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This paper aims to investigate the influence of post-curing temperature, post-curing time and gamma ray irradiation dose upon the tensile and compressive mechanical properties of the medical graded vat photopolymerization parts.

Medical graded vat photopolymerization specimens, made from photopolymer resin, were fabricated using bottom-up vat photopolymerization machine. Tensile and compressive tests were conducted to assess the mechanical properties. The specimens were categorized into uncured and post-curing groups. Temperature post-processing and/or gamma irradiation exposure were for post-curing specimens. The post-curing parameters considered included temperature levels of 50°C, 60°C and 70°C, with 1, 2, 3 and 4 h periods. For the gamma irradiation, the exposure doses were 25, 50, 75 and 100 kGy.

Post-curing improved the mechanical properties of medical graded vat photopolymerization parts for both tensile and compressive specimens. Post-curing temperature greater than 50°C or a prolonged post-curing period of more than 1 h made insignificant changes or deterioration in mechanical properties. The optimal post-curing condition was therefore a 50°C post-curing temperature with 1 h post-curing time. Exposure to gamma ray improved the compressive mechanical properties, but deteriorated tensile mechanical properties. Higher gamma irradiation doses could decrease the mechanical properties and also make the part more brittle, especially for doses more than 25 kGy.

The obtained results would be beneficial to the medical device manufacturer who fabricated the invasive temporary contact personalized surgical instruments by vat photopolymerization technique. In addition, it also raised awareness in excessive gamma sterilization in the medical graded vat photopolymerization parts.

During post-processing of stereolithography photopolymers, the limited penetration depth of ultraviolet (UV) light can lead to inhomogeneous cross-linking. This is a major problem in part design for industrial applications as this creates uncertainty regarding the mechanical load capacity. Therefore, this paper aims to present an experimental method to measure the post-curing depth in stereolithography photopolymers.

Printed specimens made from urethane acrylate photopolymers are placed in a protective housing and are exposed on one side to UV light during post-processing. A depth profile of the hardness according to ASTM D2240 Shore D is determined alongside the specimens. UVA,-B and -C spectra are investigated and the dependence on exposure dose and pigmentation is studied. The results are directly linked to the mechanical properties via tensile tests and validated on an automotive trim part.

Exposure with a 405 nm light-emitting diode provides the deepest homogenous post-curing depth of 10.5 mm, which depends on the overall exposure dose and pigmentation. If the initially transparent photopolymer is colored with black pigments, post-curing depth is significantly reduced and no homogenous post-curing can be achieved. To obtain comparable mechanical properties by tensile tests, complete cross-linking of the specimen cross-section has to be ensured.

The spatial resolution of the presented measurement method depends on the indenter size and sample hardness. As a result, the resolution of the used setup is limited in the area close to the edges of the specimen.

This paper shows that the spatially resolved hardness measurement provides more information on the post-curing influence than the evaluation of global mechanical properties. The presented method can be used to ensure homogenous cross-linking of stereolithography parts.

The purpose of the study is to evaluate the suitability of post-fire curing for normal and Recycled Aggregate Concretes (RAC) with and without fibres.

The study includes the testing of RAC specimens, i.e. 150 mm cubes and cylinders with 300 mm length and 150 mm diameter with hybrid fibres (0.15% polypropylene fibres + 0.35% steel fibres) along with fly ash. The specimens were exposed to elevated temperatures between 400 to 700°C with 100°C intervals for 2 h of duration and the post-fire exposed samples were further subjected to water curing for a period of 7 days. The compressive strength, split tensile strength and Rebound Hammer Number (RHN) were measured at room temperature, after exposure to elevated temperatures and post-fire curing.

The result shows that the compressive strength reduces by a maximum of 61.25% for 700°C and maximum retain in strength, i.e. 71.2% (in comparison to specimens kept at room temperature) is observed for 600°C post-fire cured specimens. The split tensile strength reduces by more than half for 500°C and above temperatures, whereas 400°C specimens exhibits a significant regain in strength after post-fire curing. To validate the results of compressive strength, the Rebound Hammer test has been conducted. The RHN value decreases by 41.3% for 700°C specimens and the effectiveness of post-fire curing is observed to be considerable up to 500°C.

The conclusions from the study can be used in assessing the extent of damage and to check the suitability of post-fire curing in further continuing the utilisation of a fire damaged structure.

Utilisation of secondary materials like recycled aggregates and fly ash can be made in the production of concrete.

Specimens with fibres performed better when compared to specimens without fibres and post-fire curing is found to be effective up to 500°C.

Rapid prototypes formed using stereolithography (SL) method have to undergo post‐curing to increase their strength and rigidity. This study attempts to reduce, if not eliminate, post‐cure distortion by characterising curing behaviours. Curing (both heat and UV initiated) characteristics of an acrylic‐based photopolymer under actual fabrication conditions were studied using Raman spectroscopy as well as differential scanning calorimetry (DSC) and differential scanning photo‐calorimetry (DSP). Specimens of single photopolymer lines were created using a SL machine. Raman spectroscopy was used to quantify the curing percentage at different areas on the cross‐section of these lines. Curing percentages before and after post‐curing were also obtained from the experiments. Difference in percentage of post‐curing gave an indication of the distortions faced. It was found that uncured and partially cured resins trapped within the photopolymer resulted in inhomogeneity of curing in the specimens causing shrinkage and distortion.

3D printing techniques have been widely used for manufacturing complex parts for various dental applications. For achieving suitable mechanical strength, post-cure processing is necessary, where the relative time duration and temperature specification also needs to be defined. The purpose of this study/paper is to assess the effects of post curing conditions and mechanical properties of 3D printed clear dental aligners

Dental long-term clear resin material has been used for 3D printing of dental aligners using a Formlabs 3D printer for direct usage on patients. Post-curing conditions have been varied, all of which have been subjected to mechanical compression loading of 1,000 N to evaluate the curing effects on the mechanical strength of the aligners.

The experimental studies provide significant insight into both temperatures and time durations that could provide sufficient compressive mechanical strength to the 3D printed clear dental aligners. It was observed that uncured aligners deformed plastically with large deformations under the loading conditions, whereas aligners cured between 400°C–800°C for 15–20 min deformed elastically before fragmenting into pieces after safely sustaining higher compressive loads between 495 N and 666 N. The compressive modulus ratio for cured aligners ranged between 4.46 and 5.90 as compared to uncured aligners. For shorter cure time durations and lower temperature conditions, an appropriate elevated compressive strength was also achieved.

Based on initial assessments by dental surgeons, suitable customised clear aligners can be designed, printed and cured to the desired levels based on patient’s requirements. This could result in time, energy and unit production cost savings, which ultimately would help to alleviate the financial burden placed on both the health service and their patients.

Polymeric parts produced by 3D stereolithography (SL) process have poorer mechanical properties as compared to their counterparts fabricated via conventional methods, such as injection or compression molding. Adding nanofillers in the photopolymer resin for SL could help improve mechanical properties. This study aims to achieve enhancement in mechanical properties of parts fabricated by SL, for functional applications, by using well-dispersed nanofillers in the photopolymers, together with suitable post-processing.

Carbon nanotubes (CNTs) have high strength and Young’s modulus, making them attractive nanofillers. However, dispersion of CNTs in photopolymer is a critical challenge, as they tend to agglomerate easily. Achieving good dispersion is crucial to improve the mechanical properties; thus, suitable dispersion mechanisms and processes are examined. Solvent exchange process was found to improve the dispersion of multiwalled carbon nanotubes in the photopolymer. The UV-absorbing nature of CNTs was also discovered to affect the curing properties. With suitable post processing, coupled with thermal curing, the mechanical properties of SL parts made from CNTs-filled resin improved significantly.

With the addition of 0.25 wt.% CNTs into the photopolymer, tensile stress and elongation of the 3D printed parts increased by 70 and 46 per cent, respectively. With the significant improvement, the achieved tensile strength is comparable to parts manufactured by conventional methods.

This allows functional parts to be manufactured using SL.

In this paper, an improved procedure to incorporate CNTs into the photopolymer was developed. Furthermore, because of strong UV-absorption nature of CNTs, curing properties of photopolymer and SL parts with and without CNT fillers were studied. Optimized curing parameters were determined and additional post-processing step for thermal curing was discovered as an essential step in order to further enhance the mechanical properties of SL composite parts.

This paper aims to present a multi-material additive manufacturing (AM) process with a newly developed curing-on-demand method to fabricate a three-dimensional (3D) object with multiple material compositions.

Unlike the deposition-on-demand printing method, the proposed curing-on-demand printheads use a digital light processing (DLP) projector to selectively cure a thin layer of liquid photocurable resin and then clean the residual uncured material effectively using a vacuuming and post-curing device. Each printhead can individually fabricate one type of material using digitally controlled mask image patterns. The proposed AM process can accurately deposit multiple materials in each layer by combining multiple curing-on-demand printheads together. Consequently, a three-dimensional object can be fabricated layer-by-layer using the developed curing-on-demand printing method.

Effective cleaning of uncured resin is realized with reduced coated resin whose height is in the sub-millimeter level and improved vacuum cleaning performance with the uncleaned resin less than 10 µm thick. Also, fast material swapping is achieved using the compact design of multiple printheads.

The proposed multi-material stereolithography (SL) process enables 3D printing components using more viscous materials and can achieve desired manufacturing characteristics, including high feature resolution, fast fabrication speed and low machine cost.

The purpose of this paper is to present a hybrid manufacturing system that integrates stereolithography (SL) and direct print (DP) technologies to fabricate three‐dimensional (3D) structures with embedded electronic circuits. A detailed process was developed that enables fabrication of monolithic 3D packages with electronics without removal from the hybrid SL/DP machine during the process. Successful devices are demonstrated consisting of simple 555 timer circuits designed and fabricated in 2D (single layer of routing) and 3D (multiple layers of routing and component placement).

A hybrid SL/DP system was designed and developed using a 3D Systems SL 250/50 machine and an nScrypt micro‐dispensing pump integrated within the SL machine through orthogonally‐aligned linear translation stages. A corresponding manufacturing process was also developed using this system to fabricate 2D and 3D monolithic structures with embedded electronic circuits. The process involved part design, process planning, integrated manufacturing (including multiple starts and stops of both SL and DP and multiple intermediate processes), and post‐processing. SL provided substrate/mechanical structure manufacturing while interconnections were achieved using DP of conductive inks. Simple functional demonstrations involving 2D and 3D circuit designs were accomplished.

The 3D micro‐dispensing DP system provided control over conductive trace deposition and combined with the manufacturing flexibility of the SL machine enabled the fabrication of monolithic 3D electronic structures. To fabricate a 3D electronic device within the hybrid SL/DP machine, a process was developed that required multiple starts and stops of the SL process, removal of uncured resin from the SL substrate, insertion of active and passive electronic components, and DP and laser curing of the conductive traces. Using this process, the hybrid SL/DP technology was capable of successfully fabricating, without removal from the machine during fabrication, functional 2D and 3D 555 timer circuits packaged within SL substrates.

Results indicated that fabrication of 3D embedded electronic systems is possible using the hybrid SL/DP machine. A complete manufacturing process was developed to fabricate complex, monolithic 3D structures with electronics in a single set‐up, advancing the capabilities of additive manufacturing (AM) technologies. Although the process does not require removal of the structure from the machine during fabrication, many of the current sub‐processes are manual. As a result, further research and development on automation and optimization of many of the sub‐processes are required to enhance the overall manufacturing process.

A new methodology is presented for manufacturing non‐traditional electronic systems in arbitrary form, while achieving miniaturization and enabling rugged structure. Advanced applications are demonstrated using a semi‐automated approach to SL/DP integration. Opportunities exist to fully automate the hybrid SL/DP machine and optimize the manufacturing process for enhancing the commercial appeal for fabricating complex systems.

This work broadly demonstrates what can be achieved by integrating multiple AM technologies together for fabricating unique devices and more specifically demonstrates a hybrid SL/DP machine that can produce 3D monolithic structures with embedded electronics and printed interconnects.

The purpose of this paper is to evaluate the relationship between the Cu trace and epoxy resin and to check the validity of surface and interfacial cutting analysis system (SAICAS) by comparing its results to those of the 90° peel test.

In this study, the effects of surface morphology on the adhesion strength were studied for a Cu/epoxy resin system using a SAICAS. In order to evaluate the peel strength of the sample, the curing degree and surface morphology of the epoxy resin were varied in the Cu/epoxy resin system.

The results indicated that the peel strength is strongly affected by the curing degree and the surface morphology of the epoxy layer. As the pre-cure time increased, the interactions between the epoxy resin and permanganate during the adhesion promotion process decreased, which decreased the surface roughness (Ra) of the resin. Therefore, the surface roughness of the epoxy resin decreased with increasing pre-cure time. The curing degree was calculated with the FTIR absorption peak (910 cm−1) of the epoxy groups. The high curing degree for the epoxy resin results in a coral-like morphology that provides a better anchoring effect for the Cu trace and a higher interfacial strength.

It is necessary to study the further adhesion strength, i.e. the friction energy, the plastic deformation energy, and the interfacial fracture energy, in micro- and nanoscale areas using SAICAS owing to insufficient data regarding the effects of size and electroplating materials.

From findings, it is found that measuring the peel strength using SAICAS is particularly useful because it makes the assessment of the peel strength in the Cu/epoxy resin system of electronic packages possible.

This paper presents an experimental study undertaken to determine the polymerisation‐induced residual stresses generated in stereolithography (SL) built test specimens, by using the hole‐drilling strain gage method of stress relaxation. Experimentally measured strains, using special three‐element strain gage rosettes, were input into the blind‐hole analysis to calculate the induced residual stresses. The mechanical properties of resin specimens fabricated by the solidification process using an epoxy based photopolymer and post‐cured under ultraviolet (UV) and thermal exposure were determined and incorporated into the subsequent drill‐hole analysis. The effect of the pre‐selected fabrication parameters (hatching space and curing depth) and subsequent by the post‐curing procedure (UV, thermal curing) on the magnitude of the recorded strains is also presented.