Search results

The purpose of this paper is to focus on through‐silicon via (TSV), with a new concept that every chip or interposer could have two surfaces with circuits. Emphasis is placed on the 3D IC integration, especially the interposer (both active and passive) technologies and their roadmaps. The origin of 3D integration is also briefly presented.

This design addresses the electronic packaging of 3D IC integration with a passive TSV interposer for high‐power, high‐performance, high pin‐count, ultra fine‐pitch, small real‐estate, and low‐cost applications. To achieve this, the design uses chip‐to‐chip interconnections through a passive TSV interposer in a 3D IC integration system‐in‐package (SiP) format with excellent thermal management.

A generic, low‐cost and thermal‐enhanced 3D IC integration SiP with a passive interposer has been proposed for high‐performance applications. Also, the origin of 3D integration and the overview and outlook of 3D Si integration and 3D IC integration have been presented and discussed. Some important results and recommendations are summarized: the TSV/redistribution layer (RDL)/integrated passive devices passive interposer, which supports the high‐power chips on top and low‐power chips at its bottom, is the gut and workhorse of the current 3D IC integration design; with the passive interposer, it is not necessary to “dig” holes on the active chips. In fact, try to avoid making TSVs in the active chips; the passive interposer provides flexible coupling for whatever chips are available and/or necessary, and enhances the functionality and possibly the routings (shorter); with the passive interposer, the TSV manufacturing cost is lower because the requirement of TSV manufacturing yield is too high (>99.99 percent) for the active chips to bear additional costs due to TSV manufacturing yield loss; with the passive interposer, wafer thinning and thin‐wafer handling costs (for the interposer) are lower because these are not needed for the active chips and thus adds no cost due to yield loss; with the current designs, all the chips are bare; the packaging cost for individual chips is eliminated; more than 90 percent of heat from the 3D IC integration SiP is dissipated from the backside of high‐power chips using a thermal interface material and heat spreader/sink; the appearance and footprint of current 3D IC integration SiP designs are very attractive to integrated device manufactures, original equipment manufactures, and electronics manufacturing services (EMS) because they are standard packages; and underfills between the copper‐filled TSV interposer and the high‐ and low‐power chips are recommended to reduce creep damage of the lead‐free microbump solder joints and prolong their lives.

The paper's findings will be very useful to the electronic industry.

The paper aims to deal with the benefits and challenges of 3D integration of electronics and mechanics as well as the special requirements in designing a system.

Three‐dimensional integration technology has been enabled by innovations in thermoplastic printed circuit board (PCB) materials and novel system integration. Furthermore, the integration of electronics and mechanics helps manage product creation, as design phases must be integrated and teamwork well organized. A multidisciplinary approach is another must in marketing technology, because any decision to incorporate an integrative technology in a product must be based on an understanding of the many forms of expertise involved in creating a product.

With a unique copper pattern for each 3D shape, inconvenient distortions can be controlled, as dedicated copper patterns enable designers to make efficient use of formable multilayer structures and advance an extra step in freedom of design. Findings are based on a working demonstrator.

Even if 3D multilayer design now lacks dedicated tools, software is likely to evolve to include all necessary functions.

Forming a multilayer PCB enables designers to free their imagination and to take advantage of numerous possibilities, including even futuristic shapes.

Three‐dimensional integration offers great potential for product design, although by definition and in terms of production technology 3D integration is an incremental change.

This paper aims to explore the dynamic evolution of the integration of three-dimensional (3D) technologies into special libraries. This analysis examines the difficulties and advantages that emerge from this significant shift and emphasises the possibilities for improving research, education and preservation in these specific environments.

This study uses a comprehensive approach, synthesising existing literature and case studies to gain insights into the adoption of 3D technology in special libraries. It also explores the synergy between 3D technology and artificial intelligence (AI) within library services.

This research uncovers a dynamic landscape in special libraries, marked by a growing embrace of 3D technology. Specialised industries and organisations increasingly use this technology to enrich their services, from crafting physical models for in-depth research to safeguarding precious artifacts through digital replication. Challenges include the need for specialised expertise, financial constraints and limitations in access. Notably, the integration of AI enhances user experiences by streamlining search and discovery.

This study adds value to the field by shedding light on the transformative potential of 3D technology and AI in special libraries. It underscores the significance of strategic planning, collaboration, staff training and tailored needs assessments to ensure successful technology integration. This paper’s originality lies in its exploration of emerging trends and the outlook for technology-driven innovation and collaborative endeavours shaping the future of special libraries.

We have succeeded in capturing porcine 3D surface anatomy in vivo by developing a high‐resolution stereo imaging system. The system achieved accurate 3D shape recovery by matching stereo pair images containing only natural surface textures at high (image) resolution. The 3D imaging system presented for pig shape capture is based on photogrammetry and comprises: stereo pair image acquisition, stereo camera calibration and stereo matching and surface and texture integration. Practical issues have been addressed, and in particular the integration of multiple range images into a single 3D surface. Robust image segmentation successfully isolated the pigs within the stereo images and was employed in conjunction with depth discontinuity detection to facilitate the integration process. The capture and processing chain is detailed here and the resulting 3D pig anatomy obtained using the system presented.

The purpose of this paper is to propose new 3D light emitting diodes (LED) and integrated circuits (IC) integration packages.

These packages consist of the multi‐LEDs and active IC chip such as the application specific IC, LED driver, processor, memory, radio frequency, sensor, or power controller in a 3D manner. The assembly processes of these packages are also presented and discussed.

The advantages of these 3D integration packages are found to be: better performance, lower cost, less footprint, lighter package, and smaller form factor.

A thermal management system for 3D IC and LEDs integration packages is proposed.

Building information modeling (BIM) is a striking development in the architecture, engineering and construction (AEC) industry, which provides in-depth information on different stages of the building lifecycle. Real estate valuation, as a fully interconnected field with the AEC industry, can benefit from 3D technical achievements in BIM technologies. Some studies have attempted to use BIM for real estate valuation procedures. However, there is still a limited understanding of appropriate mechanisms to utilize BIM for valuation purposes and the consequent impact that BIM can have on decreasing the existing uncertainties in the valuation methods. Therefore, the paper aims to analyze the literature on BIM for real estate valuation practices.

This paper presents a systematic review to analyze existing utilizations of BIM for real estate valuation practices, discovers the challenges, limitations and gaps of the current applications and presents potential domains for future investigations. Research was conducted on the Web of Science, Scopus and Google Scholar databases to find relevant references that could contribute to the study. A total of 52 publications including journal papers, conference papers and proceedings, book chapters and PhD and master's theses were identified and thoroughly reviewed. There was no limitation on the starting date of research, but the end date was May 2022.

Four domains of application have been identified: (1) developing machine learning-based valuation models using the variables that could directly be captured through BIM and industry foundation classes (IFC) data instances of building objects and their attributes; (2) evaluating the capacity of 3D factors extractable from BIM and 3D GIS in increasing the accuracy of existing valuation models; (3) employing BIM for accurate estimation of components of cost approach-based valuation practices; and (4) extraction of useful visual features for real estate valuation from BIM representations instead of 2D images through deep learning and computer vision.

This paper contributes to research efforts on utilization of 3D modeling in real estate valuation practices. In this regard, this paper presents a broad overview of the current applications of BIM for valuation procedures and provides potential ways forward for future investigations.

This study aims to evaluate the enhancement in prosthetic supply chain capabilities resulting from the implementation of additive manufacturing (AM) technologies. The study presents an emerging model outlining the key areas that undergo changes when integrating 3D printing technologies into the prosthetic supply chain.

Employing a qualitative approach, data were collected through field observations and 31 in-depth interviews conducted within various Jordanian organizations associated with the prosthetic industry and 3D printing technologies.

The findings suggest that the adoption of 3D printing technologies improves the prosthetic supply chain’s capabilities in terms of customization, responsiveness, innovation, environmental sustainability, cost minimization and patient empowerment. The study sheds light on the specific areas affected in the prosthetic supply chain following the adoption of 3D printing technologies, emphasizing the overall improvement in supply chain capabilities within the prosthetic industry.

This study provides recommendations for governmental bodies and prosthetic organizations to maximize the benefits derived from the use of 3D printing technologies.

This study contributes as the first of its kind in exploring the impact of 3D printing technology adoption in the Jordanian prosthetic industry, elucidating the effects on the supply chain and identifying challenges for decision-makers in an emerging market context.

Bumpless Cu/SiO₂ hybrid bonding, which this paper aims to, is a key technology of three-dimensional (3D) high-density integration to promote the integrated circuits industry’s continuous development, which achieves the stacks of chips vertically connected via through-silicon via. Surface-activated bonding (SAB) and thermal-compression bonding (TCB) are used, but both have some shortcomings. The SAB method is overdemanding in the bonding environment, and the TCB method requires a high temperature to remove copper oxide from surfaces, which increases the thermal budget and grossly damages the fine-pitch device.

In this review, methods to prevent and remove copper oxidation in the whole bonding process for a lower bonding temperature, such as wet treatment, plasma surface activation, nanotwinned copper and the metal passivation layer, are investigated.

The cooperative bonding method combining wet treatment and plasma activation shows outstanding technological superiority without the high cost and additional necessity of copper passivation in manufacture. Cu/SiO₂ hybrid bonding has great potential to effectively enhance the integration density in future 3D packaging for artificial intelligence, the internet of things and other high-density chips.

To achieve heterogeneous bonding at a lower temperature, the SAB method, chemical treatment and the plasma-assisted bonding method (based on TCB) are used, and surface-enhanced measurements such as nanotwinned copper and the metal passivation layer are also applied to prevent surface copper oxide.

The purpose of this paper is to describe the technical features, underlying concepts and implementation details of a novel Building Information Modeling (BIM)-integrated, graph-based platform developed to support BIM for facilities management through a usability driven visual representation of the construction operations building information exchange (COBie) spreadsheet data.

This paper is based on the iterative steps of design thinking and agile software development methodology. The conceptual development of the VisualCOBie platform is based on Gestalt’s principles of visual perception to facilitate usability and comprehension of the COBie data.

The paper demonstrates that Gestalt’s principles of visual perception provide a suitable conceptual as well as implementable basis for improving the usability and comprehension of COBie spreadsheets. The implemented BIM-integrated, graph-based VisualCOBie platform supports visual navigation and dynamic search, reducing the cognitive load of large spreadsheets that are common in facilities management software.

The usability, visual search and dependencies-based search of VisualCOBie can potentially transform how we implement and use facilities and information management systems in construction, where large spreadsheets are frequently used in conjunction with BIM and other tools. VisualCOBie also provides usability-based step towards BIM for facilities management.

The VisualCOBie approach provides a novel user interface and information management platform. This paper may also foster a potential paradigm shift in our approach to the representation and use of information exchange standards such as COBie, which are required to facilitate the research and practice on BIM for facilities management.

The purpose of this paper is to fabricate a new Cu-Sn-Ni-Cu interconnection microstructure for electromigration studies in 3D integration.

The Cu-Sn-Ni-Cu interconnection microstructure is fabricated by a three-mask photolithography process with different electroplating processes. This microstructure consists of pads and conductive lines as the bottom layer, Cu-Sn-Ni-Cu pillars with the diameter of 10-40 μm as the middle layer and Cu conductive lines as the top layer. A lift-off process is adopted for the bottom layer. The Cu-Sn-Ni-Cu pillars are fabricated by photolithography with sequential electroplating processes. To fabricate the top layer, a sputtered Cu layer is introduced to prevent the middle-layer photoresist from being developed. With the final Cu electroplating processes, the Cu-Sn-Ni-Cu interconnection microstructure is successfully achieved.

The surface morphology of Cu-Sn pillars consists of densely packed clusters which are formed by an ordered arrangement of tetragonal Sn grains. The diffusion of Cu atoms into the Sn phases is observed at the Cu/Sn interface. Furthermore, the obtained Cu-Sn-Ni-Cu pillars have a flat surface with an average roughness of 13.9 nm. In addition, the introduction of Ni layer between the Sn and the top Cu layers in the Cu-Sn-Ni-Cu pillars can mitigate the diffusion of Cu atoms into Sn phases. The process is verified by checking the electrical performance using four-point probe measurements.

The method described in this paper which combined a three-mask photolithography process with sequential Cu, Sn, Ni and Cu electroplating processes provides a new way to fabricate the interconnection microstructure for future electromigration studies.