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A review of stencil printing for microelectronic packaging

Robert Kay (MicroSystems Engineering Centre (MISEC), Heriot‐Watt University, Edinburgh, UK)
Marc Desmulliez (School of Engineering & Physical Sciences, Heriot‐Watt University, Edinburgh, UK)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 3 February 2012



The purpose of this paper is to present a detailed overview of the current stencil printing process for microelectronic packaging.


This paper gives a thorough review of stencil printing for electronic packaging including the current state of the art.


This article explains the different stencil technologies and printing materials. It then examines the various factors that determine the outcome of a successful printing process, including printing parameters, materials, apparatus and squeegees. Relevant technical innovations in the art of stencil printing for microelectronics packaging are examined as each part of the printing process is explained.


Stencil printing is currently the cheapest and highest throughput technique to create the mechanical and electrically conductive connections between substrates, bare die, packaged chips and discrete components. As a result, this process is used extensively in the electronic packaging industry and therefore such a review paper should be of interest to a large selection of the electronics interconnect and assembly community.



Kay, R. and Desmulliez, M. (2012), "A review of stencil printing for microelectronic packaging", Soldering & Surface Mount Technology, Vol. 24 No. 1, pp. 38-50.



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Copyright © 2012, Emerald Group Publishing Limited