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The purpose of the work is to provide a comprehensive review of the digital image correlation (DIC) technique for those who are interested in performing the DIC technique in the area of manufacturing.

No methodology was used because the paper is a review article.

no fundings.

Herein, the historical development, main strengths and measurement setup of DIC are introduced. Subsequently, the basic principles of the DIC technique are outlined in detail. The analysis of measurement accuracy associated with experimental factors and correlation algorithms is discussed and some useful recommendations for reducing measurement errors are also offered. Then, the utilization of DIC in different manufacturing fields (e.g. cutting, welding, forming and additive manufacturing) is summarized. Finally, the current challenges and prospects of DIC in intelligent manufacturing are discussed.

This paper aims to present an adaptation of digital image correlation (DIC) to the electronics industry for reliability assessment of electronic packages. Two case studies are presented: one for warpage measurement of a micro-electro-mechanical system (MEMS) package under different temperature conditions and the other for the measurement of transient displacements on the surface of a printed circuit board (PCB) assembly under free-fall drop conditions, which is for explaining the typical camera setup requirement and comparing among different boundary conditions by fastening methods of PCB.

DIC warpage measurements on a small device, such as a MEMS package, require a special speckle pattern. A new method for the creation of speckle patterns was developed using carbon coating and aluminum evaporative deposition. To measure the transient response on the surface of a PCB during a free-fall impact event, three-dimensional (3D) DIC was integrated with synchronized stereo-high speed cameras. This approach enables the measurement of full-field displacement on the PCB surface during a free-fall impact event, contrary to the localized information that is obtained by the conventional strain gage and accelerometer method.

The authors suggest the proposed patterning method to the small-sized microelectronics packages for DIC measurements. More generally, the idea is to have a thin layer of the dark or bright color of the background and then apply the white or black colored pattern, respectively, so that the surface has high contrast. Also, to achieve a proper size of speckles, this paper does not want to expose the measuring objects to high temperatures or pressures during the sample preparation stage. Of course, it seems a complicated process to use aluminum evaporator, carbon coater and electroformed mesh. However, the authors intend to share one of the solutions to achieve a proper pattern on such small-sized electronic packages.

3D DIC technique can be successfully implemented for the measurement of micro-scale deformations in small packages (such as MEMS) and for the analysis of dynamic deformation of complex PCB.

The mismatch of the thermal expansion coefficients of the materials in multiplayer structure may induce serious stress concentrations in electronic packaging. Experimental evaluation of the thermal stresses and strains in those electronic composites is becoming significantly important for optimizing design and failure prediction of the electronic devices.

Digital image correlation (DIC) technique was utilized to obtain thermal deformation filed of a BGA package. With the help of white light to illuminate the cross section of the BGA package, the gray images were taken from the rough surface of the specimen, that offer a kid of carrier pattern for the DIC processing with statistical resemblance in gray distributions. By using the algorithm of correlation computation, the DIC searched the matching spots in a pair of those images in which the spot displacements were involved in between, to obtain the deformation fields of the package specimen caused by temperature changes.

The results show interesting strain distributions in the assembly. Both the horizontal displacement component and its normal derivative are strongly related to the arrangement of the solder joints in the bonding medium between the die and the ceramic substrate. The strain components in the middle region of the package are larger than those in the side regions where the strain relaxation may exist near the stress‐free boundaries. The shear strain components show special bands of parallel lines with identical amount over the chip‐package to sustain the shearing of the packed structure under thermal loading.

The DIC technique shows to be a useful tool for the thermal strain analysis of the electronic packaging devices. Not only provides it the whole field deformation of the assembly, but also maintains the surface pictures of the package without covering any fringes, which is important to compare the deformation field with the specimen surface to reveal the stain distribution related to the failure prediction of the materials.

The purpose of this paper is to provide a comprehensive review of a non-contact full-field optical measurement technique known as digital image correlation (DIC).

The approach of this review paper is to introduce the research pertaining to DIC. It comprehensively covers crucial facets including its principles, historical development, core challenges, current research status and practical applications. Additionally, it delves into unresolved issues and outlines future research objectives.

The findings of this review encompass essential aspects of DIC, including core issues like the subpixel registration algorithm, camera calibration, measurement of surface deformation in 3D complex structures and applications in ultra-high-temperature settings. Additionally, the review presents the prevailing strategies for addressing these challenges, the most recent advancements in DIC applications across quasi-static, dynamic, ultra-high-temperature, large-scale and micro-scale engineering domains, along with key directions for future research endeavors.

This review holds a substantial value as it furnishes a comprehensive and in-depth introduction to DIC, while also spotlighting its prospective applications.

3D printing is gaining attention in the medical sector for the development of customized solutions for a wide range of applications such as temporary external implants. The materials used for the manufacturing process are critical, as they must provide biocompatibility and adequate mechanical properties. This study aims to evaluate and model the influence of the printing parameters on the mechanical properties of two biocompatible materials.

In this study, the mechanical properties of 3D-printed specimens of two biocompatible materials (ABS medical and PLActive) were evaluated. The influence of several printing parameters (infill density, raster angle and layer height) was studied and modelled on three response variables: ultimate tensile strength, deformation at the ultimate tensile strength and Young’s modulus. Therefore, statistical models were developed to predict the mechanical responses based on the selected printing parameters.

The used methodology allowed obtaining compact models that show good fit, particularly, for both the ultimate tensile strength and Young’s modulus. Regarding the deformation at ultimate tensile strength, this output was found to be influenced by more factors and interactions, resulting in a slightly less precise model. In addition, the influence of the printing parameters was discussed in the work.

The presented paper proposed the use of statistical models to select the printing parameters (infill density, raster angle and layer height) to optimize the mechanical response of external medical aids. The models will help users, researchers and firms to develop optimized solutions that can reduce material costs and printing time but guaranteeing the mechanical response of the parts.

This work aims to identify the linear elastic orthotropic material paramters of Pinus pinaster Ait. wood, using full-field measurements and an inverse identification strategy based on the finite element (FE) method updating technique.

Compression tests are carried out under uniaxial and quasi-static loading conditions on wood specimens oriented on the radial-tangential (RT) plane, with different grain orientations. Full-field displacements and strains are measured using digital image correlation (DIC), which are then used as a reference in the identification procedure. A FE model is implemented assuming plane stress conditions, where wood is modelled as an orthotropic homogeneous material. Based on the numerical results, a synthetic image reconstruction scheme is implemented to synthetically deform the reference experimental image, which is then processed by DIC and further compared to the experimental results.

The results for both approaches were similar when both specimen configurations were used in a single run. However, when using the DIC-based FEMU approach with the on-axis configuration, the identified modulus of elasticity in the tangential direction and shear modulus are closer to the reference values.

This approach ensures a fair comparison between both sets of data since the full-field strain maps are obtained through the same filter and therefore have the same strain formulation, spatial resolution and data filtering. Firstly, the identification is performed using a single configuration, either the on-axis or the off-axis specimen. Secondly, the identification is carried out by merging data from both on-axis and off-axis configurations.

The determination of mode-I fracture toughness of brittle structural materials by means of the notched Brazilian disc configuration is studied. Advantage is taken of a recently introduced analytical solution and, also, of data provided by an experimental protocol with notched marble specimens under diametral compression using the loading device suggested by International Society for Rock Mechanics (ISRM) and also the three-dimensional digital image correlation (3D-DIC) technique.

The analytical solution highlighted the role of geometrical factors, like, for example, the width of the notch, which are usually disregarded. The data of the experimental protocol were comparatively considered with those concerning the response of the specific material under uniaxial tensile load.

This combined study provided interesting data concerning some open issues, as it is the exact crack initiation point and the level of the critical load causing crack initiation. It was definitely indicated that the crack initiation point is not a priori known (even for notched specimens) and, also, that the maximum recorded load does not correspond by default to the critical load responsible for the onset of catastrophic macroscopic fracture.

It was suggested that the load considered critical one for the determination of mode-I fracture toughness K_IC is erroneous. At a load equal to about 70% of the maximum one, a process zone is formed (zone of non-reversible phenomena) around the notch's crown, designating termination of the validity of any linear elastic solution used to determine the normalized stress intensity factors (SIFs). Moreover, at a load level equal to about 95% of the macroscopically observed fracture load, crack propagation has already begun. Therefore, the experimental procedure must be monitored with additional equipment, providing an overview of the displacement field developed during loading.

The antique structures are part of the inheritance that our elders left, being important to preserve their memories. It is important to preserve, rehabilitate and restore the historic buildings protecting the cultural patrimony, attending to the actual comfort and habitability requirements. It is necessary to study the behaviour of the various elements that compose antique structures (masonry and wood) in order to develop assessment measures according to the characteristics of the original materials. The paper aims to discuss these issues.

An experimental campaign to characterize the mechanical behaviour of the wood of the roof of the “sequeiro” of “Quinta Lobeira de Cima”, a building from the twentieth century located in Minho, was carried out. The tested wood specimens are from two different species: chestnut and oak. Compression, tension and static flexion tests according to parallel to the grain direction were performed. Other parameters, such as density, moisture content and longitudinal modulus of elasticity in compression and in tension, were also obtained. The measurement of displacements was made with Digital Image Correlation (DIC).

The results of this study show the similarity between experimental and empirical values for the studied woods species.

This original study aimed at characterizing the mechanical properties using DIC of wood of the roof of the “sequeiro” of “Quinta Lobeira de Cima”, a building from the twentieth century located in Minho (Portugal). This study is part of master thesis of João Martins, an original research work.

Additive manufacturing (AM) enables the production of lightweight parts with complex shapes and small dimensions. Recent improvements in AM techniques have allowed a significant growth of AM for industrial applications. In particular, AM is suitable for the production of materials shaped in lattice, which are very attractive for their lightweight design and their multi-functional properties. AM parts are often characterised by geometrical imperfections, residual porosity, high surface roughness which typically lead to stress/strain localisations and decreasing the resistance of the structure. This paper aims to focus on the study of the effects of geometrical irregularities and stress concentrations derived from them.

In this paper, several technique were combined: 3D tomography, experimental tests, digital image correlation and finite elements (FE) models based on both the as-designed and the as-manufactured geometries of lattice materials. The Digital Image Correlation technique allowed to measure local deformations in the specimen during the experimental test. The micro-computed tomography allowed to reconstruct the as-manufactured geometries of the specimens, from which the geometrical quality of the micro-structure is evaluated to run FE analyses.

Experimental and numerical results were compared by means of a stress concentration factor. This factor was calculated in three different specimens obtained from three-different printing processes to compare and understand their mechanical properties. Considering the as-designed geometry, it is not possible to model geometrical imperfections, and a FE model based on an as-manufactured geometry is needed. The results show that the mechanical properties of the printed samples are directly related to the statistical distribution of the stress concentration factor.

In this work, several techniques were combined to study the mechanical behaviour of lattice micro-structures. Lattice materials obtained by different selective laser melting printing parameters show different mechanical behaviours. A stress concentration factor can be assumed as a measure of the quality of these mechanical properties.

This study aims to enhance the understanding of fiber-reinforced polymer (FRP) applications in partially confined concrete, with a specific focus on improving economic value and load-bearing capacity. The research addresses the need for a more comprehensive analysis of non-uniform vertical strain responses and precise stress–strain models for FRP partially confined concrete.

DIC and strain gauges were employed to gather data during axial compression tests on FRP partially confined concrete specimens. Finite element analysis using ABAQUS was utilized to model partial confinement concrete with various constraint area ratios, ranging from 0 to 1. Experimental findings and simulation results were compared to refine and validate the stress–strain model.

The experimental results revealed that specimens exhibited strain responses characterized by either hardening or softening in both vertical and horizontal directions. The finite element analysis accurately reflected the relationship between surface constraint forces and axial strains in the x, y and z axes under different constraint area ratios. A proposed stress–strain model demonstrated high predictive accuracy for FRP partially confined concrete columns.

The stress–strain curves of partially confined concrete, based on Teng's foundation model for fully confined stress–strain behavior, exhibit a high level of predictive accuracy. These findings enhance the understanding of the mechanical behavior of partially confined concrete specimens, which is crucial for designing and assessing FRP confined concrete structures.

This research introduces innovative insights into the superior convenience and efficiency of partial wrapping strategies in the rehabilitation of beam-column joints, surpassing traditional full confinement methods. The study contributes methodological innovation by refining stress–strain models specifically for partially confined concrete, addressing the limitations of existing models. The combination of experimental and simulated assessments using DIC and FEM technologies provides robust empirical evidence, advancing the understanding and optimization of FRP-concrete structure performance. This work holds significance for the broader field of concrete structure reinforcement.