Search results

1 – 10 of 11
Article
Publication date: 23 December 2021

Ewa Klimiec, Piotr Zachariasz, Halina Kaczmarek, Bogusław Królikowski and Sławomir Mackiewicz

This paper aims to present the details of isotactic polypropylene (it-PP) films with a cellular structure (air-cavities) dedicated to pressure sensors. The polymer composites…

Abstract

Purpose

This paper aims to present the details of isotactic polypropylene (it-PP) films with a cellular structure (air-cavities) dedicated to pressure sensors. The polymer composites (thin films enriched with 5 and 10 wt% of mineral fillers as Sillikolloid P 87 and glass beads) should exhibit suitable structural elasticity within specific stress ranges. After the deformation force is removed, the sensor material must completely restore its original shape and size.

Design/methodology/approach

Estimating the stiffness tensor element (C33) for polymer films (nonpolar space-charge electrets) by broadband resonance ultrasound spectroscopy is a relatively simple method of determining the safe stress range generated in thin pressure sensors. Therefore, ultrasonic and piezoelectric studies were carried out on four composite it-PP films. First, the longitudinal velocity (vL) of ultrasonic waves passing through the it-PP film in the z-direction (thickness) was evaluated from the ω-position of mechanical resonance of the so-called insertion loss function. In turn, the d33 coefficient was calculated from accumulated piezoelectric charge density response to mechanical stress.

Findings

Research is at an early stage; however, it can be seen that the mechanical orientation of the it-PP film improves its piezoelectric properties. Moreover, the three-year electric charge stability of the it-PP film seems promising.

Originality/value

Ultrasonic spectroscopy can be successfully handled as a validation method in the small-lot production of polymer films with the air-cavities structure intended for pressure sensors. The structural repeatability of polymer films is strongly related to a homogeneous distribution of the electric charge on the electret surface.

Article
Publication date: 1 April 2021

Md Delwar Hossain, Md Kamrul Hassan, Anthony Chun Yin Yuen, Yaping He, Swapan Saha and Waseem Hittini

The purpose of this study is to review and summarise the existing available literature on lightweight cladding systems to provide detailed information on fire behaviour…

Abstract

Purpose

The purpose of this study is to review and summarise the existing available literature on lightweight cladding systems to provide detailed information on fire behaviour (ignitibility, heat release rate and smoke toxicity) and various test method protocols. Additionally, the paper discusses the challenges and provides updated knowledge and recommendation on selective-fire mechanisms such as rapid-fire spread, air cavity and fire re-entry behaviours due to dripping and melting of lightweight composite claddings.

Design/methodology/approach

A comprehensive literature review on fire behaviour, fire hazard and testing methods of lightweight composite claddings has been conducted in this research. In summarising all possible fire hazards, particular attention is given to the potential impact of toxicity of lightweight cladding fires. In addition, various criteria for fire performance evaluation of lightweight composite claddings are also highlighted. These evaluations are generally categorised as small-, intermediate- and large-scale test methods.

Findings

The major challenges of lightweight claddings are rapid fire spread, smoke production and toxicity and inconsistency in fire testing.

Originality/value

The review highlights the current challenges in cladding fire, smoke toxicity, testing system and regulation to provide some research recommendations to address the identified challenges.

Details

Journal of Structural Fire Engineering, vol. 12 no. 3
Type: Research Article
ISSN: 2040-2317

Keywords

Article
Publication date: 11 September 2019

Swapnil Vyavahare, Soham Teraiya, Deepak Panghal and Shailendra Kumar

Fused deposition modelling (FDM) is the most economical additive manufacturing technique. The purpose of this paper is to describe a detailed review of this technique. Total 211…

3707

Abstract

Purpose

Fused deposition modelling (FDM) is the most economical additive manufacturing technique. The purpose of this paper is to describe a detailed review of this technique. Total 211 research papers published during the past 26 years, that is, from the year 1994 to 2019 are critically reviewed. Based on the literature review, research gaps are identified and the scope for future work is discussed.

Design/methodology/approach

Literature review in the domain of FDM is categorized into five sections – (i) process parameter optimization, (ii) environmental factors affecting the quality of printed parts, (iii) post-production finishing techniques to improve quality of parts, (iv) numerical simulation of process and (iv) recent advances in FDM. Summary of major research work in FDM is presented in tabular form.

Findings

Based on literature review, research gaps are identified and scope of future work in FDM along with roadmap is discussed.

Research limitations/implications

In the present paper, literature related to chemical, electric and magnetic properties of FDM parts made up of various filament feedstock materials is not reviewed.

Originality/value

This is a comprehensive literature review in the domain of FDM focused on identifying the direction for future work to enhance the acceptability of FDM printed parts in industries.

Details

Rapid Prototyping Journal, vol. 26 no. 1
Type: Research Article
ISSN: 1355-2546

Keywords

Article
Publication date: 4 January 2016

Shanmugan Subramani and Mutharasu Devarajan

The purpose of this research is to study the effect of thickness and surface properties of ZnO solid thin film for heat dissipation application in LED. Heat dissipation in…

Abstract

Purpose

The purpose of this research is to study the effect of thickness and surface properties of ZnO solid thin film for heat dissipation application in LED. Heat dissipation in electronic packaging can be improved by applying a thermally conductive interface material (TIM) and hence the junction temperature will be maintained. ZnO is one of the oxide materials and used as a filler to increase the thermal conductivity of thermal paste. The thickness of these paste-type material cannot be controlled which restricts the heat flow from the LED junction to ambient. The controlled thickness is only possible by using a solid thin-film interface material.

Design/methodology/approach

Radio Frequency (RF)-sputtered ZnO thin film on Cu substrates were used as a heat sink for high-power LED and the thermal performance of various ZnO thin film thickness on changing total thermal resistance (R th-tot) and rise in junction temperature were tested. Thermal transient analysis was used to study the performance of the given LED. The influence of surface roughness profile was also tested on the LED performance.

Findings

The junction temperature was high (6.35°C) for 200 nm thickness of ZnO thin film boundary condition when compared with bare Cu substrates. Consecutively, low R th-tot values were noticed with the same boundary condition. The 600 nm thickness of ZnO thin film exhibited high R th-tot and interface resistance than the other thicknesses. Bond Line Thickness of the interface material was influenced on the interface thermal resistance which was decreased with increased BLT. Surface roughness parameter showed an immense effect on thermal transport, and hence, low R th (47.6 K/W) value was noticed with low film roughness (7 nm) as compared with bare Cu substrate (50.8 K/W) where the surface roughness was 20.5 nm.

Originality/value

Instead of using thermal paste, solid thin film ZnO is used as TIM and coated Cu substrates were used as a heat sink. The thickness can be controlled, and it is a new approach for reducing the BLT between the metal core printed circuit board and heat sink.

Details

Microelectronics International, vol. 33 no. 1
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 16 October 2009

Bingshan Hu, Liwen Wang, Yanzheng Zhao and Z. Fu

Wall climbing robots' volume is needed to be very small in fields that workspace is limited, such as anti‐terror scouting, industry pipe network inspecting and so on. The purpose…

1258

Abstract

Purpose

Wall climbing robots' volume is needed to be very small in fields that workspace is limited, such as anti‐terror scouting, industry pipe network inspecting and so on. The purpose of this paper is to design a miniature wall climbing robot with biomechanical suction cups actuated by shape memory alloy (SMA) actuators.

Design/methodology/approach

Based on characteristics of biologic suction apparatuses, the biomechanical suction cup is designed first. Theory analysis of the suction cup is made considering elastic plate's deflection and SMAs constitutive model. A triangular close linkage locomotion mechanism is chosen for the miniature robot because of its simple structure and control. The robot's gait, kinematics, and control system are all illustrated in this paper.

Findings

Experiments indicate that the suction cup can be used as an adhesion mechanism for miniature wall climbing robots, and the miniature robot prototype with biomechanical suction cups can move in straight line and turn with a fixed angle on an inclined glass wall.

Originality/value

This paper describes how a miniature wall climbing robot with biomechanical suction cups actuated by SMA without any air pump is designed.

Details

Industrial Robot: An International Journal, vol. 36 no. 6
Type: Research Article
ISSN: 0143-991X

Keywords

Content available

Abstract

Details

Circuit World, vol. 40 no. 1
Type: Research Article
ISSN: 0305-6120

Content available

Abstract

Details

Soldering & Surface Mount Technology, vol. 26 no. 1
Type: Research Article
ISSN: 0954-0911

Article
Publication date: 27 May 2014

Jussi Putaala, Olli Salmela, Olli Nousiainen, Tero Kangasvieri, Jouko Vähäkangas, Antti Uusimäki and Jyrki Lappalainen

The purpose of this paper is to describe the behavior of different lead-free solders (95.5Sn3.8Ag0.7Cu, i.e. SAC387 and Sn7In4.1Ag0.5Cu, i.e. SAC-In) in thermomechanically loaded…

Abstract

Purpose

The purpose of this paper is to describe the behavior of different lead-free solders (95.5Sn3.8Ag0.7Cu, i.e. SAC387 and Sn7In4.1Ag0.5Cu, i.e. SAC-In) in thermomechanically loaded non-collapsible ball grid array (BGA) joints of a low-temperature co-fired ceramic (LTCC) module. The validity of a modified Engelmaier’s model was tested to verify its capability to predict the characteristic lifetime of an LTCC module assembly implementable in field applications.

Design/methodology/approach

Five printed wiring board (PWB) assemblies, each carrying eight LTCC modules, were fabricated and exposed to a temperature cycling test over a −40 to 125°C temperature range to determine the characteristic lifetimes of interconnections in the LTCC module/PWB assemblies. The failure mechanisms of the test assemblies were verified using scanning acoustic microscopy, scanning electron microscopy (SEM) and field emission SEM investigation. A stress-dependent Engelmaier’s model, adjusted for plastic-core solder ball (PCSB) BGA structures, was used to predict the characteristic lifetimes of the assemblies.

Findings

Depending on the joint configuration, characteristic lifetimes of up to 1,920 cycles were achieved in the thermal cycling testing. The results showed that intergranular (creep) failures occurred primarily only in the joints containing Sn7In4.1Ag0.5Cu solder. Other primary failure mechanisms (mixed transgranular/intergranular, separation of the intermetallic compound/solder interface and cracking in the interface between the ceramic and metallization) were observed in the other joint configurations. The modified Engelmaier’s model was found to predict the lifetime of interconnections with good accuracy. The results confirmed the superiority of SAC-In solder over SAC in terms of reliability, and also proved that an air cavity structure of the module, which enhances its radio frequency (RF) performance, did not degrade the reliability of the second-level interconnections of the test assemblies.

Originality/value

This paper shows the superiority of SAC-In solder over SAC387 solder in terms of reliability and verifies the applicability of the modified Engelmaier’s model as an accurate lifetime prediction method for PCSB BGA structures for the presented LTCC packages for RF/microwave telecommunication applications.

Details

Soldering & Surface Mount Technology, vol. 26 no. 3
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 28 August 2023

P.S. Liu, S. Song and J.X. Sun

The purpose of this paper is mainly to know: (1) the sound absorption coefficient of porous composite structures constituted by a new kind of lightweight ceramic foam and…

Abstract

Purpose

The purpose of this paper is mainly to know: (1) the sound absorption coefficient of porous composite structures constituted by a new kind of lightweight ceramic foam and perforated plate; (2) the availability of an equivalent porous material model, recently proposed by the present author, to these composite structures in sound absorption.

Design/methodology/approach

A kind of lightweight ceramic foam with bulk density of 0.38–0.56 g·cm-3 was produced by means of molding, drying and sintering. The effect of stainless steel perforated plate on sound absorption performance of the ceramic foam was investigated by means of JTZB absorption tester.

Findings

The results indicate that the sound absorption performance could be obviously changed by adding the stainless steel perforated plate in front of the porous samples and the air gap in back of the porous samples. Adding the perforated plate to the porous sample with a relatively large pore size, the sound absorption performance could be evidently improved for the composite structure. When the air gap is added to the composite structure, the first absorption peak shifts to the lower frequency, and the sound absorption coefficient could increase in the low frequency range.

Originality/value

Based on the equivalent porous material model and the “perforated plate with air gap” model, the sound absorption performance of the composite structures can be simulated conveniently to a great extent by using Johnson-Champoux-Allard model.

Details

Multidiscipline Modeling in Materials and Structures, vol. 19 no. 6
Type: Research Article
ISSN: 1573-6105

Keywords

Article
Publication date: 18 January 2016

Tanyong Wei, Qiulin Tan, Tao Luo, Guozhu Wu, Shun Tang, Dan-Dan Shen, Chen Li and Jijun Xiong

The purpose of this paper is to propose a pressure-, temperature- and acceleration-sensitive structure-integrated inductor-capacitor (LC) resonant ceramic sensor to fulfill the…

Abstract

Purpose

The purpose of this paper is to propose a pressure-, temperature- and acceleration-sensitive structure-integrated inductor-capacitor (LC) resonant ceramic sensor to fulfill the measurement of multi-parameters, such as the measurement of pressure, temperature and acceleration, simultaneously in automotive, aerospace and aeronautics industries.

Design/methodology/approach

The ceramic-based multi-parameter sensor was composed of three LC tanks, which have their resonant frequencies sensitive to pressure, temperature and acceleration separately. Two aspects from the specific sensitive structure design to the multiple signals reading technology are considered in designing the multi-parameter ceramic sensor. Theoretical analysis and ANSYS simulation are used in designing the sensitive structure, and MATLAB simulation and experiment are conducted to verify the feasibility of non-coverage of multi-readout signals.

Findings

It is found that if the parameters of sensitive structure and layout of the LC tanks integrated into the sensor are proper, the implementation of a multi-parameter sensor could be feasible.

Practical implications

The ceramic sensor proposed in the paper can measure pressure, temperature and acceleration simultaneously in harsh environments.

Originality/value

The paper creatively proposes a pressure-, temperature- and acceleration-sensitive structure-integrated LC resonant ceramic sensor for harsh environments and verifies the feasibility of the sensor from sensitive structure design to multiple-signal reading.

Details

Sensor Review, vol. 36 no. 1
Type: Research Article
ISSN: 0260-2288

Keywords

1 – 10 of 11