Thermal Transient Testing
V. Székely
(Department of Electron Devices, Technical University of Budapest, Hungary)
M. Rencz
(Department of Electron Devices, Technical University of Budapest, Hungary)
B. Courtois
(TIMA, Grenoble, France)
348
Abstract
Thermal issues are becoming increasingly serious with the scaling down of integrated circuits and the increasing density brought in by advanced packaging techniques. Consequently, thermal issues need to be considered during both design and test. The present paper addresses thermal testing, and more specifically thermal transient testing.
Keywords
Citation
Székely, V., Rencz, M. and Courtois, B. (1997), "Thermal Transient Testing", Microelectronics International, Vol. 14 No. 2, pp. 8-10. https://doi.org/10.1108/13565369710800529
Publisher
:MCB UP Ltd
Copyright © 1997, MCB UP Limited