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Understanding and tailoring the solidification characteristics and microstructure evolution in as-built parts fabricated by laser powder bed fusion (LPBF) is crucial as they influence the final properties. Experimental approaches to address this issue are time and capital-intensive. This study aims to develop an efficient numerical modeling approach to develop the process–structure (P-S) linkage for LPBF-processed Inconel 718.

In this study, a numerical approach based on the finite element method and cellular automata was used to model the multilayer, multitrack LPBF build for predicting the solidification characteristics (thermal gradient G and solidification rate R) and the average grain size. Validations from published experimental studies were also carried out to ensure the reliability of the proposed numerical approach. Furthermore, microstructure simulations were used to develop P-S linkage by evaluating the effects of key LPBF process parameters on G × R, G/R and average grain size. A solidification or G-R map was also developed to comprehend the P-S linkage.

It was concluded from the developed G-R map that low laser power and high scan speed will result in a finer microstructure due to an increase in G × R, but due to a decrease in G/R, columnar characteristics are also reduced. Moreover, increasing the layer thickness and decreasing the hatch spacing lowers the G × R, raises the G/R and generates a coarse columnar microstructure.

The proposed numerical modeling approach was used to parametrically investigate the effect of LPBF parameters on the resulting microstructure. A G-R map was also developed that enables the tailoring of the as-built LPBF microstructure through solidification characteristics by tuning the process parameters.

Overall, selection maps about the extent of the eutectic growth projects the solidification velocities leading to given microstructures. This is because of limitations of most of the set of results when obtained for single thermal gradients within the experimental spectrum. In these cases, associations only with the solidification velocity could give the false impression that reaching a given velocity would be enough to reproduce a result. However, that velocity must necessarily be accompanied by a specific thermal gradient during transient solidification. Therefore, the purpose of this paper is to not only project velocity but also include the gradients acting for each velocity.

Compilation of solidification velocity, v, thermal gradient, G, and cooling rate, Ṫ, data for Sn-Cu and Sn-Bi solder alloys of interest is presented. These data are placed in the form of coupled growth zones according to the correlated microstructures in the literature. In addition, results generated in this work for Sn-(0.5, 0.7, 2.0, 2.8)% Cu and Sn-(34, 52, 58)% Bi alloys solidified under non-stationary conditions are added.

When analyzing the cooling rate (Ṫ = G.v) and velocity separately, in or around the eutectic composition, a consensus cannot be reached on the resulting microstructure. The (v vs. G) + cooling rate diagrams allow comprehensive analyzes of the combined v and G effects on the subsequent microstructure of the Sn-Cu and Sn-Bi alloys.

The present paper is devoted to the establishment of (v vs. G) + cooling rate diagrams. These plots may allow comprehensive analyses of the combined v and G effects on the subsequent microstructure of the Sn-Cu and Sn-Bi alloys. This microstructure-processing mapping approach is promising to predict phase competition and resulting microstructures in soldering of Sn-Cu and Sn-Bi alloys. These two classes of alloys are of interest to the soldering industry, whereas manipulation of their microstructures is considered of utmost importance for the metallurgical quality of the product.

The aim of this paper is to determine a parallel computational methodology for simultaneously predicting the macro/micro scale phenomena occurring during solidification processing with external electromagnetic stirring.

Macro and micro phenomena occurring in an electromagnetically‐stirred solidifying melt are simulated using a numerical model that integrates the finite element methodology for transport phenomena and the Monte‐Carlo cellular‐automata method for microstructure formation. Parallel algorithm is introduced to enhance the computational efficiency.

Computed results show that parallel algorithm can be effective in enhancing the computational efficiency of a combined macro/micro model if it is applied appropriately. Also, electromagnetically induced stirring can have a strong effect on the nucleation and grain growth and hence the final solidification microstructure.

This paper fulfils a need for developing an efficient numerical methodology to simulate complex electromagnetically‐assisted transport phenomena and microstructure formation during solidification processing systems.

This paper aims to analyze the different between matrix and overhanging structure and indicate the laws and mechanism of overhanging structure formed by selective laser melting (SLM).

This paper includes processing the matrix and overhanging structure with optimized parameters and analyzing the microstructure and properties of matrix and overhanging with OM, SEM, XRD etc. so as to analyze and reveal the laws and mechanism of overhanging structure formed by SLM.

The solidification of overhanging structure begins from the structure’s edge and extends to its center; the distribution of the Cr with a diameter of 250 nm in the Fe matrix is uniform; the grain in the overhanging structure is growing faster than the grain in the matrix. The overhanging structure mainly composed by austenite has no apparent layer. Moreover, the microhardness of the overhanging structure is 258.6-294.0 Hv0.3, smaller than the microhardness of the matrix which is 236.4-300.9 Hv0.3.

This paper clarifies how to manufacture overhanging structure and non-overhanging structure matrix with optimized parameters, analyzes the microstructures and compares the properties of both overhanging structure and non-overhanging structure “matrix”, so as to analyze the reasons for the forming of the overhanging structure, which in turn lauds basic data foundation for the theoretical studies in the future.

Additive manufacturing (AM) is revolutionizing the manufacturing industry due to several advantages and capabilities, including use of rapid prototyping, fabrication of complex geometries, reduction of product development cycles and minimization of material waste. As metal AM becomes increasingly popular for aerospace and defense original equipment manufacturers (OEMs), a major barrier that remains is rapid qualification of components. Several potential defects (such as porosity, residual stress and microstructural inhomogeneity) occur during layer-by-layer processing. Current methods to qualify AM parts heavily rely on experimental testing, which is economically inefficient and technically insufficient to comprehensively evaluate components. Approaches for high fidelity qualification of AM parts are necessary.

This review summarizes the existing powder-based fusion computational models and their feasibility in AM processes through discrete aspects, including process and microstructure modeling.

Current progresses and challenges in high fidelity modeling of AM processes are presented.

Potential opportunities are discussed toward high-level assurance of AM component quality through a comprehensive computational tool.

The net power delivered to the surface of parts (i.e. the actual heat flux) is a key parameter in the laser melting process and its exact control has a great impact on the numerical solutions. In this paper, the impact of laser additive manufacturing parameters including laser power, scanning speed and powder injection rate on thermal efficiency, net power delivered to the part and power loss due to powder flow has been investigated.

The response surface method was applied to measure the net laser power in laser deposited Inconel 718 using k-type thermocouples. The temperature history obtained by thermocouples was used to calculate the net power delivered by inverse analysis method. The applied model is Rosenthal's optimized model, in which all the thermal properties of the material are considered to vary with temperature.

The results indicated that the thermal efficiency, power delivered to the part and power loss can be optimized simultaneously at laser power of 400 W, scanning speed of 2 mm/s and powder injection rate of 200 mg/s. The microstructure analysis indicated that a high-quality sample without microstructural defects was formed under optimal condition of parameters. Moreover, the primary dendrite arm spacing for the optimal sample was higher than that obtained for other samples.

The novelty of this research summarized as follows: Prediction of the thermal efficiency and power loss during the laser metal deposition of Inconel 718 superalloy using the inverse analysis. Finding the optimal values of thermal efficiency, power delivered to the surface and power loss in the laser metal deposition of Inconel 718 superalloy. Investigating the effect of laser power, powder injection rate and scanning speed on the thermal efficiency and power loss of Inconel 718 superalloy during the laser metal deposition.

Wire + arc additive manufacturing (WAAM) uses existing welding technology to make a part from metal deposited in an almost net shape. WAAM is flexible in that it can use multiple materials successively or simultaneously during the manufacturing of a single component.

In this work, a gas metal arc welding (GMAW) based wire + arc additive manufacturing (WAAM) system has been developed to use two material successively and fabricate bimetallic additively manufactured structure (BAMS) of low carbon steel and AISI 316L stainless steel (SS).

The interface shows two distinctive zones of LCS and SS deposits without any weld defects. The hardness profile shows a sudden increase of hardness at the interface, which is attributed to the migration of chromium from the SS. The tensile test results show that the bimetallic specimens failed at the LCS side, as LCS has lower strength of the materials used.

The microstructural features and mechanical properties are studied in-depth with special emphasis on the bimetallic interface.

The purpose of this paper is to obtain a finite difference method (FDM) solution using control volume for heat transport by conduction and the heat absorption by the enthalpy model in the sand mixture used in casting manufacturing processes. A mixture of sand and different chemicals (binders) is used as moulding materials in the casting processes. The presence of various compounds in the system improve the complexity of the heat transport due to the heat absorption as the binders are decomposing and transformed into gaseous products due to significant heat shock.

The geometrical domain were defined in a 1D polar coordinate system and adapted for numerical simulation according to the control volume-based FDM. The simulation results were validated by comparison to the temperature measurements under laboratory conditions as the sand mould mixture was heated by interacting with a liquid alloy.

Results of validation and simulation methods were about high correspondence, the numerical method presented in this paper is accurate and has significant potential in the simulation of casting processes.

Both numerical solution (definition of geometrical domain in 1D polar coordinate system) and verification method presented in this paper are state-of-the-art in their kinds and present high scientific value especially regarding to the topic of numerical modelling of heat flow and foundry technology.

As a literature review article, the purpose of this paper is to highlight the intricate interaction and correlation between the interconnection microstructure and the failure mechanism. It is therefore critical to summarize all the challenges in understanding solder solidification of interconnections.

Literature review.

Solidification of solder interconnections is therefore critical because it is the process during which the solder interconnection is formed. The as‐solidified microstructure serves as the starting point for all failure modes. Because of the miniaturization of electronics, the interconnection size decreases continuously, already to such a range that solder solidification takes place remarkably differently from the bulk ingot, on which solidification studies have been focused for decades. There are many challenges in understanding the solidification of tiny solder interconnections, including the complex metallurgical system, dynamic solder composition, supercooling and actual solidification temperature, localized temperature field, diverse interfacial IMC formation, and so on, warranting further research investment on solder solidification.

This paper provides a critical overview of the concerns in solidification study for lead‐free solder interconnection. It is probably an article initiating more attention towards solidification topics.

The aim of the present work is to study the effect of processing conditions on solidification path and resultant microstructure and further predict the solidification behavior of gas-atomized Sn-5mass%Pb droplets.

Combined with previous models for in-flight droplet nucleation and non-equilibrium solidification, a simulation method is applied to four typical containerless solidification conditions with helium, nitrogen or argon gas at two different gas jet velocities, in the presence of 10 or 500 ppm oxygen. The simulation outputs distribution of primary dendrite composition, tip velocity and tip radius with radial distance from the nucleation point, and the fraction solid at the end of recalescence and the post-recalescence duration. Both surface and internal nucleation are considered. The possible dendritic fragmentation in the post-recalescence stage is also discussed.

Result indicates that dendritic fragmentation is not likely to occur in droplets solidifying along the paths considered in the simulation.

The simulation method applies to any droplet-based solidification process for which droplet cooling schedule is known and thus provides a scientific basis for powder quality assurance.