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Article
Publication date: 6 November 2023

Huda Abdullah, Norshafadzila Mohammad Naim, Kok Seng Shum, Aidil Abdul Hamid, Mohd Hafiz Dzarfan Othman, Vidhya Selvanathan, Wing Fen Yap and Seri Mastura Mustaza

Regular monitoring of bacteria, especially Escherichia coli, in wastewater is crucial to ensure the maintenance of public health. Amperometric detection proves to be a fast…

Abstract

Purpose

Regular monitoring of bacteria, especially Escherichia coli, in wastewater is crucial to ensure the maintenance of public health. Amperometric detection proves to be a fast, sensitive and economically viable solution for E. coli enumeration. This paper reported a prototype amperometric sensor based on PANI-ZnO-NiO nanocomposite thin films prepared by sol–gel method and irradiated with gamma ray. The purpose of this study is to investigate the sensor performance of PANI-ZnO-NiO nanocomposite thin films to detect E. coli in water.

Design/methodology/approach

The films were varied with different compositions of ZnO and NiO by using the formula PANI-(ZnO)1-x-(NiO)x, with x = 0.2, 0.4, 0.6 and 0.8. PANI-ZnO-NiO nanocomposite thin films were characterized by using X-ray diffraction (XRD) and atomic force microscopy (AFM) to study the crystallinity and surface morphology of the films. The sensor performance was conducted using the current–voltage (I-V) measurement by testing the films in clean water and E. coli solution.

Findings

XRD diffractograms show the peaks of ZnO (1 0 0) and NiO (1 0 2). AFM analysis shows the surface roughness, and the grain size of PANI-ZnO-NiO thin films decreases when the concentration ratios of NiO increased. I-V curves show the difference in current flow, where the current in E. coli solution is higher than the clean water.

Originality/value

PANI-(ZnO)1-x-(NiO)x nanocomposite thin film with the highest concentration of ZnO performed the highest sensitivity among the other concentrations, which can be used to indicate the presence of E. coli bacteria in water.

Details

Pigment & Resin Technology, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0369-9420

Keywords

Article
Publication date: 27 October 2023

Quang Khai Nguyen

This study aims to investigate the effect of the presence of women in top executive positions on financial reporting quality (FRQ) and the role of external audit in enhancing the…

Abstract

Purpose

This study aims to investigate the effect of the presence of women in top executive positions on financial reporting quality (FRQ) and the role of external audit in enhancing the role of women in top executive positions.

Design/methodology/approach

This study uses a sample of 644 Vietnamese-listed firms from 2010 to 2020 and applies fixed-effect and dynamic system generalized method of moments techniques for empirical models to test the related hypotheses.

Findings

First, this study found a U-shaped relationship between women on the board and FRQ as well as women on the audit committee and FRQ. Second, female CEOs are positively associated with FRQ in small firms but there is no evidence of this in large firms. Third, a female chief accountant can enhance FRQ. Finally, external audit quality can reduce the negative effect of women on the board and the audit committee on FRQ and increase the positive impact of female chief accountants on FRQ.

Practical implications

The results support all risk-averse, ethical sensitivity and glass ceiling hypotheses in different contexts. This study provides important implications for firms to enhance FRQ by nominating women in a majority of top executive positions and simultaneously using high-quality external audit services.

Originality/value

The impact of women in top executive positions on controlling FRQ in different contexts is an original contribution to gender in management literature.

Details

Journal of Accounting in Emerging Economies, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 2042-1168

Keywords

Article
Publication date: 27 August 2024

Vali Dalouji and Nasim Rahimi

The purpose of this paper is to study the correlation between the thicknesses of the C–Ni films that have been prepared by RF-magnetron sputtering on quartz substrates and their…

Abstract

Purpose

The purpose of this paper is to study the correlation between the thicknesses of the C–Ni films that have been prepared by RF-magnetron sputtering on quartz substrates and their three-dimensional (3D) micro morphology. In this work by AFM images, this paper studied stereo metric analysis of these films.

Design/methodology/approach

The C–Ni films have been prepared by RF-magnetron sputtering on quartz substrates using a mosaic target consisting of pure graphite and strips of pure nickel approximately 2 cm2 attached to the graphite race track. The field emission scanning electronic microscopy (FESEM) images were used for the morphological characterization.

Findings

The histogram peaks are zero for all samples and the histograms are almost symmetric around zero. Temperature did not have much effect on the degree of isolation, so all four diagrams have similar results. The qualitative observations through statistical parameters of the 3D surface texture revealed that the smoothest surface has been obtained for C-Ni films annealed at 500 °C (Sa, Sq, Sz and Sv have the lower values), while the most irregular topography has been found for C-Ni films annealed at 300 °C (the fractal dimension D = 2.01 ± 0.131).

Originality/value

As shown in FESEM images, the size of the particles was increased for films deposited from 300 ºC to 800ºC; however, at 1000ºC, it decreased significantly. The histogram peaks are zero for all samples and the histograms were almost symmetric around zero. Also, the largest and lowest root mean heights (Sq) belong to films at 300 °C and 500 °C. Furthermore, the more irregular surface was found at 300 °C, and the more regular surface was found at 500 °C. As the temperature was increased to 800 °C, the values of the IAPSD function increased systematically, and then the values of the IAPSD function was decreased in the fourth sample. The surface skewness of samples annealed at 1000 °C was positive which confirms the lack of dominance of cavities on their surface with the highest amount of C-Ni films at 800 °C.

Details

Soldering & Surface Mount Technology, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 4 July 2024

Hojat Jafari and Elham Ameri

The main purpose of the present study is to introduce new Schiff bases as corrosion inhibitor for carbon steel in 1 M HCl. The inhibitory activity of Schiff base was also assessed.

Abstract

Purpose

The main purpose of the present study is to introduce new Schiff bases as corrosion inhibitor for carbon steel in 1 M HCl. The inhibitory activity of Schiff base was also assessed.

Design/methodology/approach

2,2′-((1Z,1′Z)-((2,2-dimethylpropane-1,3-diyl)bis(azanylylidene))bis(methanylylidene))diphenol was synthesized and it’s performance as an inhibitor was then investigated in 1 M HCl. The inhibition of this compound was studied and evaluated by the chemical methods of electrochemical impedance spectroscopy, electrochemical potential dynamic polarization and Atomic Force microscopy (AFM) method. The thermodynamics parameters were investigated for corrosion of carbon steel in both the absence and presence of Schiff base.

Findings

The results of the tests showed that this compound has a good performance as an inhibitor and the percentage of inhibition on steel corrosion will increase with increasing concentration and it will reach 70% in the presence of 2 × 10−3 M of this inhibitor. Polarization tests indicated that this compound will act as a mixed inhibitor. Nyquist curves showed that the addition of this substance to the solution increased the charge transfer resistance and decreased the capacity of the double layer. The absorption of the new Schiff base on steel follows Langmuir adsorption isotherm, and the amount of free energy of adsorption indicates the spontaneous adsorption of this inhibitor. Using AFM investigations, the results of electrochemical methods were confirmed.

Originality/value

Incorporation of a new Schiff base into 1 M HCl is a promising approach for protecting the carbon steel against corrosive solution.

Details

Anti-Corrosion Methods and Materials, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0003-5599

Keywords

Article
Publication date: 19 February 2024

Bassem Assfour, Bassam Abdallah, Hour Krajian, Mahmoud Kakhia, Karam Masloub and Walaa Zetoune

The purpose of this study is to investigate the structural, surface roughness and corrosion properties of the zirconium oxide thin films deposited onto SS304 substrates using the…

Abstract

Purpose

The purpose of this study is to investigate the structural, surface roughness and corrosion properties of the zirconium oxide thin films deposited onto SS304 substrates using the direct current (DC) magnetron sputtering technique.

Design/methodology/approach

DC sputtering at different powers – 80, 100 and 120 W – was used to deposit ZrO2 thin films onto different substrates (Si/SS304) without annealing of the substrate. Atomic force microscope (AFM), energy-dispersive X-ray spectroscopy (EDS), Tafel extrapolation and contact angle techniques were applied to investigate the surface roughness, chemical compositions, corrosion behavior and hydrophobicity of these films.

Findings

Results showed that the thickness of the deposited film increased with power increase, while the corrosion current decreased with power increase. AFM images indicated that the surface roughness decreased with an increase in DC power. EDS analysis showed that the thin film has a stoichiometric ZrO2 (Zr:O 1:2) composition with basic uniformity. Water contact angle measurements indicated that the hydrophobicity of the synthesized films decreased with an increase in surface roughness.

Originality/value

DC magnetron sputtering technique is infrequently used to deposition thin films. The obtained thin films showed good hydrophobic and anticorrosion properties. Finally, results are compared with other deposition techniques.

Details

World Journal of Engineering, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1708-5284

Keywords

Article
Publication date: 6 June 2024

AFM Jalal Ahamed and Yam B. Limbu

Financial anxiety has become a global concern and a growing research area with significant potential to contribute to the behavioral and personal finance literature. Despite this…

Abstract

Purpose

Financial anxiety has become a global concern and a growing research area with significant potential to contribute to the behavioral and personal finance literature. Despite this, the literature is fragmented and inconsistent. Prior studies vary greatly in the breadth of definitions and measures of financial anxiety. There has been no systematic evaluation of literature on financial anxiety antecedents, consequences, and coping strategies. This systematic review fills this gap.

Design/methodology/approach

We followed the Preferred Reporting Items for Systematic Reviews and Meta-Analyses (PRISMA) guidelines. We searched Scopus and Web of Science and identified 55 eligible studies published between 2009 and 2024.

Findings

Financial anxiety is defined and measured differently in different research domains. We identified several antecedents, including socio-demographic factors (e.g. gender, age, ethnicity, income, employment, racial background, and language proficiency), personality traits, compulsive and impulsive buying behavior, depression or other mental issues, family health issues, and the COVID-19 pandemic and consequences of financial anxiety, including psychological and psychic health, societal and personal relations, financial behavior and well-being, and job-related outcomes. In addition, the literature presents six financial anxiety coping strategies (self-imposed coping mechanisms, spiritual and theological resources, increased financial capability, social and family support, seeking professional help, and language proficiency training). Several future research directions are presented.

Originality/value

This review represents the first systematic compilation and evaluation of the research findings on financial anxiety.

Details

International Journal of Bank Marketing, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0265-2323

Keywords

Article
Publication date: 11 January 2024

Liangbin Chen, Lihong Zhao, Keren Ding, Kaibo Xu and Xianzhe Tang

This study aims to optimize the preparation conditions and modify the nanofiltration (NF) membranes to prepare high-performance polysulfone/sulfonated polysulfone composite…

Abstract

Purpose

This study aims to optimize the preparation conditions and modify the nanofiltration (NF) membranes to prepare high-performance polysulfone/sulfonated polysulfone composite nanofiltration (PSF/SPSF-NF) membranes through interfacial polymerization.

Design/methodology/approach

Investigating the impacts of anhydrous piperazine (PIP) concentration, trimesoyl chloride (TMC) concentration and basement membrane type on NF membrane performance, the optimal membrane was prepared. In addition, nano-SiO2 was added to the active separation layer to modify the NF membranes.

Findings

The comprehensive performance of PSF/SPSF-NF membranes was optimized when the concentration of PIP was 0.75 Wt.% and the concentration of TMC was 0.15 Wt.%, at which time the water flux was 66.1 L·m−2·h−1 and the retention rate of Na2SO4 was 98.1%. The comprehensive performance of polysulfone/sulfonated polysulfone-SiO2 nanofiltration (PSF/SPSF-SiO2-NF) membranes was optimized when the blending ratio of nano-SiO2 to PIP was 2:3, with a pure water flux of 81.9 L·m−2·h−1 and a Na2SO4 retention rate of 95.9%. Compared to polysulfone nanofiltration (PSF-NF) membranes and PSF/SPSF-NF membranes, NF membranes with nano-SiO2 increased the flux recovery rate by 22.9% and 8.7%.

Practical implications

PSF/SPSF-SiO2-NF membrane exhibits excellent antifouling properties.

Originality/value

There is currently no literature available on the preparation of NF membranes using polysulfone/sulfonated polysulfone (PSF/SPFS) as a substrate. This provides a method for modifying NF membranes, starting with the modification of the basement membrane and then modifying the active separation layer.

Details

Pigment & Resin Technology, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0369-9420

Keywords

Article
Publication date: 9 July 2024

Yidong Zhang

The purpose of this study is to adjust the electronic transport performance of zinc oxide–silicon dioxide (ZnO-SiO2) film by the construction of a grain boundary barrier.

Abstract

Purpose

The purpose of this study is to adjust the electronic transport performance of zinc oxide–silicon dioxide (ZnO-SiO2) film by the construction of a grain boundary barrier.

Design/methodology/approach

ZnO-SiO2 thin films were prepared on glass substrates by a simple sol-gel method. The crystal structure of ZnO and ZnO-SiO2 powders were tested by X-ray diffraction with copper (Cu) Kα radiation. The absorption spectra of ZnO and ZnO-SiO2 films were recorded by a ultraviolet-visible spectrophotometer. The micro electrical transport performance of ZnO-SiO2 thin films were investigated by conductive atomic force microscope and electrostatic force microscope.

Findings

The results show that the current of ZnO-SiO2 film decrease, indicating that the mobility of ZnO-SiO2 film is greatly decreased, owing to the formation of the grain boundary barrier between ZnO and SiO2. The phase variation of ZnO-SiO2 film increases due to the electron accumulation at grain boundaries.

Originality/value

ZnO and ZnO-5SiO2 thin films prepared on glass substrates by a simple sol-gel method were first studied by CAFM and EFM. The band gaps of ZnO and ZnO-5SiO2 is ∼3.05 eV and 3.15 eV, respectively. The barrier height of ZnO-5SiO2 film increased by ∼0.015 eV after introducing SiO2. The phase variation intensity increased to a certain extent after doping SiO2, due to the increased GB barrier. ZnO-5SiO2 film will be a promising ETL candidate in the application of QLEDs field.

Details

Microelectronics International, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 9 January 2024

Love Kumar and Rajiv Kumar Sharma

In the context of promoting sustainable development in SMEs, the present study aims to investigate the relationship among solution dimensions based on the Industry 4.0 (I4.0…

Abstract

Purpose

In the context of promoting sustainable development in SMEs, the present study aims to investigate the relationship among solution dimensions based on the Industry 4.0 (I4.0) concept.

Design/methodology/approach

The study employs a comprehensive methodology that includes a systematic literature review, workshop, grounded theory and interpretive structural modeling. Various dimensions concerning I4.0 sustainability are tested and evaluated using a questionnaire design followed by hypothesis formulation. Further, grounded theory is used to extract the key solution dimensions that capture the essence of I4.0 implementation in SMEs. Finally, the solution dimensions for I4.0 sustainability are modeled using the ISM approach to understand the structural interdependencies among them, and Matrice d'Impacts Croisés Multiplication Applied to a Classification (MICMAC) analysis is done to understand the driving and dependence power among these dimensions.

Findings

The study identified 14 solution dimensions for the implementation of I4.0 in SMEs for sustainable development. Out of the 14 solution dimensions, human resource training programs (D4) appear at level 11, followed by top management commitment (D1), strategic collaborations (D3) and coordination among key stakeholders (D5) at level 2 in the hierarchical interpretive structural modeling (ISM) model. Also, these dimensions have an effect size of more than 0.50 which indicates a substantial correlation between the sustainability dimensions and Industry 4.0 implementation in SMEs.

Originality/value

The study contributes to the overall goal of fostering sustainability within the SME sector, which can pave the way for various stakeholders for the successful implementation of I4.0 sustainable solution dimensions.

Details

Kybernetes, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0368-492X

Keywords

Article
Publication date: 2 May 2024

Yan Pan, Taiyu Jin, Xiaohui Peng, Pengli Zhu and Kyung W. Paik

The purpose of this paper was to investigate how variations in the geometry of silicon chips and the presence of surface defects affect their static bending properties. By…

Abstract

Purpose

The purpose of this paper was to investigate how variations in the geometry of silicon chips and the presence of surface defects affect their static bending properties. By comparing the bending radius and strength across differently sized and treated chips, the study sought to understand the underlying mechanics that contribute to the flexibility of silicon-based electronic devices. This understanding is crucial for the development of advanced, robust and adaptable electronic systems that can withstand the rigors of manufacturing and everyday use.

Design/methodology/approach

This study explores the impact of silicon chip geometry and surface defects on flexibility through a multifaceted experimental approach. The methodology included preparing silicon chips of three distinct dimensions and subjecting them to thinning processes to achieve a uniform thickness verified via scanning electron microscopy (SEM). Finite element method (FEM) simulations and a series of four-point bending tests were used to analyze the bending flexibility theoretically and experimentally. The approach was comprehensive, examining both the intrinsic geometric factors and the extrinsic influence of surface defects induced by manufacturing processes.

Findings

The findings revealed a significant deviation between the theoretical predictions from FEM simulations and the experimental outcomes from the four-point bending tests. Rectangular-shaped chips demonstrated superior flexibility, with smaller dimensions leading to an increased bending strength. Surface defects, identified as critical factors affecting flexibility, were analyzed through SEM and atomic force microscopy, showing that etching processes could reduce defect density and enhance flexibility. Notably, the study concluded that surface defects have a more pronounced impact on silicon chip flexibility than geometric factors, challenging initial assumptions and highlighting the need for defect minimization in chip manufacturing.

Originality/value

This research contributes valuable insights into the design and fabrication of flexible electronic devices, emphasizing the significant role of surface defects over geometric considerations in determining silicon chip flexibility. The originality of the work lies in its holistic approach to dissecting the factors influencing silicon chip flexibility, combining theoretical simulations with practical bending tests and surface defect analysis. The findings underscore the importance of optimizing manufacturing processes to reduce surface defects, thereby paving the way for the creation of more durable and flexible electronic devices for future technologies.

Details

Soldering & Surface Mount Technology, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0954-0911

Keywords

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