structural loads and a high-temperature effect. Buildings undergo thermomechanical action when it is exposed to fire. RC beams and slabs are one of the predominant structural members. The conventional method of testing the beams and slabs under high temperatures will be performed by heating the specimens separately under the desired temperature, and then mechanical loading will be performed. This gives the residual strength of the beams and slabs under high temperatures. This method does not show the real-time behavior of the element under fire. In real-time, a fire occurs simultaneously when the structure is subjected to desired loads and this condition is called thermomechanical action. To satisfy this condition, a unique self-training test setup was prepared. The setup is based on the concept of a prestressing condition where the load is applied through the bolts.

To validate the test setup, two RC beams and slabs were used. The test setup was tested in service load range and a temperature of 300 °C. One of the beams and slabs was tested conventionally with four-point bending and point loading on the slab, and another beam and slab were tested using the preloading setup. The results indicate the successful operation of the developed self-strain preloading setup under thermomechanical action.

Gaining insight into the unpredictable reaction of structural systems to fire is crucial for designing resilient structures that can withstand disasters. However, comprehending the instantaneous behavior might be a daunting undertaking as it necessitates extensive testing resources. Therefore, a thorough quantitative and qualitative numerical analysis could effectively evaluate the significance of this research.

The study was performed to validate the thermomechanical load setup for beams and slabs on a single-bay single-storey RC frame with and without slab under various fire possible scenarios. The thermomechanical load setup for RC members is found to be scarce.

This work aims to present an experimental study of steel fibre-reinforced concrete (SFRC) subjected to high temperature, especially focusing on residual behaviour.

Compressive strength and split tensile strength of SFRC cubes and ultimate bending strength of prisms were evaluated under ambient and elevated temperatures. The specimens were heated by ceramic heaters and then repacked for testing.

The results showed that a compressive strength of SFRC is reduced by 38 and 66 per cent, tensile strength is reduced by 25 and 59 per cent and ultimate bending force is reduced by 33 and 56 per cent in case of 400°C and 600°C, respectively, comparing with ambient temperature.

The developed testing procedure could be used for determination of material properties of SFRC under elevated temperatures.