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3D LED and IC wafer level packaging

John Lau (Industrial Technology Research Institute, Hsinchu, Taiwan, Republic of China)
Ricky Lee (Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong)
Matthew Yuen (Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong)
Philip Chan (Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong)

Microelectronics International

ISSN: 1356-5362

Article publication date: 11 May 2010

1323

Abstract

Purpose

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The purpose of this paper is to propose new 3D light emitting diodes (LED) and integrated circuits (IC) integration packages.

Design/methodology/approach

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These packages consist of the multi‐LEDs and active IC chip such as the application specific IC, LED driver, processor, memory, radio frequency, sensor, or power controller in a 3D manner. The assembly processes of these packages are also presented and discussed.

Findings

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The advantages of these 3D integration packages are found to be: better performance, lower cost, less footprint, lighter package, and smaller form factor.

Originality/value

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A thermal management system for 3D IC and LEDs integration packages is proposed.

Keywords

Citation

Lau, J., Lee, R., Yuen, M. and Chan, P. (2010), "3D LED and IC wafer level packaging", Microelectronics International, Vol. 27 No. 2, pp. 98-105. https://doi.org/10.1108/13565361011034786

Publisher

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Emerald Group Publishing Limited

Copyright © 2010, Emerald Group Publishing Limited

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