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Thermal flow sensors with a wide dynamic range are at present not available in spite of the large demand which exists for such sensors in practical fluid flow measurements. In this paper, it is shown that the velocity range of a “time‐of‐flight” thermal flowmeter for slowly changing flows can be increased by using wires (or other heating/sensing elements) with large thermal inertia (time constant) and heating the sending wire with a continuous sinusoidal current, instead of discrete, very short, square‐wave pulses as in the usual pulsed‐wire anemometer. The device described here uses two parallel wires of 12.5μm diameter and its usable speed range is 0.05 to 25m/s. Although the present thermal flowmeter can be applied as a point measurement device, the main applications are in pipe flow, especially at very low flow rates. The high sensitivity at low flow rates makes the device especially suitable for this purpose.

The purpose of this paper is to prepare procedures for determination of characteristics and parameters of DC cables on the basis of transient and steady thermal field distribution in their cross-sections.

Steady-state current rating was computed iteratively, with the use of steady thermal field distribution in the cable. The iterative process was regulated with respect to this field by changes of the mean surface temperature of the sheath of the cable. It was also controlled with respect to the unknown current rating by deviations of the temperature of the core from the maximum sustained temperature of the insulation (material zone) adjacent to the core. Heating curves were determined (in arbitrarily selected points of the cross-section of the cable) by a parallel algorithm described thoroughly in the first part of the paper. The algorithm was used for computing of transient thermal field distribution throughout the whole cross-section. Thermal time constant distributions were determined by the trapezium rule, where the upper integration limit of respective thermal field distributions was being changed.

Using the methods prepared the following characteristics/parameters of the cable were determined: steady-state current rating, spatial-time heating curves, mean thermal time constant distribution. The results were verified and turned to be in conformance with those of the IEC 287 Standard and a commercial software – Nisa v. 16. Speedup and efficiency of the parallel computations were calculated. It was concluded that the parallel computations took less time than the sequential ones.

The specialized algorithms and software are dedicated to cylindrical DC cables.

The knowledge of the determined characteristics and parameters contributes to optimal exploitation of a DC cable during its use.

The algorithms of determination of the steady-state current rating and thermal time constant are original. The software described in the appendix has also been made by the authors.

The main goal of the work is to show how the kind of substrate and heat sink of integrated circuit or system influences the thermal dynamics of the circuit or system. The investigation leads to the solution of an unsteady state thermal model with analytic method and determination of the thermal time constants of various active and passive substrates and heat sinks. The results show that cheaper materials without any losses of thermal dynamics can replace expensive substrates and heat sinks. Theoretical procedure carried out step by step presents the way of unsteady state temperature computation with analytic method. It can be helpful for determination of the temperature of the chip during unsteady state in any point of the chip, average temperature and thermal time constant of the substrate.

To prevent the coil from burning or getting damaged, it is necessary to estimate the duration of its operation as long as its temperature does not exceed the permissible limit. This paper aims to investigate the effect of switching on the thermal behavior of impregnated and nonimpregnated windings. Also, the safe operating time for each winding is determined.

The power loss of the winding is expressed as a function of the winding specifications. Using homogenization techniques, the equivalent thermal properties for the homogenized winding are calculated and used in a proposed thermal equivalent circuit for winding modeling and analysis. The validity and accuracy of the proposed model are determined by comparing its analysis results and simulation and measurement results.

The results show that copper windings have better thermal behavior and lower temperature compared to aluminum windings. On the other hand, by impregnating or increasing the packing factor of the winding, the thermal behavior is improved. Also, by choosing the right duty cycle for the winding current source, it is possible to prevent the burning or damage of the winding and increase its lifespan. Comparing the measurement results with the analysis results shows that the proposed equivalent circuit has an error of less than 4% in the calculation of the winding center temperature.

In this paper, the effect of temperature on the electrical resistance of the coil is ignored. Also, rectangular wires were not investigated. Research in these topics are considered as future work.

By calculating the thermal time constant of the winding, its safe operation time can be calculated so that its temperature does not exceed the tolerable value (150 °C). The proposed method analyzes both impregnated and nonimpregnated windings with various schemes. It investigates the effects of switching on their thermal behavior. Additionally, it determines the safe operating time for each type of winding.

The thermal management of electrical insulations poses a challenge in electrical devices as electrical insulators are also thermal insulators. Diamond is the best solid electrical insulator and thermal conductor. This can lead to a paradigm change for electrical machine winding and lamination insulation design and thermal management. The paper introduces these techniques and discusses its effect for the design of electrical machines and its potential consequences for electromagnetic analysis, for example, in multi-physics modelling. The diamond winding insulation is patent-pending, but the diamond enriched lamination insulation is published for the benefit of the scientific community.

The windings of electrical machines are insulated to avoid contact between the coil and other conductive components, for example, the stator core. The principle of using mica tape and resin impregnation has not changed for a century and is well established to produce main insulation on a complex conductor shape and size. These insulations have poor heat-conducting properties. Similarly, the insulation of laminated steel sheets comprising the stator and rotor restrict heat flow. Diamond-based insulation provides a new path. Increased thermal conductivity means reduced temperature rise and the reduced thermal time constants in multi-physics simulations and system analysis.

The largest benefit of a diamond-based core insulation is in electrical machines in which the losses are conducted axially to the coolant. These are machines with radial ducts and effective cooling in the end regions. The main benefit will be in reducing the number of radial ducts that positively affect the size, production costs and the copper losses of the machine. The increased thermal conductivity of the diamond insulation system will reduce the thermal constants noticeably. These will affect system behavior and the corresponding simulation methods.

Diamond insulation can lead to a paradigm change for electrical machine winding and lamination insulation design and thermal management. It might also lead to new modeling requirements in system analysis.

The purpose of this paper is to present a method of solving a thermal conduction equation in three‐zone axially‐symmetrical systems.

In the method developed, the field functions are determined in the analytical way by the superposition of states and separation of variables method. The coefficients of the field functions and eigenvalues of the boundary‐initial problem are computed by the numerical method. The coefficients are the solution to the corresponding sets of equations. These sets are the result of scalar products of non‐orthogonal functions at the respective zones of the cable. The eigenvalues are determined by an algorithm, which uses the field properties and elements of the golden cut method.

The method made it possible to develop a mathematical model of the dynamics of the thermal field in a polymer DC cable. This model has good physical interpretation. The paper also presents the field distributions determined in an analytical form. Some arguments of the expressions derived are however computed numerically. The results obtained by the paper's method and by the finite elements methods were compared. The relative differences are less than 6 per cent.

The method concerns axially‐symmetrical three‐zone systems under nominal conditions.

By means of the method important parameters of DC lines can be determined (e.g. spatial‐temporal heat‐up curves, admissible sustained currents, time constants).

An analytical‐numerical method of analysis of the thermal field in a three‐zone axially‐symmetrical system was developed. Its original element is the algorithm of determination of eigenvalues of the boundary‐initial problem and coefficients of non‐orthogonal field functions.

Thermal issues are becoming increasingly serious with the scaling down of integrated circuits and the increasing density brought in by advanced packaging techniques. Consequently, thermal issues need to be considered during both design and test. The present paper addresses thermal testing, and more specifically thermal transient testing.

Previous studies on special dielectrics for multilayer screen printing led to defining a new concept for standard alumina substrate. The modification of the process and structure permits an increase of the thermal conductivity. The thermal conductivity of this new material is between that of alumina and BeO. It is possible to increase the thermal conductivity of 94% standard alumina (used in chip‐carriers) up to 3·6 times. It it known that the thermal conductivity of beryllia is 7 times higher than that of alumina. The thermal model gives an increase of 4 times for other configurations non‐tested in this study. With this material, the other characteristics such as thermal expansion, adhesion of the conductors, etc., scarcely change. The ‘percolation’ effect of the physical properties can usually be found with the addition of another material inside the matrix. In this particular case, the material is not submitted to the percolation law. Different configurations of metallic insert alumina with beryllia are compared by a simulation programme. The main applications are in the field of electronic packaging such as chip‐carriers with higher thermal dissipation and substrates for power devices. Since the process used to produce this new material is based on standard operations well known by alumina manufacturers, the cost is potentially much lower than for BeO.

The purpose of this paper is to present the results of thermal analysis of cermet resistors made on alumina or LTCC substrate and polymer thick-film resistors embedded in FR-4 substrate.

The study was performed using a thermal imaging method. The research was carried out with an additional consideration of such factors as sheet resistance (which depended on the type of resistive paste), the size and topology of element and the kind of contact material (Cu, Ag or Ni/Au). A few key points on the element were specified for which a more thorough analysis was carried out. The results were approximated by physically acceptable function which allowed to determine the influence of different mechanisms of heat transfer and determine their time and thermal constants.

The effectiveness of heat dissipation from resistor is determined by the type of substrate material, width of conductive paths, and contact material. The best results were observed for elements with wider conductive paths made of Cu or Ni/Au. The LTCC substrate ensures the fastest achieving of stable temperature on the component. The changes of the temperature gradient in time can be described by a formula consisting of two or three exponent parts, each one presenting different mechanism of change.

These studies do not include more detailed determination of nature of found mechanisms of change. There has not also been established what form of the formula is more accurate physically description of the results for respective structure.

The results provide important data of the thermal properties of the chosen materials. This allows to determine their usability for specific applications where heat distribution plays an important role. The used analysis method is proven to provide reliable results and can be considered to be used for further studies in that subject.

One of the key components of the micro-sensors is MEMS micro-hotplate. The purpose of this paper is to introduce a platinum micro-hotplate with the proper geometry using the analytical model based on the heat transfer analysis to improve both heating efficiency and time constant.

This analytical model exhibits that suitable design for the micro-hotplate can be obtained by the appropriate selection of square heater (LH) and tether width (WTe). Based on this model and requirements of routine sample loading, the size of LH and WTe are chosen 200 and 15 μm, respectively. In addition, a simple micro-fabrication process is adopted to form the suspended micro-heater using bulk micromachining technology.

The experimental results show that the heating efficiency and heating and cooling time constants are 21.27 K/mW and 2.5 ms and 2.1 ms, respectively, for the temperature variation from 300 to 400 K in the fabricated micro-hotplates which are in closed agreement with the results obtained from the analytical model with errors within 5 per cent.

Our design based on the analytical model achieves a combination of fast time constant and high heating efficiency that are comparable or superior to the previously published platinum micro-hotplate.