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The Microelectronics Division of the Radio Measurement Engineering Research Institute of Lithuania has developed a unique photoimageable thick film chemistry and process technology which has been in use since the mid‐1980s. The main application of the technology was for complex thick film microwave integrated circuits at lower cost than equivalent thin film devices. The paper describes the photoimageable materials and processing used at the Institute and also gives examples of suitable application in the microwave, high density interconnect, sensor and component fields.

Dates: 29–31 May 1991 Venue: De Doelen Conference Centre, Rotterdam, The Netherlands The Benelux Chapter of the International Society for Hybrid Microelectronics will be organising the 8th European Microelectronics Conference. The event will take place at ‘De Doelen’, Rotterdam, The Netherlands, from 29 to 31 May 1991.

This paper aims to present certain issues in direct bonded copper (DBC) technology towards the manufacture of Al2O3 or AlN ceramic substrates with one or both sides clad with a copper (Cu) layer.

As part of the experimental work, attempts were made to produce patterns printed onto DBC substrates based on four substantially different technologies: precise cutting with a diamond saw, photolithography, the use of a milling cutter (LPKF ProtoMat 93s) and laser ablation with differential chemical etching of the Cu layer.

The use of photolithography and etching technology in the case of boards clad with a 0.2-mm-thick Cu layer, can produce conductive paths with a width of 0.4 mm while maintaining a distance of 0.4 mm between the paths, and in the case of boards clad with a 0.3-mm-thick copper layer, conductive paths with a width of 0.5 mm while maintaining a distance of 0.5 mm between paths. The application of laser ablation at the final step of removing the unnecessary copper layer, can radically increase the resolution of printed pattern even to 0.1/0.1 mm. The quality of the printed pattern is also much better.

Etching process optimization and the development of the fundamentals of technology and design of power electronic systems based on DBC substrates should be done in the future. A limiting factor for further research and its implementation may be the relatively high price of DBC substrates in comparison with typical PCB printed circuits.

Several examples of practical implementations using DBC technology are presented, such as full- and half-bridge connections, full-wave rectifier with an output voltage of 48 V and an output current of 50 A, and part of a battery discharger controller and light-emitting diode illuminator soldered to a copper heat sink.

The paper presents a comparison of different technologies used for the realization of precise patterns on DBC substrates. The combination of etching and laser ablation technologies radically improves the quality of DBC-printed patterns.

A review of state‐of‐the‐art technology pertinent to tape automated bonding (for fine pitch, high I/O, high performance, high yield, high volume and high reliability) is presented. Emphasis is placed on a new understanding of the key elements (for example, tapes, bumps, inner lead bonding, testing and burn‐in on tape‐with‐chip, encapsulation, outer lead bonding, thermal management, reliability and rework) of this rapidly moving technology.

There have been many technological changes in this century, but the most influential is the recent revolution in electronics and its applications. As a result, so much was said and written last year about microelectronics that some people called it, incorrectly in my view, the year of the microprocessor. Most microelectronic devices look alike so I will start by defining the terms I shall use.

This study aims to propose the increase of heat dissipation requirements of modern electronic equipment and the fast development of micro-scale manufacturing technologies. The heat transfer mechanism is studied in-depth, especially for its pattern of secondary flow caused by the repeated inversion of centrifugal force. Effects of η on the frictional pressure drop and average Nusselt number are studied and the performance of such microchannel heat sink with various bend amplitudes is comprehensively evaluated. These results can provide important insight into the optimal design of this novel design configuration for microelectronics cooling.

A three-dimensional model based on the finite volume approach and SIMPLEC algorithm is performed to test an innovative serpentine microchannel, which behaves differently from conventional serpentine microchannel due to the significant effect of centrifugal force inversion.

The effect of centrifugal force significantly influences the flow and thermal fields which are responsible for the enhancement in heat transfer coefficient. The number, size and intensity of vortices increase with increasing Re, and the vortices are reformed at every change of the geometry in a periodic fashion. The serpentine microchannel studies more effectively at larger bend amplitude. Pressure fluctuations and temperature variation are greater with increasing bend amplitude.

Several techniques have been developed to augment single-phase convective heat transfer in channels. One technique is to use a serpentine channel that enhances the heat transfer due to flow mixing and periodic interruption of thermal boundary layers. This technique has been applied to micro-heat exchangers, thermal regenerators and mini/microreactors.

The optimal design of this novel design configuration for microelectronics cooling can be attained. It will become an effective cooling technology for solving the increasing of heat dissipation requirements of modern electronic equipment.

The flow and heat transfer characteristics are first presented for the circular serpentine microchannel made up of alternate U-bends without interposed straight segments. The present study first examines the effect of such centrifugal force inversion on velocity contour, pressure distribution and temperature distribution. The patterns of secondary flow along the flow passage caused by the repeated inversion of centrifugal force are further studied in depth. The effect of bend amplitude on the flow and heat transfer is explored and the performance of such microchannel heat sink has been comprehensively evaluated.