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Evaluation of the peel strength in Cu/epoxy thin film using a novel interfacial cutting method

Seok-Hwan Huh (ACI Division, Samsung Electro-Mechanics, Busan, Korea)
Kang-Dong Kim (Reliability Lab., Samsung Electro-Mechanics, Suwon, Korea)
Keun-Soo Kim (Fusion Technology Lab., Hoseo University, Asan, Korea)

Circuit World

ISSN: 0305-6120

Article publication date: 29 April 2014




The purpose of this paper is to evaluate the relationship between the Cu trace and epoxy resin and to check the validity of surface and interfacial cutting analysis system (SAICAS) by comparing its results to those of the 90° peel test.


In this study, the effects of surface morphology on the adhesion strength were studied for a Cu/epoxy resin system using a SAICAS. In order to evaluate the peel strength of the sample, the curing degree and surface morphology of the epoxy resin were varied in the Cu/epoxy resin system.


The results indicated that the peel strength is strongly affected by the curing degree and the surface morphology of the epoxy layer. As the pre-cure time increased, the interactions between the epoxy resin and permanganate during the adhesion promotion process decreased, which decreased the surface roughness (Ra) of the resin. Therefore, the surface roughness of the epoxy resin decreased with increasing pre-cure time. The curing degree was calculated with the FTIR absorption peak (910 cm−1) of the epoxy groups. The high curing degree for the epoxy resin results in a coral-like morphology that provides a better anchoring effect for the Cu trace and a higher interfacial strength.

Research limitations/implications

It is necessary to study the further adhesion strength, i.e. the friction energy, the plastic deformation energy, and the interfacial fracture energy, in micro- and nanoscale areas using SAICAS owing to insufficient data regarding the effects of size and electroplating materials.


From findings, it is found that measuring the peel strength using SAICAS is particularly useful because it makes the assessment of the peel strength in the Cu/epoxy resin system of electronic packages possible.



The authors gratefully acknowledge the support and the discussion of the Adhesion R&D Center ( about SAICAS.


Huh, S.-H., Kim, K.-D. and Kim, K.-S. (2014), "Evaluation of the peel strength in Cu/epoxy thin film using a novel interfacial cutting method", Circuit World, Vol. 40 No. 2, pp. 71-78.



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Copyright © 2014, Emerald Group Publishing Limited

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