Assessment of blind via holes – an alternative approach
Abstract
Purpose
To present a simple way of assessing blind vias, making failure analysis easier to perform and generating less controversy.
Design/methodology/approach
The paper describes a procedure that may be used to examine blind via hole interconnections for routine testing or during failure analysis of a printed circuit board.
Findings
The technique described complements existing methods for assessing vias.
Originality/value
The paper details a new method of via assessment that can be an alternative to established techniques.
Keywords
Citation
Willis, B. (2008), "Assessment of blind via holes – an alternative approach", Circuit World, Vol. 34 No. 2, pp. 34-38. https://doi.org/10.1108/03056120810874564
Publisher
:Emerald Group Publishing Limited
Copyright © 2008, Company