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Article
Publication date: 2 October 2019

Mansoor Ahmad, Ayhan Bozkurt and Omid Farhanieh

This paper aims to Separation and sorting of biological cells is desirable in many applications for analyzing cell properties, such as disease diagnostics, drugs delivery…

329

Abstract

Purpose

This paper aims to Separation and sorting of biological cells is desirable in many applications for analyzing cell properties, such as disease diagnostics, drugs delivery, chemical processing and therapeutics.

Design/methodology/approach

Acoustic energy-based bioparticle separation is a simple, viable, bio-compatible and contact-less technique using, which can separate the bioparticles based on their density and size, with-out labeling the sample particles.

Findings

Conventionally available bioparticle separation techniques as fluorescence and immunomagnetic may cause a serious threat to the life of the cells due to various compatibility issues. Moreover, they also require an extra pre-processing labeling step. Contrarily, label-free separation can be considered as an alternative solution to the traditional bio-particle separation methods, due to their simpler operating principles and lower cost constraints. Acoustic based particle separation methods have captured a lot of attention among the other reported label-free particle separation techniques because of the numerous advantages it offers.

Practical implications

This study tries to briefly cover the developments of different acoustic-based particle separation techniques over the years. Unlike the conventional surveys on general bioparticles separation, this study is focused particularly on the acoustic-based particle separation. The study would provide a comprehensive guide for the future researchers especially working in the field of the acoustics, in studying and designing the acoustic-based particle separation techniques.

Originality/value

The study insights a brief theory of different types of acoustic waves and their interaction with the bioparticles is considered, followed by acoustic-based particle separation devices reported till the date. The integration of acoustic-based separation techniques with other methods and with each other is also discussed. Finally, all major aspects like the approach, and productivity, etc., of the adopted acoustic particle separation methods are sketched in this article.

Details

World Journal of Engineering, vol. 16 no. 6
Type: Research Article
ISSN: 1708-5284

Keywords

Article
Publication date: 25 January 2021

Xu Han, Xiaoyan Li, Peng Yao and Dalong Chen

This study aims to investigate the interfacial microstructures of ultrasonic-assisted solder joints at different soldering times.

Abstract

Purpose

This study aims to investigate the interfacial microstructures of ultrasonic-assisted solder joints at different soldering times.

Design/methodology/approach

Solder joints with different microstructures are obtained by ultrasonic-assisted soldering. To analyze the effect of ultrasounds on Cu6Sn5 growth during the solid–liquid reaction stage, the interconnection heights of solder joints are increased from 30 to 50 μm.

Findings

Scallop-like Cu6Sn5 nucleate and grow along the Cu6Sn5/Cu3Sn interface under the traditional soldering process. By comparison, some Cu6Sn5 are formed at Cu6Sn5/Cu3Sn interface and some Cu6Sn5 are randomly distributed in Sn when ultrasonic-assisted soldering process is used. The reason for the formation of non-interfacial Cu6Sn5 has to do with the shock waves and micro-jets produced by ultrasonic treatment, which leads to separation of some Cu6Sn5 from the interfacial Cu6Sn5 to form non-interfacial Cu6Sn5. The local high pressure generated by the ultrasounds promotes the heterogeneous nucleation and growth of Cu6Sn5. Also, some branch-like Cu3Sn formed at Cu6Sn5/Cu3Sn interface render the interfacial Cu3Sn in ultrasonic-assisted solder joints present a different morphology from the wave-like or planar-like Cu3Sn in conventional soldering joints. Meanwhile, some non-interfacial Cu3Sn are present in non-interfacial Cu6Sn5 due to reaction of Cu atoms in liquid Sn with non-interfacial Cu6Sn5 to form non-interfacial Cu3Sn. Overall, full Cu3Sn solder joints are obtained at ultrasonic times of 60 s.

Originality/value

The obtained microstructure evolutions of ultrasonic-assisted solder joints in this paper are different from those reported in previous studies. Based on these differences, the effects of ultrasounds on the formation of non-interfacial IMCs and growth of interfacial IMCs are systematically analyzed by comparing with the traditional soldering process.

Details

Soldering & Surface Mount Technology, vol. 33 no. 4
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 1 August 2016

Thomas D.A. Jones, David Flynn, Marc P.Y. Desmulliez, Dennis Price, Matthew Beadel, Nadia Strusevich, Mayur Patel, Chris Bailey and Suzanne Costello

This study aims to understand the influence of megasonic (MS)-assisted agitation on printed circuit boards (PCBs) electroplated using copper (Cu) electrolyte solutions to improve…

Abstract

Purpose

This study aims to understand the influence of megasonic (MS)-assisted agitation on printed circuit boards (PCBs) electroplated using copper (Cu) electrolyte solutions to improve plating efficiencies through enhanced ion transportation.

Design/methodology/approach

The impact of MS-assisted agitation on topographical properties of the electroplated surfaces was studied through a design of experiments by measuring surface roughness, which is characterised by values of the parameter Ra as measured by white light phase shifting interferometry and high-resolution scanning electron microscopy.

Findings

An increase in Ra from 400 to 760 nm after plating was recorded for an increase in acoustic power from 45 to 450 W. Roughening increased because of micro-bubble cavitation energy and was supported through direct imaging of the cavitation. Current thieving effect by the MS transducer induced low currents, leading to large Cu grain frosting and reduction in the board quality. Current thieving was negated in plating trials through specific placement of transducer. Wavy electroplated surfaces, due to surface acoustic waves, were also observed to reduce the uniformity of the deposit.

Research limitations/implications

The formation of unstable transient cavitation and variation of the topology of the Cu surface are unwanted phenomena. Further plating studies using MS agitation are needed, along with fundamental simulations, to determine how the effects can be reduced or prevented.

Practical implications

This study can help identify manufacturing settings required for high-quality MS-assisted plating and promote areas for further investigation, leading to the development of an MS plating manufacturing technique.

Originality/value

This study quantifies the topographical changes to a PCB surface in response to MS agitation and evidence for deposited Cu artefacts due to acoustic effects.

Details

Circuit World, vol. 42 no. 3
Type: Research Article
ISSN: 0305-6120

Keywords

Article
Publication date: 27 November 2018

Fuda Ning, Yingbin Hu and Weilong Cong

The purpose of this paper is to identify if the implementation of ultrasonic vibration in laser engineered net shaping (LENS) process can help to reduce internal weaknesses such…

721

Abstract

Purpose

The purpose of this paper is to identify if the implementation of ultrasonic vibration in laser engineered net shaping (LENS) process can help to reduce internal weaknesses such as porosity, coarse primary TiB whisker and heterogeneous distribution of TiB reinforcement in the LENS-fabricated TiB reinforced Ti matrix composites (TiB-TMC) parts.

Design/methodology/approach

An experimental investigation is performed to achieve the results for comparative studies under different fabrication conditions through quantitative data analysis. An approach of microstructural characterization and mechanical testing is conducted to obtain the output attributes. In addition, the theoretical analysis of the physics of ultrasonic vibration in the melting materials is presented to explain the influences of ultrasonic vibration on the microstructural evolution occurred in the part fabrication.

Findings

Because of the nonlinear effects of acoustic streaming and cavitation induced by ultrasonic vibration, porosity is significantly reduced and a relatively small variation of pore sizes is achieved. Ultrasonic vibration also causes the formation of smaller TiB whiskers that distribute along grain boundaries with a homogeneous dispersion. Additionally, a quasi-continuous network (QCN) microstructure is considerably finer than that produced by LENS process without ultrasonic vibration. The refinements of both reinforcing TiB whiskers and QCN microstructural grains further improve the microhardness of TiB-TMC parts.

Originality/value

The novel ultrasonic vibration-assisted (UV-A) LENS process of TiB-TMC is conducted in this work for the first time to improve the process performance and part quality.

Details

Rapid Prototyping Journal, vol. 25 no. 3
Type: Research Article
ISSN: 1355-2546

Keywords

Article
Publication date: 11 August 2020

Shanmukh Sudhir Arasavelli, Ramakrishna Konijeti and Govinda Rao Budda

This paper aims to deal with heat transfer enhancement because of transverse vibration on counter flow concentric pipe heat exchanger. Experiments were performed at different…

Abstract

Purpose

This paper aims to deal with heat transfer enhancement because of transverse vibration on counter flow concentric pipe heat exchanger. Experiments were performed at different vibrator positions with varying amplitudes and frequencies.

Design/methodology/approach

Tests are carried out at 4 different vibration frequencies (20, 40, 60 and 100 Hz), 3 vibration amplitudes (23, 46 and 69 mm) and at 3 vibrator positions (1/4, 1/2 and 3/4 of pipe length) with respect to hot water inlet under turbulent flow condition.

Findings

Experimental results indicate that Nusselt number is enhanced to a maximum extent of 44% with vibration when compared to Nusselt number without vibration at a frequency of 40 Hz, an amplitude of 69 mm and at a vibrator position of one-fourth of pipe length with respect to hot water inlet.

Originality/value

Empirical correlation is developed from experimental data to estimate the heat transfer coefficient with vibration for experimental frequency range with an error estimate of approximately ±10%.

Details

World Journal of Engineering, vol. 17 no. 5
Type: Research Article
ISSN: 1708-5284

Keywords

Article
Publication date: 2 December 2019

Yun Liu, Weiyuan Yu, Xuemin Sun and Fengfeng Wang

This paper aims to investigate the effect of ultrasonic vibration (USV) on the evolution of intermetallic compounds (IMCs), grain morphology and shear strength of soldered…

Abstract

Purpose

This paper aims to investigate the effect of ultrasonic vibration (USV) on the evolution of intermetallic compounds (IMCs), grain morphology and shear strength of soldered Ni/Sn/Ni samples.

Design/methodology/approach

The Ni/Sn/Ni joints were obtained through ultrasonic-assisted soldering. The formation of IMCs, their composition, grain morphology and the fractured-surface microstructures from shear tests were characterized using scanning electron microscopy and energy-dispersive x-ray spectroscopy.

Findings

Without USV, a planar interfacial Ni3Sn4 layer was formed at the Ni/Sn interface, and a few Ni3Sn4 grains were distributed in the soldered joint. The morphology of these grains was needle-shaped. With USV, several grooves were formed at the interfacial Ni3Sn4 layer due to ultrasonic cavitation. Some deepened grooves led to “neck” connections at the roots of the Ni3Sn4 grains, which accelerated the strong detachment of Ni3Sn4 from the substrate. In addition, two types of Ni3Sn4 grains, needle-shaped and granular-shaped, were observed at the interface. Furthermore, the shear strength increased with longer USV time, which was attributed to the thinning of the interfacial IMC layers and dispersion strengthening from the Ni3Sn4 particles distributed evenly in the joint.

Originality/value

The novelty of the paper is the detailed study of the effect of USV on the morphology, size changes of interfacial IMC and joint strength. This provides guidance for the application of ultrasonic-assisted soldering in electronics packaging.

Details

Soldering & Surface Mount Technology, vol. 32 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 23 November 2022

Megan Burfoot, Ali GhaffarianHoseini, Amirhosein Ghaffarianhoseini and Nicola Naismith

To maximise acoustic comfort in a classroom, the acoustic conditions of the space should be variable. So, the optimal acoustic state also changes when the classroom changes from a…

Abstract

Purpose

To maximise acoustic comfort in a classroom, the acoustic conditions of the space should be variable. So, the optimal acoustic state also changes when the classroom changes from a study environment into a lecture environment. Passive Variable Acoustic Technology (PVAT) alters a room’s Reverberation Time (RT) by changing the total sound absorption in a room. The purpose of this paper is to evaluate the improvements to classroom acoustic comfort when using PVAT.

Design/methodology/approach

The study is conducted in an existing tertiary classroom at Auckland University of Technology, New Zealand. The PVAT is prototyped, and the RTs are measured according to international standards before and after classroom installation. The acoustic measurement method used is a cost-effective application tool where pre- and post-conditions are of primary concern.

Findings

PVAT is found to offer statistically significant improvements in RT, but the key benefits are realised in its’ ability to vary RT for different classroom situations. It is predicted that the RT recommendations for two room types outlined in the acoustic standard AS/NZS 2107:2016 are satisfied when using PVAT in a single classroom space. By optimising RT, the acoustic comfort during both study and lecture is significantly improved.

Originality/value

When PVAT is combined with an intelligent system – Intelligent Passive Room Acoustic Technology (IPRAT) – it can detect sound waves in real time to identify the optimal RT. This paper details a pilot case study that works towards quantifying the benefits of IPRAT, by prototyping and testing the PVAT component of the system.

Highlights

  1. A pilot case study outlines the development and test of a variable acoustic prototype in a tertiary classroom

  2. A method is adopted to measure acoustic conditions, using three under-researched Android applications

  3. The benefits of PVAT are realised in its ability to vary RT by adjusting the prototypes’ sound absorption

  4. By using PVAT in a single space, the recommended RTs for two room types outlined in the acoustic standard AS/NZS 2107:2016 can be satisfied

  5. The improvements in acoustic comfort due to PVAT are statistically significant

A pilot case study outlines the development and test of a variable acoustic prototype in a tertiary classroom

A method is adopted to measure acoustic conditions, using three under-researched Android applications

The benefits of PVAT are realised in its ability to vary RT by adjusting the prototypes’ sound absorption

By using PVAT in a single space, the recommended RTs for two room types outlined in the acoustic standard AS/NZS 2107:2016 can be satisfied

The improvements in acoustic comfort due to PVAT are statistically significant

Details

Smart and Sustainable Built Environment, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 2046-6099

Keywords

Article
Publication date: 10 July 2019

K. Todd Lowe, Raul Otero and Wing Ng

The purpose of this paper is to present an acoustics-based method for measuring turbofan nozzle exhaust thrust, while assessing the potential of scaling the methods for in-flight…

Abstract

Purpose

The purpose of this paper is to present an acoustics-based method for measuring turbofan nozzle exhaust thrust, while assessing the potential of scaling the methods for in-flight measurements.

Design/methodology/approach

Although many methods proposed for achieving in-flight thrust measurements involve complicated, sensitive and expense instruments, an acoustics-based approach is discussed that greatly simplifies the technology development pathway to in-flight applications.

Findings

Results are provided for a minimum set of sensors applied in the exhaust of a research turbofan engine at Virginia Tech, showing the difference in acoustics-measured thrust and nozzle thrust found by integrating thermocouple and Kiel probe measurements to be less than 6 per cent at the maximum fan speed examined.

Practical implications

Measuring accurate thrust values in flight will prove immediately valuable for installed thrust validation and engine health monitoring. Acoustics-based methodologies are attractive because of the robustness and low cost of sensors and sources. The value of in-flight thrust measurements, along with the benefits of acoustic approaches, makes the current topic of great interest for further development.

Originality/value

This paper presents unique applications of a time-of-flight acoustic thrust sensor, while providing an original assessment of technological challenges involved with the progression of the technique for in-flight measurements.

Details

Aircraft Engineering and Aerospace Technology, vol. 92 no. 1
Type: Research Article
ISSN: 1748-8842

Keywords

Article
Publication date: 1 April 1955

There are three lateral dynamic attitudes, delineated by rolling, yawing, and sideslipping. It is possible to solve for the pressures on the rolling wing by quasi‐steady analysis…

Abstract

There are three lateral dynamic attitudes, delineated by rolling, yawing, and sideslipping. It is possible to solve for the pressures on the rolling wing by quasi‐steady analysis. This approach is, however, inapplicable for the yawing or sideslipping wing, and it is with the latter two cases that this paper deals.

Details

Aircraft Engineering and Aerospace Technology, vol. 27 no. 4
Type: Research Article
ISSN: 0002-2667

Content available
Article
Publication date: 18 November 2013

148

Abstract

Details

Circuit World, vol. 39 no. 4
Type: Research Article
ISSN: 0305-6120

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