Thermal Transient Testing

V. Székely (Department of Electron Devices, Technical University of Budapest, Hungary)
M. Rencz (Department of Electron Devices, Technical University of Budapest, Hungary)
B. Courtois (TIMA, Grenoble, France)

Microelectronics International

ISSN: 1356-5362

Publication date: 1 August 1997

Abstract

Thermal issues are becoming increasingly serious with the scaling down of integrated circuits and the increasing density brought in by advanced packaging techniques. Consequently, thermal issues need to be considered during both design and test. The present paper addresses thermal testing, and more specifically thermal transient testing.

Keywords

Citation

Székely, V., Rencz, M. and Courtois, B. (1997), "Thermal Transient Testing", Microelectronics International, Vol. 14 No. 2, pp. 8-10. https://doi.org/10.1108/13565369710800529

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Publisher

:

MCB UP Ltd

Copyright © 1997, MCB UP Limited

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