To read this content please select one of the options below:

A review of adhesive bonding techniques for joining medical materials

S.M. Tavakoli (TWI Ltd, Cambridge, Cambridgeshire, UK)
D.A. Pullen (TWI Ltd, Cambridge, Cambridgeshire, UK)
S.B. Dunkerton (TWI Ltd, Cambridge, Cambridgeshire, UK)

Assembly Automation

ISSN: 0144-5154

Article publication date: 1 June 2005




Aims to review polymeric materials used as adhesives and the related bonding procedures applicable in the medical industry.


The main types of polymeric materials used as adhesives are described. Details and the main points of the adhesive bonding processes are also described with comments on their adaptability to automated assembly. Finally, typical examples of the use of adhesives in medical device applications are provided.

Research limitations/implications

Review paper with examples of applications of adhesives in assembly of medical materials and devices.

Practical implications

The appropriate selection of adhesive types and bonding parameters are critical for successful application of this technology in joining medical materials. Most currently available medical grade adhesives are only suitable for short‐term (<30 days) implantable application. The users must ensure that the properties of the selected adhesives, particularly the relevant biocompatibility and toxicity data are available and fully comply with any specific medical device application and regulation.


Although this is a general review paper, it contains information about new materials and processing techniques applied in successful application of adhesive bonding technology in medical devices. The information provided is expected to be of significant benefit to material scientists and design engineers evaluating and identifying suitable joining techniques for the assembly of medical devices.



Tavakoli, S.M., Pullen, D.A. and Dunkerton, S.B. (2005), "A review of adhesive bonding techniques for joining medical materials", Assembly Automation, Vol. 25 No. 2, pp. 100-105.



Emerald Group Publishing Limited

Copyright © 2005, Authors

Related articles