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The purpose of this paper is to provide a comprehensive review of a non-contact full-field optical measurement technique known as digital image correlation (DIC).

The approach of this review paper is to introduce the research pertaining to DIC. It comprehensively covers crucial facets including its principles, historical development, core challenges, current research status and practical applications. Additionally, it delves into unresolved issues and outlines future research objectives.

The findings of this review encompass essential aspects of DIC, including core issues like the subpixel registration algorithm, camera calibration, measurement of surface deformation in 3D complex structures and applications in ultra-high-temperature settings. Additionally, the review presents the prevailing strategies for addressing these challenges, the most recent advancements in DIC applications across quasi-static, dynamic, ultra-high-temperature, large-scale and micro-scale engineering domains, along with key directions for future research endeavors.

This review holds a substantial value as it furnishes a comprehensive and in-depth introduction to DIC, while also spotlighting its prospective applications.

The purpose of the work is to provide a comprehensive review of the digital image correlation (DIC) technique for those who are interested in performing the DIC technique in the area of manufacturing.

No methodology was used because the paper is a review article.

no fundings.

Herein, the historical development, main strengths and measurement setup of DIC are introduced. Subsequently, the basic principles of the DIC technique are outlined in detail. The analysis of measurement accuracy associated with experimental factors and correlation algorithms is discussed and some useful recommendations for reducing measurement errors are also offered. Then, the utilization of DIC in different manufacturing fields (e.g. cutting, welding, forming and additive manufacturing) is summarized. Finally, the current challenges and prospects of DIC in intelligent manufacturing are discussed.

This study aims to investigate the effect of speckle pattern on displacement measurements using different speckle diameters and coverage ratios.

In order to compare the coverage ratio and speckle diameter during the evaluation of the correlation of digital images (DIC) study, template speckle plates were produced on a computer numerical control (CNC) punch press with 600 punches per minute. After the speckle plates were manufactured, the speckled pattern was randomly painted on a plain white side through the manufactured template plates, and then tensile tests were performed under the same loading conditions for each sample to observe displacement variation via correlation parameters.

During the manufacturing of templates with thin plates, a punch diameter of less than 1.7 mm will cause tool failure; therefore, uniform speckle size can be assessed before operation. A higher coverage ratio resulted in more accurate and reliable results in displacement data. With smaller coverage, the facet size should be increased to achieve favorable results.

If thick template plates are selected, speckle painting cannot be done properly; therefore, template thickness shall also be assessed before operation.

For randomly distributed DIC templates, increasing coverage beyond 50% does not make sense due to difficulties in the production process in the punch press.

Evaluating DIC results via templates manufactured in a punch press with different speckle diameters and coverage ratios is a new topic in literature.

The mismatch of the thermal expansion coefficients of the materials in multiplayer structure may induce serious stress concentrations in electronic packaging. Experimental evaluation of the thermal stresses and strains in those electronic composites is becoming significantly important for optimizing design and failure prediction of the electronic devices.

Digital image correlation (DIC) technique was utilized to obtain thermal deformation filed of a BGA package. With the help of white light to illuminate the cross section of the BGA package, the gray images were taken from the rough surface of the specimen, that offer a kid of carrier pattern for the DIC processing with statistical resemblance in gray distributions. By using the algorithm of correlation computation, the DIC searched the matching spots in a pair of those images in which the spot displacements were involved in between, to obtain the deformation fields of the package specimen caused by temperature changes.

The results show interesting strain distributions in the assembly. Both the horizontal displacement component and its normal derivative are strongly related to the arrangement of the solder joints in the bonding medium between the die and the ceramic substrate. The strain components in the middle region of the package are larger than those in the side regions where the strain relaxation may exist near the stress‐free boundaries. The shear strain components show special bands of parallel lines with identical amount over the chip‐package to sustain the shearing of the packed structure under thermal loading.

The DIC technique shows to be a useful tool for the thermal strain analysis of the electronic packaging devices. Not only provides it the whole field deformation of the assembly, but also maintains the surface pictures of the package without covering any fringes, which is important to compare the deformation field with the specimen surface to reveal the stain distribution related to the failure prediction of the materials.

Part of the runway at Madeira Airport is a platform above the sea at a 60 m height, supported by a series of frames. When aircraft land on this section, a load is exerted on the structure, resulting in bending of the beams which constitute the frames. A vision-based monitoring system was devised and implemented to measure the deflection of the runway's beams when a landing occurs.

An area on the midspan of two beams, located on the area where aircraft are most likely to land, was prepared with a speckle pattern, and a camera was assembled above a column on each of the adjacent frames, enabling the computation of displacements using digital image correlation (DIC). The camera continuously acquires images of the monitored area and compares them to a reference using DIC. If a displacement is detected, a number of frames before and after this event are saved for further DIC processing.

The installed systems successfully detected several events corresponding to landings and, for each of those events, measured the deflection of the beams over time and computed displacement fields for critical images, with strain values obtained up to this point being too small to measure using the current system.

This work provides novel insights into the behaviour of a unique structure and constitutes the first use of a vision system in its structural monitoring operations. It is also a valuable development in the implementation of automated DIC monitoring systems in locations of difficult access.

This paper aims to present an adaptation of digital image correlation (DIC) to the electronics industry for reliability assessment of electronic packages. Two case studies are presented: one for warpage measurement of a micro-electro-mechanical system (MEMS) package under different temperature conditions and the other for the measurement of transient displacements on the surface of a printed circuit board (PCB) assembly under free-fall drop conditions, which is for explaining the typical camera setup requirement and comparing among different boundary conditions by fastening methods of PCB.

DIC warpage measurements on a small device, such as a MEMS package, require a special speckle pattern. A new method for the creation of speckle patterns was developed using carbon coating and aluminum evaporative deposition. To measure the transient response on the surface of a PCB during a free-fall impact event, three-dimensional (3D) DIC was integrated with synchronized stereo-high speed cameras. This approach enables the measurement of full-field displacement on the PCB surface during a free-fall impact event, contrary to the localized information that is obtained by the conventional strain gage and accelerometer method.

The authors suggest the proposed patterning method to the small-sized microelectronics packages for DIC measurements. More generally, the idea is to have a thin layer of the dark or bright color of the background and then apply the white or black colored pattern, respectively, so that the surface has high contrast. Also, to achieve a proper size of speckles, this paper does not want to expose the measuring objects to high temperatures or pressures during the sample preparation stage. Of course, it seems a complicated process to use aluminum evaporator, carbon coater and electroformed mesh. However, the authors intend to share one of the solutions to achieve a proper pattern on such small-sized electronic packages.

3D DIC technique can be successfully implemented for the measurement of micro-scale deformations in small packages (such as MEMS) and for the analysis of dynamic deformation of complex PCB.

Hybrid methods, wherefore numerical and experimental data are used to calculate a critical parameter, have been used for several years with great success in Experimental Mechanics and, in particular, in fracture mechanics. The purpose of this paper is to report on the comparison of the strain field from numerical modelling forecasts against the experimental data obtained with the digital image correlation method under Mode II loading in fatigue testing. The numerical dual boundary element method has been established in the past as a very reliable method near singular regions where stresses tend to grow abruptly. The results obtained from the strain data near the crack tip were used in Williams expansion and agree fairly well with both the numerical results and the analytical solution proposed for pure Mode II testing.

The work presented in this note is experimental. The proposed methodology is of an hybrid experimental/numerical nature in that a numerical stress intensity factor calculation hinges upon a stress field obtained with an image method.

The obtained results are an important step towards the development of a practical tool for crack behaviour prediction in fatigue dominated events.

The results also stress the necessity of improving the experimental techniques to a point where the methods can be applied in real-life solicitations outside of laboratory premises.

Although several research teams around the globe are presently working in this field, the present research topic is original and the proposed methodology has been presented initially by the research team years ago.

This paper aims to investigate the effects of build parameters and strain rate on the mechanical properties of three-dimensional (3D) printed polylactic acid (PLA) by integrating digital image correlation and desirability function analysis. The build parameters included in this paper are the infill density, build orientation and layer height. These findings provide a framework for systematic mechanical characterization of 3D-printed PLA and potential ways of choosing process parameters to maximize performance for a given design.

The Taguchi method was used to shortlist a set of 18 different combinations of build parameters and testing conditions. Accordingly, 18 specimens were 3D printed using those combinations and put through a series of uniaxial tensions tests with digital image correlation. The mechanical properties deduced for all 18 tests were then used in a desirability function analysis where the mechanical properties were optimized to determine the ideal combination of build parameters and strain rate loading conditions.

By comparing the tensile mechanical experimental properties results between Taguchi's recommended parameters and the optimal parameter found from the response table of means, the composite desirability had increased by 2.08%. The tensile mechanical properties of the PLA specimens gradually decrease with an increase in the layer height, while they increase with increasing the infill densities. On the other hand, the mechanical properties have been affected by the build orientation and the strain rate in similar increasing/decreasing trends. Additionally, the obtained optimized results suggest that changing the infill density has a notable impact on the overall result, with a contribution of 48.61%. DIC patterns on the upright samples revealed bimodal strain patterns rendering them more susceptible to failures because of printing imperfections.

These findings provide a framework for systematic mechanical characterization of 3D-printed PLA and potential ways of choosing process parameters to maximize performance for a given design.

The purpose of this paper is to develop a methodology for in situ stress intensity factor (SIF) determination that can be used for the analysis of cracked structures. The technique is based on digital image correlation (DIC) combined with an overdetermined algorithm.

The linear overdeterministic algorithm for calculating the SIF based on stress values around the crack tip is applied to a strain field obtained by DIC.

As long as the image quality is sufficiently high, a good accuracy can be obtained for the measured SIF. The crack tip can be automatically detected based on the same strain field. The use of the strain field instead of the displacement field, eliminates problems related to the rigid body motion of the analysed structure.

In future works, based on the applied techniques, the SIF of complex cracked plane stress structures can be accurately determined in real engineering applications.

The paper demonstrates application of known techniques, refined for other applications, also the use of stress field for SIF overdeterministic calculations.

The purpose of this paper is to optimise parameters of digital image analysis to investigate the deformation behaviour of woven sample and to detect the onset and variation of wrinkling that occurs due to bias‐tensioned fabric buckling.

Using models of predescribed shape, the relationship between the digitized gray scale intensities and wrinkles of the surface are analysed and conditions of specimen illumination and filtering procedures are chosen.

It is proposed to convert acquired images to binary to record the onset of buckling and to estimate critical buckling parameters of stretched woven samples. The threshold value is determined as mean value of approximated histogram of stretched specimen centre line. It is defined that profile curve and gray scale disperse presented by parameter CV can be used to obtain additional information and to compare behaviour of different samples during bias tension.

Proposed image analysis technique allows detection of the onset of buckling wave formation and evaluation of surface waviness changes in woven samples different in colour and weave type tension. However, the behaviour of fabric samples with sharp multicoloured and complicated patterns cannot be assessed by gray scale imaging.

The proposed approach can be adjusted to investigate different wrinkling problems – buckling during simple shearing or picture frame test, seam puckering, draping.