Table of contents
Base material selection for reliable lead‐free processing
Bernd Hövel, Tom VerbruggeTo demonstrate a method of selecting base materials for lead‐free processing based on the kinetics of decomposition.
A solution for PCB drilling with strict requirement on hole wall quality
Lianyu Fu, Fan YangTo provide a solution for PCB drilling with strict requirements on hole wall quality.
Hybrid modeling of woven fibre reinforced metal matrix composite for multilayer circuit boards
K.H. Low, Yuqi WangTo present a method to model woven fibre reinforced metal matrix composite for multilayer circuit boards.
Integrated optical and electronic interconnect printed circuit board manufacturing
David R. Selviah, F. Aníbal Fernández, Ioannis Papakonstantinou, Kai Wang, Hadi Bagshiahi, Andy C. Walker, Aongus McCarthy, Himanshu Suyal, David A. Hutt, Paul P. Conway, John Chappell, Shefiu S. Zakariyah, Dave MilwardTo introduce the Innovative Electronics Manufacturing Research Centre Flagship Project: Integrated Optical and Electronic Interconnect PCB Manufacturing, its objectives, its…
Environmentally friendly assembly of robust electronics without solder
Joseph FjelstadTin‐lead solder has been the primary method for connecting electronic components to printed circuit boards since near the time of its inception. Over the last 60 years, solder has…
Assessment of blind via holes – an alternative approach
Bob WillisTo present a simple way of assessing blind vias, making failure analysis easier to perform and generating less controversy.
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari