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The purpose of this paper is to present the design of a microgripper system that comprises a dual jaw actuation mechanism with contact sensing.

Interdigitated lateral comb-drive-based electrostatic actuator is used to move the gripper arms. Simultaneous contact sensing of the gripper jaws has been achieved through transverse comb-based capacitive sensor. The fabricated microgripper produces a displacement of 16 μm at gripper jaws for an applied actuation voltage of 45 V.

It is observed that the microgripper fails to operate for the maximum performance limits (70 μm jaws displacement) and produces uncontrolled force at the tip of the jaws > 45 V.

A novel behavioral model of the microgripper system is proposed using the fabricated dimensions of the system to carry out a detailed analysis to understand the cause of this failure. The failure analysis shows that the microgripper system failed to operate in its designed limits due to the presence of side instability in the designed combs structure. Our proposed failure model helps in redesigning the actuator to ensure its operation above 45 V so that the gripper jaw can be displaced to its maximum limit of 70 μm and also result in the increase of the controlled force from 250 to 303 μN at the microgripper jaws.

This paper aims to present design and characterization of a micrograsping system which is capable of safely grasping micro‐objects.

The proposed micrograsping system consists of novel MEMS based microgripper integrated with capacitive contact sensor (fabricated in standard micromachining process SOI‐MUMPs), sense electronics, a controller, high voltage actuation circuit and graphical user interface.

Due to the improvement in the lateral comb‐drive design, the actuator requires low actuation voltages in the range of 0‐45 V. This requires a simple and low power actuation circuitry. Capacitive feedback control mechanism is used in the sensor to detect the contact between the jaws and micro‐object while providing high values of the capacitance.

The designed sense electronics can sense the capacitance ranging from 0‐330 fF. Due to the availability of integrated contact sensor, objects ranging from 54 μm to 70 μm can be gripped safely with the applied maximum force of 220 μN at the tip of the gripper.

The performance of the microgripper, controller algorithm and associated electronics were experimentally quantified through the gripping of 65 μm sized human hair.

The purpose of this paper is to design a microgripper that can achieve nondestructive gripping of a miniaturized ultra-thin-walled cylindrical part.

The microgripper is mainly made of an inflatable silica gel gasbag, which can minimize the damage to the part in the gripping process. This paper introduces the design principle of a flexible air-filled microgripper, which is applied in an in-house microassembly system with coaxial alignment function. Its parameters and performance specifications have been obtained by simulation, experiment demarcating. The results show that the microgripper is able to grasp an ultra-thin-walled part non-destructively.

For the microgripper, finite element simulations and experiments were carried out, and both results indicate that the microgripper can achieve nondestructive gripping of a miniaturized ultra-thin-walled cylindrical part, with good stability, great grasping force and high repeat positioning accuracy.

Gripping the ultra-thin-walled part may lead to deformation and destruction easily. It has been a big bottleneck hindering successful assembly. This article introduces a novel microgripper using an inflatable sac. The work is interesting from an industrial point of view for a specific category of assembly applications. It provides a theoretical guidance and technical support to design a microgripper for a miniaturized ultra-thin-walled part of different sizes.

This paper aims to deal with the measurement of positioning accuracies of microscale components assembled to fabricate micro-optical benches (MOB).

The concept of MOB is presented to explain how to fabricate optical MEMS based on out-of-plane micro-assembly of microcomponents. This micro-assembly platform includes a laser sensor that enables to measure the position of the microcomponent after its assembly. The measurement set-up and procedure is displayed and applied on several micro-assembly sets.

The measurement system provides results with maximum deviation smaller than ±0.005°. Based on this measurement system and micro-assembly procedure displayed in the article, it is shown that it is possible to obtain a positioning accuracy up to 0.009°.

These results clearly show that micro-assembly is a possible way to fabricate complex, heterogeneous and 3D optical MEMS with very good optical performances.

Describes the benefits of using electroadhesion when handling very delicate, polished and/or coated optical and electro‐optical microcomponents. Electroadhesion is a technique already familiar to those working in the semiconductor industry and is eminently suitable for the handling of microcomponents in air, gas or vacuum.

The purpose of this paper is to design and develop 14-degree of freedom (DOF) robotic micromanipulator with which LIGA devices and axle hole part can be both manipulated and assembled.

The in-house robotic microassembly system is composed of a 6-DOF large motion serial robot with microgrippers, a hexapod six-DOF precision alignment worktable and a vision system whose optical axis of the microscope is parallel with the horizontal plane. A prism with special coating is fixed in front of the objective lens, thus, two-part figures can be acquired simultaneously by the microscope with 1.67 to 9.26 micron optical resolution. The relative discrepancy between the two parts can be calculated from image plane coordinate instead of calculating the space transformation matrix. A modified microgripper was designed to clamp meso-scale parts and its effectiveness was confirmed experimentally. Through the use of the other vision system, the insert action can be successfully manipulated. A laser ranger finder was integrated in this micro-assembly system to measure the assembly result.

A new 14-DOF robotic micromanipulator, including eight axes automatically and six axes manually, has been developed for the assembly of LIGA meso-scale flat parts and axle hole parts. The microassembly system with coaxial alignment function (MSCA) system is able to concurrently manipulate all eight axes automatically and six axes manually.

The robotic microassembly is applied in the assembly of meso-scale parts. The new capabilities of the MSCA will allow for the assembly of microsystems more efficiently and more precisely.

The purpose of this paper is to review recent developments in micro‐scale assembly technologies, primarily in the context of microsystems based on three‐dimensional (3D) micro‐electromechanical systems (MEMS) and micro‐opto‐electromechanical systems (MOEMS) technologies.

Following a brief introduction, this paper first discusses the problems associated with the assembly of micro‐components and then considers the role of robots and self‐assembly technologies. This is followed by a brief summary and conclusion.

Experimental robotic systems have been developed and used for the assembly of a wide range of MEMS and MOEMS components. Various self‐assembly technologies offer prospects for massively parallel microassembly but have yet to achieve the success of the robotic approach. Some work has sought to combine the best feature of both approaches but as yet, no technologies have been developed that can rapidly, accurately and cost‐effectively assemble micro‐components into hybrid 3D MEMS/MOEMS devices in a true production environment.

This paper provides a detailed review of recent progress in the robotic and self‐assembly of micro‐components.

This paper presents a cheap and easy‐to‐produce microprehensile microrobot on chip (MMOC). This four‐degree‐of‐freedom (DOFs) microprehensor is able to grip, hold and release submillimetric‐sized objects. The research conducted relied heavily on the design of a simple and efficient monolithic piezoelectric two‐DOF actuator, requiring no further motion transformation system and asking for no supplementary guiding system. The integration of all these functions in a single part eliminates nearly all assembly concerns. Each finger of the gripper is an actuator, called a duo‐bimorph, which provides higher deflections than piezoelectric tubes. The paper presents the developed MMOC prototype, comments its performances and details the functioning of the duo‐bimorph.