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This paper aims to deal with the measurement of positioning accuracies of microscale components assembled to fabricate micro-optical benches (MOB).

The concept of MOB is presented to explain how to fabricate optical MEMS based on out-of-plane micro-assembly of microcomponents. This micro-assembly platform includes a laser sensor that enables to measure the position of the microcomponent after its assembly. The measurement set-up and procedure is displayed and applied on several micro-assembly sets.

The measurement system provides results with maximum deviation smaller than ±0.005°. Based on this measurement system and micro-assembly procedure displayed in the article, it is shown that it is possible to obtain a positioning accuracy up to 0.009°.

These results clearly show that micro-assembly is a possible way to fabricate complex, heterogeneous and 3D optical MEMS with very good optical performances.

The purpose of this paper is to review recent developments in micro‐scale assembly technologies, primarily in the context of microsystems based on three‐dimensional (3D) micro‐electromechanical systems (MEMS) and micro‐opto‐electromechanical systems (MOEMS) technologies.

Following a brief introduction, this paper first discusses the problems associated with the assembly of micro‐components and then considers the role of robots and self‐assembly technologies. This is followed by a brief summary and conclusion.

Experimental robotic systems have been developed and used for the assembly of a wide range of MEMS and MOEMS components. Various self‐assembly technologies offer prospects for massively parallel microassembly but have yet to achieve the success of the robotic approach. Some work has sought to combine the best feature of both approaches but as yet, no technologies have been developed that can rapidly, accurately and cost‐effectively assemble micro‐components into hybrid 3D MEMS/MOEMS devices in a true production environment.

This paper provides a detailed review of recent progress in the robotic and self‐assembly of micro‐components.

The purpose of this paper is to provide a technical review of silicon micro‐electromechanical systems (MEMS) technology and its applications.

Following an introduction, the paper describes silicon MEMS fabrication and assembly techniques, considers a selection of commercially important products and their applications and concludes with a brief review of power MEMS research.

Silicon MEMS fabrication technology is derived from techniques used in semiconductor manufacture and has yielded a diverse and ever‐growing range of sensors, actuators and other miniaturised devices that find applications in a multitude of industries.

This paper provides a detailed technical review of MEMS technology and its applications.