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Communicating a clear, precise, interpretable and unambiguous visual message usually relies on a cross-disciplinary team of professionals. Their complementary visions can uncover which information matter and how it could be visually displayed to inform, sensitize and encourage people to act toward sustainability. While design studies generally claim that this team has to come to a shared vision, the authors question this assumption, which seems to contradict the benefits of cross-disciplinarity. The purpose of this study is to reveal how simple visual representations displayed in a PowerPoint actively participate in the expression of various and sometimes divergent visions. Recognizing the agency of visuals also leads this study to propose the notion of (un)shared professional vision, which shows that the richness of visual representations can only reveal itself through the capacity of professional visions to maintain their differences while confronting each other.

Over a 20-month ethnography, this study documented its own cross-disciplinary reflective design process, which aimed to design collectively an experimental environmental label, focusing on interactions occurring between professionals and visuals displayed on five key PowerPoint slides.

This study first demonstrates how, in practice, a cross-disciplinary reflective design conversation with visuals concretely unfolds through boundary-objects. This study shows how these visuals manage to ex-press themselves through the multiple visions represented in the discussions, revealing their complexity. Second, this study introduces the notion of (un)shared professional vision which underlines that unsharing a vision nurtures the team’s collective capacity to express the complexity of a design situation, while sharing a vision is also necessary to confront these respective expressions to allow the professional uncovering of what should be visually communicated.

The Communication as Constitutive of Organization lens the authors chose to understand the reflective design conversation illustrates that, even though each collaborator’s vision was “(un)shared,” their many voices expand the understanding of the situation and lead them to develop an unexpected and creative environmental information ecosystem that can positively transform society through visuals.

This review paper aims to introduce the inkjet printing as a tool for fabrication of flexible/wearable sensors. It summarizes inkjet printing techniques including various modes of operation, commonly used substrates and inks, commercially available inkjet printers and variables affecting the printing process. More focus is on the drop-on-demand printing mode, a strongly considered printing technique for patterning conductive lines on flexible and stretchable substrates. As inkjet-printed patterns are influenced by various variables related to its conductivity, resistivity, durability and dimensions of printed patterns, the main printing parameters (e.g. printing multilayers, inks sintering, surface treatment, cartridge specifications and printing process parameters) are reported. The embedded approaches of adding electronic components (e.g. surface-mounted and optoelectronic devices) to the stretchable circuit are also included.

In this paper, inkjet printing techniques for fabrication of flexible/stretchable circuits will be reviewed. Specifically, the various modes of operation, commonly used substrates and inks and variables affecting the printing process will be presented. Next, examples of inkjet-printed electronic devices will be demonstrated. These devices will be compared to their rigid counterpart in terms of ease of implementation and electrical behavior for wearable sensor applications. Finally, a summary of key findings and future research opportunities will be presented.

In conclusion, it is evident that the technology of inkjet printing is becoming a competitor to traditional lithography fabrication techniques, as it has the advantage of being low cost and less complex. In particular, this technique has demonstrated great capabilities in the area of flexible/stretchable electronics and sensors. Various inkjet printing methods have been presented with emphasis on their principle of operation and their commercial availability. In addition, the components of a general inkjet printing process have been discussed in details. Several factors affect the resulting printed patterns in terms of conductivity, resistivity, durability and geometry.

The paper focuses on flexible/stretchable optoelectronic devices which could be implemented in stretchable circuits. Furthermore, the importance and challenges related to printing highly conductive and highly stretchable lines, as well as reliable electronic devices, and interfacing them with external circuitry for power transmission, data acquisition and signal conditioning have been highlighted and discussed. Although several fabrication techniques have been recently developed to allow patterning conductive lines on a rubber substrate, the fabrication of fully stretchable wearable sensors remains limited which needs future research in this area for the advancement of wearable sensors.

Solar cells could make textile-based wearable systems energy independent without the need for battery replacement or recharging; however, their laundry resistance, which is prerequisite for the product acceptance of e-textiles, has been rarely examined. This paper aims to report a systematic study of the laundry durability of solar cells embedded in textiles.

This research included small commercial monocrystalline silicon solar cells which were encapsulated with functional synthetic textile materials using an industrially relevant textile lamination process and found them to reliably endure laundry washing (ISO 6330:2012). The energy harvesting capability of eight textile laminated solar cells was measured after 10–50 cycles of laundry at 40 °C and compared with light transmittance spectroscopy and visual inspection.

Five of the eight textile solar cell samples fully maintained their efficiency over the 50 laundry cycles, whereas the other three showed a 20%–27% decrease. The cells did not cause any visual damage to the fabric. The result indicates that the textile encapsulated solar cell module provides sufficient protection for the solar cells against water, washing agents and mechanical stress to endure repetitive domestic laundry.

This study used rigid monocrystalline silicon solar cells. Flexible amorphous silicon cells were excluded because of low durability in preliminary tests. Other types of solar cells were not tested.

A review of literature reveals the tendency of researchers to avoid standardized textile washing resistance testing. This study removes the most critical obstacle of textile integrated solar energy harvesting, the washing resistance.

The purpose of this paper is to investigate the durability of radio‐frequency identification (RFID) chips assembled on flexible substrates (paper and foil), with materials evaluated with regard to mechanical stresses and dependence on the applied substrate, antenna materials, chip pad printing and chip encapsulation.

RFID chips were assembled to antennas screen printed on flexible substrates. Shear and bending tests were conducted in order to evaluate the mechanical durability of the chip joints depending on the materials used for mounting the RFID chip structures. X‐ray inspection and cross sectioning were performed to verify the quality of the assembly process. The microstructure and the resistance of the materials used for chip pads were investigated with the aim of determining the conductivity mechanism in the printed layers.

Addition of carbon nanotubes to the conductive adhesive (CA) provided a higher shear force for the assembled RFID chips, compared to the unmodified conductive adhesive or a polymer paste with silver flakes. However, this additive resulted in an increase in the material's resistance. It was found that the RFID substrate material had a significant influence on the shear force of mounted chips, contrary to the materials used for printing antennas. The lower shear force for chips assembled on antennas printed on paper rather than on foil was probably connected with its higher absorption of solvent from the pastes. Increasing the curing temperature and time resulted in an additional increase in the shear force for chips assembled to antennas printed on foil. A reverse dependence was observed for chips mounted on the antennas made on paper. An improvement in the durability of the RFID chip structures was achieved by chip encapsulation. Bending tests showed that a low‐melting adhesive was the best candidate for encapsulation, as it provided flexibility of the assembled structure.

Further studies are necessary to investigate the mechanical durability of RFID chips assembled with a conductive adhesive, with different addition levels and types of carbon nanotubes.

The results revealed that the best candidate for providing the highest RFID chip durability related to mechanical stresses was the low‐melting adhesive. It can be recommended for practical use, as it simplified the assembly process and reduced the curing step in the encapsulation of the RFID devices. From the results of shear testing, conductive adhesives with carbon nanotubes can be used in RFID chip assembly because of their ability to increase the shear force of joints created between the antenna and the chip.

In this paper, the influence of the materials used for antenna, chip pads, encapsulation and the curing conditions on the mechanical durability (shear and bending) of RFID chips was analyzed. Commercial and elaborated materials were compared. Some new materials containing a conductive adhesive and carbon nanotubes were proposed and tested in RFID chip assembly to antennas printed on flexible substrates (paper and foil).

This paper highlights how technical devices last in organizations. Instead of focusing on the usual implementation or short-term post-implementation phases, this study aims to explore what happens to established technical devices.

The authors build on a 10-year in-depth longitudinal case study examining a CRM package, a type of Enterprise Resource Planning system specialized in customer relationship management, in a door-drop advertising company. This case is based mainly on 35 interviews and four weeks of non-participant observation, made over three different periods.

Drawing on the literature on drift and maintenance, this study investigates two tensions foregrounding lasting: one regarding the degree of human intervention on the technical device (object being maintained vs object maintaining itself) and one regarding the relationship to the initial expectations towards the technical device (relinquishment of certain hopes vs regeneration of interests). This case combines these tensions and allows to highlight four alterations in the CRM system to show how apparently stable devices keep on changing.

In a time of resource exhaustion, it is important to reflect upon our relationships to information technology and their modalities of lasting. By stressing that uses emerge from relinquishment and reduction, the authors wish to help organizations move towards more sustainable engagement with their technical devices in the long run.

Lasting is not just a matter of being maintained in a context of threat but also builds upon the capacities of a technical device to maintain itself. The self-alteration dynamics that the authors come up with, shedding and ramification, offer a dedramatized interpretation of maintenance that complements studies on institutional maintenance. The results also contribute to studies on technological drift. The authors stress that drifts are triggered by ties that run out, in particular, discontinuation of maintenance in the system. The durability of technical devices in organizations thus does not consist in always more uses or functionalities, but is also made of reductions and relinquishment.

Fuel cells technologies are the most promising green energy technologies for diverse applications. One of the fastest growing areas is the portable electronic applications where the power range is the order of 1–100 W. For most of the portable electronic devices, rechargeable battery is the major energy source. Due to limitations like limited capacity, requirement of external power for recharge have led many researchers to look for alternative power sources to power portable electronic devices. The high energy density of fuel cells makes them very attractive alternative to batteries for portable power applications. There are a variety of fuel cell technologies being considered to replace batteries in portable electronic equipment. Direct Liquid Fuel Cells (DLFCs) have attracted much attention due to their potential applications as a power source for portable electronic devices. The advantages of DLFCs over hydrogen fed PEM fuel cells include a higher theoretical energy density and efficiency, a more convenient handling of the streams, and enhanced safety. Unlike batteries, fuel cells need not be recharged, merely refueled. This paper provides an overview on challenges of DLFCs (Direct Liquid Fuel Cells), like fuel crossover, cost, durability, water management, weight and size along with approaches being investigated to solve these challenges. Portable Fuel Cell Commercialization Targets for future and producers of portable fuel cells across the globe are also discussed in this paper.

The purpose of this paper is to realize an electronic circuit design on the fabric surfaces to form a fully integrated functional active T‐shirt structure.

Functional products combining textile, electronics and the software have attracted great attention in recent years. The integration of the electrical and electronic devices on the garment surface using conductive threads is a challenging issue considering conductiveness, long durability, washability and manufacturing process. As an application, a group of light emitting diode (LED) lights controlled by a light sensor, accelerometer and related electronic control circuits were placed on a fabric construction.

The brightness of LED lights is controlled by using a light sensor depending on the perceived ambient light intensity. LED lighting patterns are controlled by means of an accelerometer which senses the physical activities of the wearer, such as walking, running and standing.

In this study, new construction methods have been successfully implemented and the active T‐shirt has been realized with its related hardware and software.

Aims to review polymeric materials used as adhesives and the related bonding procedures applicable in the medical industry.

The main types of polymeric materials used as adhesives are described. Details and the main points of the adhesive bonding processes are also described with comments on their adaptability to automated assembly. Finally, typical examples of the use of adhesives in medical device applications are provided.

Review paper with examples of applications of adhesives in assembly of medical materials and devices.

The appropriate selection of adhesive types and bonding parameters are critical for successful application of this technology in joining medical materials. Most currently available medical grade adhesives are only suitable for short‐term (<30 days) implantable application. The users must ensure that the properties of the selected adhesives, particularly the relevant biocompatibility and toxicity data are available and fully comply with any specific medical device application and regulation.

Although this is a general review paper, it contains information about new materials and processing techniques applied in successful application of adhesive bonding technology in medical devices. The information provided is expected to be of significant benefit to material scientists and design engineers evaluating and identifying suitable joining techniques for the assembly of medical devices.

The paper aims to investigate on the mechanical properties of surface-mount device (SMD) interconnections made on flexible and rigid substrates.

The durability of joints to shear strength was measured with tensile machine. Investigations were carried out for 0402- and 0603-sized ceramic passives and integrated circuits in SOIC-8, TSSOP-8, XSON3 and XSON6 packages. Three types of flexible substrates (Kapton, Mylar and Pyralux) and two types of rigid substrates (LTCC and alumina) were used. SMD components were mounted with SAC solder or electrically conductive adhesive. Contact pads were made of Ag-based polymer paste on flexible substrates and PdAg-based cermet paste on ceramics. The shear strength was measured for as-made and long-term thermally aged test structures. The average durability and standard deviation were compared for different combination of materials. Moreover, mechanical properties of interconnections made of polymer thick-film pastes or electrically/thermally conductive adhesives between ceramic chips and flexible/ceramic substrates were investigated.

The mechanical properties of joints strongly depend on configuration of applied materials. Some of them exhibit high durability to shear strength, while other should not be recommended due to very weak connections. Additionally, long-term thermal ageing showed that exploitation of such connections at elevated temperature in some cases might increase their strength. However, for some materials, it leads to accelerated degradation of joints.

This paper provides practical information about SMD interconnections made with standard materials (lead-free solder, electrically/thermally conductive adhesives) and proposed non-standard procedures, e.g. assembling of ceramic chips with low temperature cermet or polymer thick-film conductive pastes.

This paper is intended to be of interest to those involved in electronic applications of the screen printing process, including PCBs, membrane switches, thick film printing and instrument control panels. In recent years there have been a number of advances in screen printing technology which have significantly increased the capabilities and versatility of the process. Developments have included improvements in performance of screen printing machinery, mesh fabrics, stretching equipment, screen frame design, exposure devices, stencil systems and ink rheology and printability. In spite of these advances, there are many applications in PCB production where screen printing is under‐utilised, despite its cost effectiveness for volume board production when compared with dry film resists. This paper outlines some of the developments which have produced the modern screen stencils, and describes the rôle of mesh and stencil in determining the properties of the final printed result.