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The purpose of this study was to perform thermo-mechanical deformation and stress analysis in a functionally graded (FG) hollow cylinder considering steady-state temperature distribution under the effect of rotation, gravity and constant heat generation.

Navier's equation was used to solve the problem, and the obtained results were validated with benchmarks found to be in excellent agreement. The variation of temperature and other material properties such as Young's modulus, density, thermal expansion coefficient and thermal conductivity varied radially as per power-law variation.

The effect of rotation was found to be vital compared to gravity and heat generation when compared individually and in combination. The results of displacement and stresses were presented for varying grading indices.

FG cylinders have huge industrial applications as it opens the possibility of developing structures with a high strength/weight ratio. The present study will benefit industries in identifying the effective grading index that can be used by industries for fabricating FG structures.

The effect of rotation, body force and heat generation on a cylindrical body has not been studied before. Furthermore, the combined effect of rotation, body force and heat generation has been studied to understand the behaviour of cylinders operating under similar conditions.

This paper seeks to review recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging.

Of the 91 journal papers, 59 were published in 2005‐2007 and topics related to wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging are reviewed.

Research on advanced wire bonding is continuously performed for advanced and complex applications such as stacked‐dies wire bonding, wire bonding of low‐k ultra‐fine‐pitch devices, and copper wire bonding. Owing to its many advantages, flip chip using adhesive has gained more popularity. Research on the reliability of lead‐free solder joints is being conducted world‐wide. The new challenges, solutions and new developments are discussed in this paper.

Because of page limitation of this review paper and the large number of the journal papers available, only a brief review is conducted. Further reading is needed for more details.

This review paper attempts to provide introduction to recent developments and the trends in terms of the topics for advanced microelectronics packaging. With the references provided, readers may explore more deeply, focusing on a particular issue.

The purpose of this paper was to study the combined effect of hygro and thermo-mechanical behavior on a plastic encapsulated micro-electro-mechanical systems (MEMS) package during the reflow process after exposed to a humid environment for a prolonged time. Plastic encapsulated electronic packages absorb moisture when they are subjected to humid ambient conditions.

Thus, a comprehensive stress model is established for a three-axis accelerometer MEMS package, with detailed considerations of fundamentals of mechanics such as heat transfer, moisture diffusion and hygro-thermo-mechanical stress. In this study, the mold compound is considered to be the most critical plastic material in MEMS package. Other plastic components of thin film materials can be disregarded due to their small sizes such as die attach and Bismaleimide Triazine (BT) core, even though they are also susceptible to moisture. Thus, only the moisture-induced properties of mold compound were obtained from the proposed experiments. From the desorption measurement after preconditioning at 85°C/85 per cent relative humidity (RH), the saturated moisture content and diffusivity were obtained by curve fitting the data to Fick’s equation. In addition, a new experimental setup was devised using the digital image correlation system together with a precision weight scale to obtain the coefficient of hygroscopic swelling (CHS) at different temperatures.

The experimental results show that the diffusion coefficient of mold compound material follows Arrhenius equation well. Also, it is shown that the CHS of mold compound increases as temperature increases. Experimentally obtained moisture properties were then used to analyze the combined behavior (thermo-hygro-mechanical) of fully saturated MEMS package during the reflow process using a finite element analysis (FEA) with the classical analogy method. Finally, the warpage and stresses inside the MEMS package were analyzed to compare the effects of hygroscopic, thermal and hygro-thermo-mechancal behaviors.

In this study, unlike the other researches, the moisture effects are investigated specifically for MEMS package which is relatively smaller in scale than conventional electronic packages. Also, as a conjugated situation, MEMS package experiences both humid and temperature during the moisture resistance test. Thus, major objective of this study is to verify stress state inside MEMS package during the reflow process which follows the preconditioning at 85°C/85 per cent RH. To quantify the stresses in the package, accurate information of material properties is experimentally obtained and used to improve modeling accuracy.

An accurate prediction of process-induced residual stress is necessary to prevent large distortion and cracks in gas metal arc (GMA)-based additive manufactured parts, especially thin-walled parts. The purpose of this study is to present an investigation into predicting the residual stress distributions of a thin-walled component with geometrical features.

A coupled thermo-mechanical finite element model considering a general Goldak double ellipsoidal heat source is built for a thin-walled component with geometrical features. To confirm the accuracy of the model, corresponding experiments are performed using a positional deposition method in which the torch is tilted from the normal direction of the substrate. During the experiment, the thermal cycle curves of locations on the substrate are obtained by thermocouples. The residual stresses on the substrate and part are measured using X-ray diffraction. The validated model is used to investigate the thermal stress evolution and residual stress distributions of the substrate and part.

Decent agreements are achieved after comparing the experimental and simulated results. It is shown that the geometrical feature of the part gives rise to an asymmetrical transversal residual stress distribution on the substrate surface, while it has a minimal influence on the longitudinal residual stress distribution. The residual stress distributions of the part are spatially uneven. The longitudinal tensile residual stress is the prominent residual stress in the central area of the component. Large wall-growth tensile residual stresses, which may cause delamination, appear at both ends of the component and the substrate–component interfaces.

The predicted residual stress distributions of the thin-walled part with geometrical features are helpful to understand the influence of geometry on the thermo-mechanical behavior in GMA-based additive manufacturing.

The purpose of this paper is to develop a novel method for analyzing wheel-rail (W-R) contact using thermo-mechanical measurements and study the effects of heating on the characteristics of W-R contact under different creepages.

This study developed an implicit-explicit finite element (FE) model which could solve both partial slip and full sliding problems by setting different angular velocities on the wheels. Based on the model, four material types under six different creepages were simulated.

The results showed that frictional heating significantly affected the residual stress distribution under large creepage conditions. As creepage increased, the temperature of the wheel tread and rail head rose and the peak value was located at the trailing edge of the contact patch.

The proposed FE model could reduce computational time and thus cost to about one-third of the amount commonly found in previous literature. Compared to other studies, these results are in good agreement and offer a reasonable alternative method for analyzing W-R contact under various conditions.

The peer review history for this article is available at: https://publons.com/publon/10.1108/ILT-07-2019-0298

This study aims to present a more accurate lifetime prediction model considering solder chemical composition.

Thermal cycling and standard creep tests as well as finite element simulation were used.

The study found lower error in the solder joint lifetime evaluation. The higher the Ag content is, the higher the lifetime is achieved.

It is confirmed.

The current investigation aims at observing the influence of the cooling channel on the thermal and residual stress behavior of the selective laser melting (SLM)316L uni-layer thermo-mechanical model.

On a thermo-mechanical model with a cooling channel, the effect of scanning direction, parallel and perpendicular and scan spacing was simulated. The effect of underlying solid and powder bases was evaluated on residual stress profile and thermal variables at various locations.

The high heat dissipation of solid base due to high cooling rates and steep thermal gradients can reciprocate with smaller melt pool temperature and melt pool size. Given the same scan spacing, residual stresses were found lower when laser scanning was perpendicular to the cooling channel. Moreover, large scan spacing was found to increase residual stresses.

Cooling channels are increasingly being used in additive manufacturing; however, their effect on the residual stress behavior of the SLM component is not extensively studied. This research can serve as a foundation for further inquiries into the impact of base material design such as cooling channels on manufactured components using SLM.

The purpose of this paper is to assess the thermo-mechanical reliability of a solder bump with different underfills, with the evaluation of different underfill materials. As there is more demand in higher input/output, smaller package size and lower cost, a flip chip mounted at the module level of a board is considered. However, bonding large chips (die) to organic module means a larger differential thermal expansion mismatch between the module and the chip. To reduce the thermal stresses and strains at solder joints, a polymer underfill is added to fill the cavity between the chip and the module. This procedure has typically, at least, resulted in an increase of the thermal fatigue life by a factor of ten, as compared to the non-underfilled case. Yet, this particular case is to deal with a flip chip mounted on both sides of a printed circuit board (PCB) module symmetrically (solder bump interconnection with Cu-Pillar). Note that Cu-Pillar bumping is known to possess good electrical properties and better electromigration performance. The drawback is that the Cu-Pillar bump can introduce high stress due to the higher stiffness of Cu compared to the solder material.

As a reliability assessment, thermal cyclic loading condition was considered in this case. Thermal life prediction was conducted by using finite element analysis (FEA) and modified Darveaux’s model, considering microsize of the solder bump. In addition, thermo-mechanical properties of four different underfill materials were characterized, such as Young’s modulus at various temperatures, coefficient of temperature expansion and glass transition temperature. By implementing these properties into FEA, life prediction was accurately achieved and verified with experimental results.

The modified life prediction method was successfully adopted for the case of Cu-Pillar bump interconnection in flip chip on the module package. Using this method, four different underfill materials were evaluated in terms of material property and affection to the fatigue life. Both predicted life and experimental results are obtained.

This study introduces the technique to accurately predict thermal fatigue life for such a small scale of solder interconnection in a newly designed flip chip package. In addition, a guideline of underfill material selection was established by understanding its affection to thermo-mechanical reliability of this particular flip chip package structure.

Present‐day electronics are shifting increasingly towards surface mounting technology (SMT) and hybrid technology (thick and thin film), which offer greater advantages due to their fabrication processes. Capacitors, like other components used in these processes, must occupy the smallest volume possible. Because of miniaturisation of the capacitors, the reliability of the surface mounting process is affected not only by the reliability of the components themselves but also by that of the assembly. In this study, a thermo‐mechanical simulation has been performed by means of ANSYS software based on the finite element method. This paper deals with the evaluation of a ceramic capacitor module (capacitors soldered on copper lands) on FR‐4 or alumina substrates during cooling to room temperature (25°C). The parameters of the assembly — temperature, length and thickness of the capacitor, thickness of the solder joint and nature of the substrate — were chosen by using the Design Of Experiments (DOE) method, which permits optimisation of these parameters and reduces the investigation time. The results showed a correlation between the length of the capacitor and the nature of the substrate used. Greater capacitor length is required for alumina substrate while a shorter length is preferred for FR‐4. It appears that a solder joint more than 100 urn thick may induce significant constraints on the copper lands and on the capacitor leads. It was noted that shear stress and voids in the solder joint can occur at temperatures higher than 250°C. This investigation makes it possible to prevent thermo‐mechanical stress damage during the mounting process and gives some recommendations for the choice of assembly variables.

The sustainability of the structures is not only a technical goal, but also a matter of social and environmental values. This requires the researchers to use very rigid, highly durable and corrosion-resistant composite structures in order to achieve the technical, environmental and social goals. The purpose of this paper is to present an original work on reducing the interfacial stresses of bonded structures with fibre-reinforced polymers (FRP) plates based on new taper design.

In this proposed concept, the effect of combined taper is investigated on reducing interfacial stresses, attempting to enhance the structure performance and address the debonding problem that comes with reinforcing techniques. This research is carried out by using finite element analysis, incorporating many new parameters.

As a result, a new solution is discovered that combined taper in both adhesive layer and composite laminate, which significantly reduces the interfacial stresses at the end of the FRP plate. Additionally, a parametric study is carried out in order to determine the optimal configurations of taper dimensions as well as other parameters that influence the stress concentration distribution at the edge of the adherends.

This new design regarding the reduction of interfacial stresses will help in increasing the lifespan of damaged structures reinforced by FRP composites, preserving thus its technical, historical and social values.

The paper uses straight, concave and convex fillets with inverse taper as a new design solution with new parameters including thermo-mechanical loads and pre-stressed FRP plate with multi-layer, fibre orientation and shear-lag effects.