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This study aims to investigate the factors responsible for substrate cracking reliability problem in through-glass vias (TGVs), which are critical components for glass-based 2.5 D integration.

Numerical models were used to examine the driving force for substrate cracking in glass interposers due to stress coupling during heating. An analytical solution was used to demonstrate how the energy release rate (ERR) for the glass substrate cracking is affected by the via design and the mismatch in thermal strain. Then, the numerical models were implemented to investigate the design factors effects, such as the pitch distance, via diameter, via pattern, via design, effect from a stress buffer layer and the interposer materials selection on the susceptibility to substrate cracking.

ERR for substrate cracking was found to be directly proportional to the via diameter and the thermal mismatch strain. When a via pattern is implemented for high-density integration, a coupling in the stress fields was identified. This coupling effect was found to depend on the pitch distance, the position of the vias, and the via arrangement, suggesting a via pattern-dependent reliability behavior for glass interposers. Changing the design of the via to an annular shape or a substrate-cored via was found to be a promising approach to reduce the susceptibility to substrate cracking compared to a fully filled solid via. Also, the use of a stress buffer layer, an encouraging design prospect presented for the first time for TGVs in this study, was found to significantly reduce cracking. Finally, alternative via and substrate materials showed lower tendency for substrate cracking, indicating that the reliability of glass interposers can be further enhanced with the implementation of such new materials.

This study signifies the first attempt to comprehensively evaluate the susceptibility to crack formation in glass interposers during heating. Therefore, this study provides new perspectives on how to achieve a significant potential reliability improvement for TGVs.

Glass is a promising interposer substrate for 2.5 D integration; yet detailed analysis of the interfacial reliability of through-glass vias (TGVs) has been lacking. The purpose of this paper is to investigate the design and material factors responsible for the interfacial delamination in TGVs and identify methods to improve reliability.

The interfacial reliability of TGVs is studied both analytically and numerically. An analytical solution is presented to show the dependence of the energy release rate (ERR) for interfacial delamination on the via design and the thermal mismatch strain. Then, finite element analysis (FEA) is used to investigate the influence of detailed design and material factors, including the pitch distance, via aspect ratio, via geometry and the glass and via materials, on the susceptibility to interfacial delamination.

ERR for interfacial delamination is directly proportional to the via diameter and the thermal mismatch strain. Thinner wafers with smaller aspect ratios show larger ERRs. Changing the via geometry from a fully filled via to an annular via leads to lower ERR. FEA results also show that certain material combinations have lower thermal mismatch strains, thus less prone to delamination.

The results and approach presented in this paper can guide the design and development of more reliable 2.5 D glass interposers.

This paper represents the first attempt to comprehensively evaluate the impact of design and material selection on the interfacial reliability of TGVs.

This paper aims to realize the vertical interconnection in 3D radio frequency (RF) circuit by coaxial transitions with broad working bandwidth and small signal loss.

An advanced packaging method, 12-inch wafer-level through-mold-via (TMV) additive manufacturing, is used to fabricate a 3D resin-based coaxial transition with a continuous ground wall (named resin-coaxial transition). Designation and simulation are implemented to ensure the application universality and fabrication feasibility. The outer radius R of coaxial transition is optimized by designing and fabricating three samples.

The fabricated coaxial transition possesses an inner radius of 40 µm and a length of 200 µm. The optimized sample with an outer radius R of 155 µm exhibits S11 < –10 dB and S21 > –1.3 dB at 10–110 GHz and the smallest insertion loss (S21 = 0.83 dB at 77 GHz) among the samples. Moreover, the S21 of the samples increases at 58.4–90.1 GHz, indicating a broad and suitable working bandwidth.

The wafer-level TMV additive manufacturing method is applied to fabricate coaxial transitions for the first time. The fabricated resin-coaxial transitions show good performance up to the W-band. It may provide new strategies for novel designing and fabricating methods of RF transitions.

This paper aims to provide the proper preset temperatures of the convection reflow oven when reflowing a printed circuit board (PCB) assembly with varied sizes of components simultaneously.

In this study, computational fluid dynamics modeling is used to simulate the reflow soldering process. The training data provided to the machine learning (ML) model is generated from a programmed system based on the physics model. Support vector regression and an artificial neural network are used to validate the accuracy of ML models.

Integrated physical and ML models synergistically can accurately predict reflow profiles of solder joints and alleviate the expense of repeated trials. Using this system, the reflow oven temperature settings to achieve the desired reflow profile can be obtained at substantially reduced computation cost.

The prediction of the reflow profile subjected to varied temperature settings of the reflow oven is beneficial to process engineers when reflowing bulky components. The study of reflowing a new PCB assembly can be started at the early stage of board design with no need for a physical profiling board prototype.

This study provides a smart solution to determine the optimal preset temperatures of the reflow oven, which is usually relied on experience. The hybrid physics–ML model providing accurate prediction with the significantly reduced expense is used in this application for the first time.

The paper's goal is to examine and illustrate the useful uses of submodeling in finite element modeling for topology optimization and stress analysis. The goal of the study is to demonstrate how submodeling – more especially, a 1D approach – can reliably and effectively produce ideal solutions for challenging structural issues. The paper aims to demonstrate the usefulness of submodeling in obtaining converged solutions for stress analysis and optimized geometry for improved fatigue life by studying a cantilever beam case and using beam formulations. In order to guarantee the precision and dependability of the optimization process, the developed approach will also be validated through experimental testing, such as 3-point bending tests and 3D printing. Using 3D finite element models, the 1D submodeling approach is further validated in the final step, showing a strong correlation with experimental data for deflection calculations.

The authors conducted a literature review to understand the existing research on submodeling and its practical applications in finite element modeling. They selected a cantilever beam case as a test subject to demonstrate stress analysis and topology optimization through submodeling. They developed a 1D submodeling approach to streamline the optimization process and ensure result validity. The authors utilized beam formulations to optimize and validate the outcomes of the submodeling approach. They 3D-printed the optimized models and subjected them to a 3-point bending test to confirm the accuracy of the developed approach. They employed 3D finite element models for submodeling to validate the 1D approach, focusing on specific finite elements for deflection calculations and analyzed the results to demonstrate a strong correlation between the theoretical models and experimental data, showcasing the effectiveness of the submodeling methodology in achieving optimal solutions efficiently and accurately.

The findings of the paper are as follows: 1. The use of submodeling, specifically a 1D submodeling approach, proved to be effective in achieving optimal solutions more efficiently and accurately in finite element modeling. 2. The study conducted on a cantilever beam case demonstrated successful stress analysis and topology optimization through submodeling, resulting in optimized geometry for enhanced fatigue life. 3. Beam formulations were utilized to optimize and validate the outcomes of the submodeling approach, leading to the successful 3D printing and testing of the optimized models through a 3-point bending test. 4. Experimental results confirmed the accuracy and validity of the developed submodeling approach in streamlining the optimization process. 5. The use of 3D finite element models for submodeling further validated the 1D approach, with specific finite elements showing a strong correlation with experimental data in deflection calculations. Overall, the findings highlight the effectiveness of submodeling techniques in achieving optimal solutions and validating results in finite element modeling, stress analysis and optimization processes.

The originality and value of the paper lie in its innovative approach to utilizing submodeling techniques in finite element modeling for structural analysis and optimization. By focusing on the reduction of finite element models and the creation of smaller, more manageable models through submodeling, the paper offers designers a more efficient and accurate way to achieve optimal solutions for complex problems. The study's use of a cantilever beam case to demonstrate stress analysis and topology optimization showcases the practical applications of submodeling in real-world scenarios. The development of a 1D submodeling approach, along with the utilization of beam formulations and 3D printing for experimental validation, adds a novel dimension to the research. Furthermore, the paper's integration of 1D and 3D submodeling techniques for deflection calculations and validation highlights the thoroughness and rigor of the study. The strong correlation between the finite element models and experimental data underscores the reliability and accuracy of the developed approach. Overall, the originality and value of this paper lie in its comprehensive exploration of submodeling techniques, its practical applications in structural analysis and optimization and its successful validation through experimental testing.

I have always marvelled at the beauty of a model ship that is built in a bottle. Because my father collected ship models I was able to watch a retired Danish sea captain painstakingly construct some parts outside the bottle and assemble it all within. I marvel, too, at the online public access catalogues that librarians and automation managers and cataloguers have constructed over the years at great effort and great expense. In a sense, these are similar to the ships in bottles; the OPACs are finely crafted but present only a small window to the information within our libraries. Access is still some‐what limited. Almost all of us still have to view the electronic library through glass teletypes (or perhaps VT‐100 emulation), and it is a rather narrow view.

The basic information required by trainers who wish to use video to achieve training outcomes is presented for those who are not experts at video production, do not have the time or the interest to become expert, do not have, and do not wish to develop, expertise in electronics and do not have access to sufficient organisational resources to hire an expert. The essential information needed to make experiences with video as productive, creative and problem‐free as possible is included.

Highlights the use of infrared and ultraviolet for flame detection, emission monitoring and thermal imaging. Describes the application of an infrared fire detection system at Courtaulds Chemicals and the use of thermal imaging for preventive maintenance at Blue Circle Cement.

The purpose of this paper is to develop a new measure called the Career Pathways Survey (CPS) which allows quantitative comparisons of women's beliefs about glass ceilings.

A 34‐item version of the CPS was completed by 243 women from all levels of management, mostly in Australia. An expanded 38‐item CPS was administered to another sample of women (n=307).

Analyses of data from both studies yielded a four factor model of attitudes to glass ceilings: resilience, acceptance, resignation and denial. The factors demonstrated good internal consistency.

The CPS allows a comparison of positive attitudes towards seeking promotions via resilience and denial scores, and provides feedback on negative attitudes towards seeking promotions via resignation and acceptance scores.

This new measure can be recommended for studies of women's and men's attitudes towards gender inequality in organizational leadership. Also, it could play a role in identifying sexist cultures in organizations.

Because of the scarcity of measures of glass ceiling beliefs, this study makes a major contribution to the literature on women's beliefs about barriers to career advancement.

The purpose of this study is to compare the natural lighting performance of roof skylight systems in buildings with atriums and to compare the sustainability and energy efficiency of several roof skylight systems for educational buildings with atriums.

Five roof skylight systems previously assessed in another study were adapted for simulation. In order to determine the effects of each skylight system on natural lighting, all the physical data of the building to be studied were recorded and entered into a computer.

The results of the study showed that roof skylight systems should be designed both to limit light during periods of maximum daylight to avoid such problems as glare, flare, and so on; and to direct light indoors as fully as possible during periods of limited daylight. In this regard, the “Moving Sunshade Double Layer” roof system showed better performance than the other four roof skylight systems.

In subsequent studies, roof systems appropriate for natural lighting should be studied for other plan types, hospitals, public buildings and so on. Moreover, real structures in which direct environment measurements can be taken could be used for obtaining data, instead of simulations.

Use of the roof system suggested by the research will minimize lighting and air conditioning costs, and enhance building sustainability.

This study explores methods of taking advantage of natural lighting indoors through the use of roof skylight systems, and identifies the most appropriate, sustainable and energy efficient roof skylight system for education buildings having an atrium.