To present a method to model woven fibre reinforced metal matrix composite for multilayer circuit boards.
This paper presents a hybrid modelling method to model multilayer multimaterial composites with the combination of metallic and woven composite plies. Firstly, 3D unit cells of woven composite are idealized as orthotropic plies, while metallic layers are taken as isotropic plies. Secondly, the idealized composite plies and metallic plies are modelled into a 2D multilayer finite element (FE). Lastly, scalar damage parameters are used for damage modelling.
Based on this method, static and dynamic analysis of multilayer composite can be performed at both micro and board levels. Meanwhile, the hybrid model illustrates a good agreement with the experimental results and good computational efficiency required for FE simulation. Conceptually, this study is aimed to provide an efficient damage modelling techniques for laminate composites and flexible modelling methodology for further development of new composite material systems.
Damaging testing and simulation is not involved, although damaging modelling method is presented.
This model has high flexibility and efficiency: the micro structure and properties of reinforced fibres, polymer matrix and metallic plies can be changed conveniently in 3D mechanics unit‐cell model; the 2D structure of geometry model provides a high‐computational efficiency in the numerical simulation. The presented work also provides the damage modelling methods, multi‐linear damage law and scalar damage parameters, to simulate damage behaviour after impact.
Low, K.H. and Wang, Y. (2008), "Hybrid modeling of woven fibre reinforced metal matrix composite for multilayer circuit boards", Circuit World, Vol. 34 No. 2, pp. 12-20. https://doi.org/10.1108/03056120810874537
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