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The usage of additive manufacturing (AM) technology in industries has reached up to 50 per cent as prototype or end-product. However, for AM products to be directly used as final products, AM product should be produced through advanced quality control process, which has a capability to be able to prove and reach their desire repeatability, reproducibility, reliability and preciseness. Therefore, there is a need to review quality-related research in terms of AM technology and guide AM industry in the future direction of AM development.

This paper overviews research progress regarding the QC in AM technology. The focus of the study is on manufacturing quality issues and needs that are to be developed and optimized, and further suggests ideas and directions toward the quality improvement for future AM technology. This paper is organized as follows. Section 2 starts by conducting a comprehensive review of the literature studies on progress of quality control, issues and challenges regarding quality improvement in seven different AM techniques. Next, Section 3 provides classification of the research findings, and lastly, Section 4 discusses the challenges and future trends.

This paper presents a review on quality control in seven different techniques in AM technology and provides detailed discussions in each quality process stage. Most of the AM techniques have a trend using in-situ sensors and cameras to acquire process data for real-time monitoring and quality analysis. Procedures such as extrusion-based processes (EBP) have further advanced in data analytics and predictive algorithms-based research regarding mechanical properties and optimal printing parameters. Moreover, compared to others, the material jetting progresses technique has advanced in a system integrated with closed-feedback loop, machine vision and image processing to minimize quality issues during printing process.

This paper is limited to reviewing of only seven techniques of AM technology, which includes photopolymer vat processes, material jetting processes, binder jetting processes, extrusion-based processes, powder bed fusion processes, directed energy deposition processes and sheet lamination processes. This paper would impact on the improvement of quality control in AM industries such as industrial, automotive, medical, aerospace and military production.

Additive manufacturing technology, in terms of quality control has yet to be reviewed.

This work aims to investigate the interaction effects of printing process parameters of acrylonitrile butadiene styrene (ABS) parts fabricated by fused deposition modeling (FDM) technology on both the dimensional accuracy and the compressive yield stress. Another purpose is to determine the optimum process parameters to achieve the maximum compressive yield stress and dimensional accuracy at the same time.

The standard cylindrical specimens which produced from ABS by using an FDM 3D printer were measured dimensions and tested compressive yield stresses. The effects of six process parameters on the dimensional accuracy and compressive yield stress were investigated by separating the printing orientations into horizontal and vertical orientations before controlling five factors: nozzle temperature, bed temperature, number of shells, layer height and printing speed. After that, the optimum process parameters were determined to accomplish the maximum compressive yield stress and dimensional accuracy simultaneously.

The maximum compressive properties were achieved when layer height, printing speed and number of shells were maintained at the lowest possible values. The bed temperature should be maintained 109°C and 120°C above the glass transition temperature for horizontal and vertical orientations, respectively.

The optimum process parameters should result in better FDM parts with the higher dimensional accuracy and compressive yield stress, as well as minimal post-processing and finishing techniques.

The important process parameters were prioritized as follows: printing orientation, layer height, printing speed, nozzle temperature and bed temperature. However, the number of shells was insignificant to the compressive property and dimensional accuracy. Nozzle temperature, bed temperature and number of shells were three significant process parameters effects on the dimensional accuracy, while layer height, printing speed and nozzle temperature were three important process parameters influencing compressive yield stress. The specimen fabricated in horizontal orientation supported higher compressive yield stress with wide processing ranges of nozzle and bed temperatures comparing to the vertical orientation with limited ranges.

The purpose of this paper is to present a detailed overview of the current stencil printing process for microelectronic packaging.

This paper gives a thorough review of stencil printing for electronic packaging including the current state of the art.

This article explains the different stencil technologies and printing materials. It then examines the various factors that determine the outcome of a successful printing process, including printing parameters, materials, apparatus and squeegees. Relevant technical innovations in the art of stencil printing for microelectronics packaging are examined as each part of the printing process is explained.

Stencil printing is currently the cheapest and highest throughput technique to create the mechanical and electrically conductive connections between substrates, bare die, packaged chips and discrete components. As a result, this process is used extensively in the electronic packaging industry and therefore such a review paper should be of interest to a large selection of the electronics interconnect and assembly community.

This paper aims to establish the predictive equations of height, area and volume of printed solder paste during solder paste stencil printing (SPSP) process in surface mount technology (SMT) to better understand the effect of process parameters on the printing quality.

An experiment plan is proposed based on the response surface method (RSM). Experiments with 30 different combinations of process parameters are performed using a solder paste printer. After printing, the volume, area and height of the printed SAC105 solder paste are measured by a solder paste inspection machine. Using RSM, the predictive equations associated with the printing parameters and the printing quality of the solder paste are formed.

The optimal printing parameters are 175.08 N printing pressure, 250 mm/s printing speed, 0.1 mm snap-off height and 15.7 mm/s stencil snap-off speed if the target height of solder paste is 100 µm. As the target printing area of solder paste is 1.1 mm × 1.3 mm, the optimized values of the printing parameters are 140.29 N, 100.52 mm/s, 0.63 mm and 20.25 mm/s. When both the target printing height and area are optimized together, the optimal values for the four parameters are 86.67 N, 225.76 mm/s, 0.15 mm and 1.82 mm/s.

A simple RSM-based experimental method is proposed to formulate the predictive polynomial equations for height, area and volume of printed solder paste in terms of important SPSP parameters. The predictive equation model can be applied to the actual SPSP process, allowing engineers to quickly predict the best printing parameters during parameter setting to improve production efficiency and quality.

The purpose of this paper is to describe, review, classify and analyze the current challenges in three-dimensional printing processes for combined electrochemical and microfluidic fabrication areas, which include printing devices and sensors in specified areas.

A systematic review of the literature focusing on existing challenges is carried out. Focused toward sensors and devices in electrochemical and microfluidic areas, the challenges are oriented for a discussion exploring the suitability of printing varied geometries in an accurate manner. Classifications on challenges are based on four key categories such as process, material, size and application as the printer designs are mostly based on these parameters.

A key three-dimensional printing process methodologies have their unique advantages compared to conventional printing methods, still having the challenges to be addressed, in terms of parameters such as cost, performance, speed, quality, accuracy and resolution. Three-dimensional printing is yet to be applied for consumer usable products, which will boost the manufacturing sector. To be specific, the resolution of printing in desktop printers needs improvement. Printing scientific products are halted with prototyping stages. Challenges in three-dimensional printing sensors and devices have to be addressed by forming integrated processes.

The research is underway to define an integrated process-based on three-dimensional Printing. The detailed technical details are not shared for scientific output. The literature is focused to define the challenges.

The research can provide ideas to business on innovative designs. Research studies have scope for improvement ideas.

Review is focused on to have an integrated three-dimensional printer combining processes. This is a cost-oriented approach saving much of space reducing complexity.

To date, no other publication reviews the varied three-dimensional printing challenges by classifying according to process, material, size and application aspects. Study on resolution based data is performed and analyzed for improvements. Addressing the challenges will be the solution to identify an integrated process methodology with a cost-effective approach for printing macro/micro/nano objects and devices.

The purpose of this paper is provide a broad view for the standardization efforts of color quality evaluation of color 3D printing techniques. Further, this review paper demonstrates the processes and color properties of most color 3D printing techniques with specific devices and applications to extend the range of possible memberships of standardization group.

Six color 3D printing techniques including plastic-based, paper-based, powder-based, organism-based, food-based and metal-based color 3D printing have been introduced and illustrated with colorization principles and forming features in detail. Moreover, for printed 3D color objects, literature about color measurement, color specification and color reproduction are described and analyzed, respectively.

Four color 3D printing techniques including plastic-based, paper-based, powder-based and food-based color 3D printing show great affinity toward standardization of color quality evaluation, while their colorization principles indicate that it is difficult with a single standard frame. It is possible to develop a completed color quality evaluation standard for color 3D printing based on approaches in color 2D printing when color measurement method and devices are standardized together.

The paper provides an important guide focusing on the efforts to standardize the colorization processes and color quality evaluation of the color 3D printing techniques.

This research aims to study the stencil printing process of the quad flat package (QFP) component with a pin pitch of 0.4 mm. After the optimization of the printing process, the desired inspection specification is determined to reduce the expected total process loss.

Static Taguchi parametric design is applied while considering the noise factors possibly affecting the printing quality in the production environment. The Taguchi quality loss function model is then proposed to evaluate the two types of inspection strategies.

The optimal parameter-level treatment for the solder paste printing process includes a squeegee pressure of 11 kg, a stencil snap-off of 0.14 mm, a cleaning frequency of the stencil once per printing and using an air gun after stencil wiping. The optimal upper and lower specification limits are 119.8 µm and 110.3 µm, respectively.

Noise factors in the production environment are considered to determine the optimal printing process. For specific components, the specification is established as a basis for subsequent processes or reworks.

The purpose of this paper is to investigate and minimize the printing-related defects in the surface mount assembly (SMA) process.

This paper uses an experimental approach to explore process parameter and printing defects during the SMA process. Increasing printing performance, various practices of solder paste (Ag3.0/Cu0.5/Sn) storage and handling are suggested. Lopsided paste problem is studied by varying squeegee pressure and the results are presented. Unfilled pads problems are observed for ball grid array (BGA) and quad flat package (QFP) which is mitigated by proper force tuning. In this paper, a comparative study is conducted which evaluates the manifestation of printing offset due to low-grade stencil. The input/output (I/O) boards were oxidized when the relative humidity was maintained beyond 70 per cent for more than 8 h. This pad oxidation problem is overcome by proper printed circuit board (PCB) handling procedures. When the unoptimized line is used, the paste wedged in the stencil and influences the performance of the screen printer, for this reason, an optimized line is proposed that minimize the printing defects.

The key findings are as follows: in the SMA process, printing quality is directly associated with solder paste quality. Experimentally, it is observed that a considerable variance in solder deposition occurred when the front and rear squeegee have different configurations. High-grade and unsoiled stencil results in superior paste deposition and less distinction. Insufficient solder paste and bridge problems also occur in printing when PCB pads are oxidized. Optimized line resolves solder paste clog issues, associated with stencil’s aperture. The cooling arrangement on the conveyor, after reflow, explicates hot jig problem. Control environmental conditions minimized static charges and printing defects.

The preceding studies emphasis mostly on the squeegee pressure, while other important parameters are not completely investigated. Moreover, it is very imperative to concurrently measure all parameters while varying the environmental conditions. This study highlights and provides an experimental approach to various PCB printing defects, and a comparative study has been conducted that concurrently measure all process parameters.

The purpose of this study is to produce a low-cost sheet metal forming mold made from the low melting point Bi58Sn42 (bismuth) alloy by using an open-source desktop-type material extrusion additive manufacturing system and to evaluate the performance of the additively manufactured mold for low volume sheet metal forming. Thus, it was aimed to develop a fast and inexpensive die tooling methodology for low-volume batch production.

Initially, the three-dimensional printing experiments were performed to produce the sheet metal forming mold. The encountered problems during the performed three-dimensional printing experiments were analyzed. Accordingly, both tunings in process parameters (extrusion temperature, extrusion multiplier, printing speed, infill percentage, etc.) and customizations on the extruder head of the available material extrusion additive manufacturing system were made to print the Bi58Sn42 alloy properly. Subsequently, the performance of the additively manufactured mold was evaluated according to the dimensional change that occurred on it during the performed pressing operations.

Results showed that the additively manufactured mold was rigid enough and proved to have sufficient strength in sheet metal forming operations for low-volume production.

Alternative mold production was carried out using open-source material extrusion system for low volume sheet metal part production. Thus, cost effective solution was presented for agile manufacturing.

This paper aims to detect the printing failures (such as warpage and collapse) in material extrusion (MEX) process effectively and timely to reduce the waste of printing time, energy and material.

The approach is designed based on the frequently observed fact that printing failures are accompanied by abnormal material phenomena occurring close to the nozzle. To effectively and timely capture the phenomena near the nozzle, a camera is delicately installed on a typical MEX printer. Then, aided by the captured phenomena (images), a smart printing failure predictor is built based on the artificial neural network (ANN). Finally, based on the predictor, the printing failures, as well as their types, can be effectively detected from the images captured by the camera in real-time.

Experiments show that printing failures can be detected timely with an accuracy of more than 98% on average. Comparisons in methodology demonstrate that this approach has advantages in real-time printing failure detection in MEX.

A novel real-time approach for failure detection is proposed based on ANN. The following characteristics make the approach have a great potential to be implemented easily and widely: (1) the scheme designed to capture the phenomena near the nozzle is simple, low-cost, and effective; and (2) the predictor can be conveniently extended to detect more types of failures by using more abnormal material phenomena that are occurring close to the nozzle.