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The purpose of this paper is to investigate the influence of In additions on the wetting properties of the Sn2.86Ag0.40Cu (in wt%) eutectic‐based alloys, on a copper substrate, in the presence of a flux. The main goal was to find correlations between the results of the wetting balance (WB) and the sessile drop (SD) method, in relation to the contact angles.

The WB method was applied for the wetting measurements, at 250°C, in an air atmosphere and in the presence of a flux. The SD measurements were conducted at the same temperature, in the presence of the same flux, but in an Ar atmosphere, while the maximum bubble pressure (MBP) and dilatometric measurements were conducted in an Ar+H₂ atmosphere. The density data from the dilatometric method were used for the determination of the surface tension by means of MBP, and the WB method was used to determine the surface and interfacial tension. Next, the surface tension data from these two methods were compared. The WB data were used to calculate the contact angles and the obtained indirect data were compared with the results of the direct SD measurements of the contact angle.

A higher In content in the alloy resulted in a lower contact angle on the copper, and the WB results agreed well with the results of the SD experiments. It was confirmed that, in liquid In‐Sn and the alloys containing In and Sn (Ag‐In‐Sn, Sn‐Ag‐Cu‐In, Sn‐Zn‐In), the improvement of the wettability was indicated only by the increase of the contact angle with the increasing In content.

Further studies are necessary for the confirmation of practical application, but they should be directed to the soldering of high indium alloys on printed circuit boards, with different finishes and qualities of the solder joint performance.

Taking into account the contact angle data from the WB and SD methods, the best results of the SAC‐In alloy on copper were obtained for the alloy of the highest In content. It was found that the contact angles from SD after 4 s were higher (non‐equilibrium conditions) than the values calculated from WB after 3 s. In contrast, the contact angles from SD after 10 min (equilibrium conditions) were lower than those from WB after 3 s. The comparison suggests that the contact angles from WB are situated within the data from SD, showing the same lowering tendency with the increasing content of In, and they may be well accepted for practical purposes. On the other hand, the sample of the solder in the SD method, after a prolonged time – in order to get the equilibrium contact angle – may be used to study the interfacial phenomena with the Cu substrate. The differential thermal analysis results indicate that the melting temperature decreases with increasing tin concentration. Taking into account the results of this study and the available literature data, alloys containing 8‐10 wt% of In can be recommended for practical application.

The WB and SD methods were used for the contact angle determination of a wide range of solder compositions, in the same temperature and flux conditions. Also, the surface tensions for these alloys were determined with the use of two independent methods: the MBP and the WB methods. The results obtained made it possible to draw conclusions regarding the correlation between the output of different methods and the conditions in which a comparison of the results can be made. It is supposed that these observations apply to many other alloy systems.

This research aims to provide a theoretical method and data supports for a future study on interfacial reaction mechanism and spreading mechanism between molten solder and V-shaped substrate, which also gives guidance for those complicated welding operation objects in brazing technique.

Wetting experiments were performed to measure the contact angles at different temperatures of molten Sn-3.0Ag-0.5Cu wetting on the quartz substrate with an included angle of 90°. According to the experimental results, the theoretical spreading morphology of molten solder on V-shaped substrate at corresponding temperature was simulated by Surface Evolver.

The theoretical morphology profiles of the molten solder sitting on the V-shaped substrate are simulated using Surface Evolver when the molten solder reaches spreading equilibrium. The spreading mechanisms as well as the impact of surface tension and gravity on interfacial energy of the molten solder wetting on the V-shaped groove substrate are also discussed where theoretical results agree well with experiment results. The contact area between the gas and liquid phases shows a tendency of first increasing and later decreasing. Otherwise, the spreading distance and the height of the molten solder increases as the droplet volume increases as the included angle and the contact angle are given as constants, and both the interfacial energy and the gravitational energy increase as well. This research has a wide influence on predicting the outcomes in commercial impact and also gives guidance for those complicated welding operation objects in brazing technique.

It is of very important significance in both science and practice to investigate the differences between the flat surface and V-shaped surface. Some necessary parameters including intrinsic contact angle and surface tension need to be directly measured when the droplet spreads on the flat surface. The relevant simulation conclusions on the inherent characteristics can be given based on these intrinsic parameters. Compared with the flat surface, the V-shaped substrate is chosen for further discuss on the effects of gravity on the droplet spreading behavior and the changes of apparent contact angle which can only occurs as the substrate is inclined. Therefore, this research provides theoretical method and data supports for a future study on interfacial reaction mechanism and spreading mechanism between molten solder and substrate.

The research is developed for verifying the accuracy of the model built in Surface Evolver. Based on this verified model, other researches on the spreading distance along y-axis and the contact area that are especially difficult to be experimentally measured can be directly simulated by Surface Evolver, which can provides a convenient method to discuss the changes of horizontal spreading distance, droplet height and contact area with increasing the included angle of V-shaped substrate or with increasing the droplet volume. Actually, the modeling results are calculated for supplying the theoretical parameters and technical guidance in the welding process.

This research provides theoretical method and data supports for a future study on interfacial reaction mechanism and spreading mechanism between molten solder and substrate, which has a wide influence on prediction the outcomes in commercial impact and also gives guidance for those complicated welding operation objects in brazing technique.

Surface Evolver, can also be used to discuss the structure and spreading mechanism of droplets on V-shaped substrates, which have not been discussed before.

Peel adhesion of an epoxy filleting compound and Parylene C conformal coating to plasma treated, solder mask coated substrates and the apparent contact angle of water on the treated surfaces were evaluated. No significant improvement was achieved in the case of the epoxy filleting adhesive for most solder mask coatings studied. On the other hand, Parylene C peel adhesion significantly increased after substrates were treated with air plasma and reached the level of Silane coupling agent primed substrates. This was in contrast to the decrease in Parylene adhesion to argon plasma treated substrates in comparison with the non‐treated substrates. This was related to the oxygen functionalities created on the surfaces by the air plasma versus the ablative nature of the argon plasma. No clear correlation was found between peel strength and the water contact angle in the case of the epoxy adhesive, while for the Parylene conformal coating peel strength achieved its maximum value at the middle of the contact angle range which resulted from the pretreatments applied in this study. It is concluded that air plasma is a very efficient solder mask pretreatment for Parylene conformal coating that can replace Silane primer. Also, if a calibration curve is established for each solder mask‐adhesive and solder mask‐coating system, the apparent water contact angle can serve as a convenient quality control tool for printed circuit finishing processes.

This paper aims to investigate spontaneous movement of single droplet on chemically heterogeneous surfaces induced by the net surface tension, using the improved three-dimensional (3D) lattice Boltzmann (LB) method.

D3Q19 Shan-Chen LB model is improved in this paper. Segmented particle distribution functions coupled with the P-R equation of state are introduced to maintain the higher accuracy and greater stability. In addition, exact difference method (EDM) is adopted to implement force term to predict the droplet deformation and dynamics.

The numerical results demonstrate that spontaneous movement of single droplet (=1.8 µm) along wedge-shaped tracks is driven by net surface tension. Advancing angle decreases instantaneously with time, while receding angle changes slightly first and then decreases rapidly. Wetting length is affected by vertex angle and wetting difference, whereas the final value is only dependent on the stronger wettability. Although the velocity of single droplet on wedge-shaped tracks can be increased by the larger vertex angle, it has a negative influence on the displacement. For the same wetting difference, vertex angle equal to 30º is an optimization strategy in this model. If the simulation length is extended enough, then the smaller vertex angle is beneficial for the droplet movement. In addition, a larger wetting difference is beneficial to spontaneous movement, which can speed up the droplet movement.

The proposed numerical model of droplet dynamics on chemically heterogeneous surfaces provides fundamental insights for the enhancement of drop-wise condensation heat transfer.

The surface energy of the printing material can be increased to desired levels with different chemicals or methods. However, the important thing is that the surface properties of printing material are not affected negatively. In this way the aim of this paper provide that the surface properties of matte and glossy coated paper is improved by the argon containing atmospheric pressure plasma device because the plasma treatment method does not occur surface damaging on the papers.

In experimental studies, test samples cut from 160 mm × 30 mm in size from 115 g/m² gloss- and matt-coated papers were used. The plasma treatments of paper samples were carried out with an argon containing atmospheric pressure plasma device of laboratory scale that produces plasma of the corona discharge type at radio frequency. The optimized plasma parameters were at a frequency of 20 kHz and plasma power 200 W. A copper electrode of length 12 cm and diameter 2.5 mm was placed in the centre of the nozzle.

Research findings showed that the surface energies of the papers increased with the increase in plasma application time. While the contact angle of the untreated glossy paper is 82.2, 8 second plasma applied G3 sample showed 54 contact angle value. Similarly, the contact angle of the base paper of matt coated is 91.1, while M3 is reduced to 60.4 contact angles by the increasing plasma time.

Plasma treatment has shown that no chemical coating is needed to increase the wettability of the paper surface by reducing the contact angle between the paper and the water droplet. In addition, the surface energies of all papers treated by argon gas containing atmospheric pressure plasma, increased. Plasma treatment provides to improve both the wettability of the paper and the adhesion property required for the ink, with an environmentally friendly approach.

The purpose of this study is to establish a thermal contact conductance model of rough surfaces with inclination based on three-dimensional fractal theory.

The effects of contact load, inclination angle, fractal dimensional and fractal roughness on thermal contact conductance of rough surfaces were studied using numerical simulation.

The results show that the thermal contact conductance of the rough surface increases with the increase of contact load and fractal dimension and decreases with the increase of fractal roughness and inclination angle. The inclination angle of the rough surface has an important influence on the thermal contact conductance of the rough, and it is a factor that cannot be ignored in the study of the thermal contact conductance of rough surfaces.

A thermal contact conductance model of rough surfaces with inclination based on three-dimensional fractal theory was established in this study. The achievements of this study provide some theoretical basis for the investigation of the thermal contact conductance of rough surfaces.

This research work aims to determine the maximum load a thermoplastic gear can withstand without the occurrence of extended contact. The extended contact of polymer gears is usually overlooked in basic design calculations, although it considerably affects the gear's load-carrying ability. Although various researchers highlighted the phenomenon, an extensive investigation of the extended contact behaviour is limited. Hence the work aims to investigate the premature and extended contact behaviour of thermoplastic gears and its effect in the gear kinematics, bending stiffness, stresses induced and the roll angle subtended by the gear pair.

The work uses finite element method to perform quasi-static two-dimensional analysis of the meshing gear teeth. The FE model was developed in AutoCAD and analysed using ANSYS 19.1 simulation package. A three-dimensional gear model with all the teeth is computationally intensive for solving a static analysis problem. Hence, planar analysis with a reduced number of teeth is considered to reduce the computational time and difficulty.

The roll angle subtended at the centre by the path of approach is higher than the path of recess because of the increased load sharing. The contact stress profile followed a unique R-F-R-F pattern in the premature and extended contact regions due to the driven tip-driver flank surface contact. A non-dimensional parameter was formulated correlating the young's modulus, the load applied and deflection induced that can be utilised to predict the occurrence of premature and extended contact in thermoplastic gears.

The gear rating standards for polymer gears are formulated from the conventional metal gears which does not include the effect of gear tooth deflection. The work attempts to explain the gear tooth deflection for various standard thermoplastics and its effect in kinematics. Likewise, a new dimensionless number was introduced to predict the extended contact that will help in appropriate selection of load reducing the possibility of wear.

The surface characteristics of wood such as surface roughness, surface free energy (SFE) and wettability are important properties influencing further manufacturing processes such as gluing and coating. The purpose of this study is to determine the influence of surface roughness of ten tropical woods on their SFE, wettability and bonding quality for water-based acrylic and solvent-based alkyd varnishes.

The woods tested in this study were fast-growing teak, afrika, sungkai, mindi, merbau, durian, lamtoro, pulai, acacia and kempas. Wood surfaces were prepared in unsanded and sanded using an abrasive paper of 120 grits. SFE values were calculated based on the Rabel method. Wettability values were measured based on the contact angle between varnish liquids and wood surfaces using the sessile drop method, and the S/G model was used to evaluate the wettability of the varnishes on the woods surface. The bonding quality of the varnishes was measured using a cross-cut test based on the ASTM 3359-02 standard.

The results show that unsanded kempas wood had the roughest surface with a Ra value of 16.24 µm, whereas sanded lamtoro wood has the smoothest surface with a Ra value of 6.86 µm. The unsanded afrika wood had the highest SFE value of 53.61 mJ/m², whereas sanded fast-growing teak had the lowest SFE value of 36.17 mJ/m². Sanded merbau woods had the lowest K value of 0.022 for the water-based acrylic varnish, whereas unsanded afrika wood had the highest K value of 9.253 for the alkyd varnish. Afrika wood with the highest K values (highest wettability) for both acrylic and alkyd varnishes produced the highest bonding quality (grade 4-5). Compared to the water-based acrylic varnish, the solvent-based alkyd varnish was more wettable and generated better bonding quality.

Improving the quality of fast-growing wood from plantation by painting could be considered to increase their use for higher value wood products.

Compared to water-based acrylic varnish, solvent-based alkyd varnish was more wettable and generated better bonding quality.

The originality of this research is to evaluate the values of surface free energy. SFE could be used to quantitatively determined the wettability of paints liquid in the surface of wood

Therefore, the purpose of this study is to understand the relationships between the processing parameters and the geometric form of the produced single tracks, in order to control dimensional quality in future experimentations. The quality of the deposited single track and layer is of prime importance in the selective laser melting (SLM) process, as it affects the product quality in terms of dimensional precision and product performance.

In this paper, a vertical milling machining center equipped with an Ytterbium-fiber laser was used in the SLM experimentation to form single cobalt-chromium-molybdenum (CoCrMo) tracks. The different geometric features and the influence of the scanning parameters on these morphologic characteristics were studied statistically by means of ANOVA.

Evidently, track height (h1) inaccuracy reduced in layer thicknesses between 100 and 200 μm. The re-melt depth (h2) was determined by the energy parameters, with laser power of 325-350 W and scanning speed (SS) of 66.6-83.3 mm/s being the most favorable parameters to obtain the required anchoring. Moreover, a contact angle of 117° was proposed as optimal, as it permitted an adequate overlapping region and a full densification, and, finally, an SS of 50 mm/s and a layer thickness of 250 were suggested for its development.

The comprehension of the phenomena inherent to the process is related to the single track geometrical characteristics, which allow the definition of an optimal value for each factor for a further proposal of processing conditions that can finally derive a higher precision, wetting, density and mechanical properties.

This paper aims to discuss the effect of surface treatment on the wettability between copper and a lead-free solder paste. The industrial applications of laser technologies are increasing constantly. A specific laser treatment can modify the surface energy of copper and affect the wetting properties.

The surfaces of copper plates were treated using an Nd:YAG laser with varying laser powers. After laser surface treatment, wetting experiments were performed between the copper plates and SAC305 lead-free solder paste. The effect of laser treatment on copper surface was analysed using optical microscopy and scanning electron microscopy (SEM).

The experimental results showed that the wetting contact angles changed with the variation in laser power. Furthermore, it means that the surface energy of copper plates was changed by the laser treatment. The results demonstrated that the contact angles also changed when a different soldering paste was used.

Previous laser surface treatment can be a possible way to optimize the wettability between solders and substrates and to increase the quality of the soldered joints.