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Packaging represents an essential issue for marketers in terms of effectively communicating the product’s benefits, especially in the case of organic food products. Because of logistical advantages, rectangular packaging is frequently used for organic food products. However, the question arises whether packaging alignment may significantly influence consumers’ decision-making at the point of sale. Therefore, this paper aims to examine the effects of rectangular packaging alignment (vertical vs horizontal) on consumer perception in the context of organic food products.

On the basis of the empirical results of a pilot study, a between-subjects online experiment with a sample size of 699 participants and two conditions (vertical vs horizontal packaging alignment) was performed. Analyses of covariance and PROCESS mediation analysis were used for data analysis.

The results of two empirical studies confirm the relevance of differences in consumers’ horizontal and vertical information processing for the research context of organic food and provide evidence for the assumed relevance of packaging alignment by ultimately showing a change in packaging alignment affects consumers’ willingness to pay. Importantly, this effect is mediated by utilitarian value perception.

This paper importantly contributes to research on packaging design of organic food products. Specifically, the relevance of an efficient utilitarian value perception for the consumer’s willingness to pay is highlighted in this context. Potential implications of these results for companies, consumers and public health are discussed.

The purpose of this paper is to investigate and theoretically explain how line managers and lower-status experts work together in public health-care organizations. Hence, this study explores how lower-status experts influence line managers' decision-making and task prioritizing in order to guide staff experts' cooperation and performance improvements.

The authors used a qualitative method for data collection and analysis of the experts' and line managers' explanations about their cooperation. A theoretical approach of experts' identity positioning, in terms of differences and similarities, was used in analyzing the interaction between managers and experts.

This study shows that similarities and differences in positioning acts exist simultaneously. Similarity is constructed by way of strategic and professional alignment with the line managers' core tasks. Differences stem from the distinction between knowledge-grounded skills and professional attributes such as language, analytical tools, and jargon. Lower-status experts need to leave their entrenched positions and match the professional status of line managers in both knowledge aspirations and appearance to reach a respected approach of experts' identity positioning.

Unlike many previous studies, this study demonstrates that similarities and differences in positioning acts exist simultaneously.

The aim of the research was to evaluate the concept that utilizes structured planar substrates based on low temperature co‐fired ceramics (LTCC) as a precision platform for the passive alignment of a multimode fiber and wide‐stripe diode laser.

Presents the manufacturing process for realisation of 3D precision structures, heat dissipation structures and a cooling channel into the LTCC substrate. The developed methodology for 3D modelling and simulation of the system was used to optimize structures, materials and components in order to achieve optimal performance for the final product and still maintain reasonably low fabrication costs. The simulated optical coupling efficiency and alignment tolerances were verified by prototype realization and characterization.

The achieved passive alignment accuracy allows high coupling efficiency realisations of multimode fiber pigtailed laser modules and is suitable for mass production.

Provides guidance in the design of LTCC precision platforms for passive alignment and presents a hybrid simulation method for photonics module concept analysis.

The three‐dimensional shape of the laminated and fired ceramic substrate provides the necessary alignment structures including holes, grooves and cavities for the laser to fiber coupling. Thick‐film printing and via punching can be incorporated in order to integrate electronic assemblies directly into the opto‐mechanical platform.

Introduces the LTCC 3D precision structures for photonics modules enabling passive alignment of multimode fiber pigtailed laser with high efficiency optical coupling. Demonstrates the hybrid simulation methodology for concept analysis.

This paper investigates how to design traditional ready-to-eat food packaging by manipulating its shape, font and slogan to promote consumer buying intention and willingness to pay (WTP).

Two package designs, interplaying the square shapes (vertical vs horizontal), font formality (formal vs less formal/casual) and slogans (ethno-positioning vs short and catchy), were created and tested in an online experiment with 483 participants.

The results revealed that the differed package designs elicited relatively equal levels of attractiveness to consumers and their buying intentions. However, the designs significantly differentiated consumers' WTP. The results further show the significant direct and indirect effects on WTP of packaging attractiveness when it is moderated by package designs and mediated by buying intention. However, the varied package designs did not have significant direct or indirect impacts on WTP when mediated by packaging attractiveness and buying intention.

The vertical square-shaped packaging, written in a less formal font and highlighting a short and catchy slogan, is more financially promising for marketers to get a better price for local food products perceived as hedonic and bought impulsively on casual occasions. Furthermore, besides prominent package design elements such as font, color, size, material and picture, packaging designers or marketing practitioners should consider other supporting factors, such as shelf efficiency.

This study complements existing studies of “cue utilization theory” and “packaging design theory” by demonstrating the importance of extrinsic packaging cues, such as shape, font style and slogan, in improving consumers' WTP for traditional food products. The study also fills some gaps in the literature by exploring the direct, mediating and moderating relationships between package design, packaging attractiveness, buying intention and WTP, especially in an emerging market such as Indonesia.

The purpose of this paper is to identify and describe the strategic potential of logistics‐driven packaging innovation in retail supply chains, and suggest propositions for further research and development, providing practitioners with a better basis on which to make strategic packaging and logistics decisions.

An in‐depth case study was conducted at a large global retailer which had implemented an innovative unit load carrier. The case study highlights a previously inaccessible phenomenon, as this type of unit load carrier has only been implemented on a large‐scale in the studied retailer's supply chain. In order to explore the impact of the innovative unit load carrier, the case study draws on a longitudinal research approach.

The case study demonstrates the potential of logistics‐driven packaging innovation in retail supply chains. It provides detailed insights into the impact of an innovative unit load carrier on different supply chain echelons. These insights emphasise the need for a systems perspective in order to understand the total impact of packaging innovations on supply chains.

The case study focuses on the impact of a particular innovation on a particular supply chain. Even though the consequences in other supply chains may be different, this study provides detailed explanations and illustrative examples which generate insights relevant to other firms and supply chains.

This paper provides an understanding of potential trade‐offs between standardised and differentiated packaging, providing practitioners with a better basis for making decisions on packaging design and development.

The paper illustrates the need to consider packaging as a strategic component which contributes to overall supply chain performance. To support strategic packaging decision‐making propositions for packaging innovation in retail supply chains are provided.

Front-of-packaging (FOP) is a critical branding tool that uses “cues” to communicate product attributes and establish distinct brand images. This paper aims to understand how food brands utilize cues and their relative proportions to hierarchically communicate brand image and belonging to particular subcategories.

A content analysis is used for analysing 543 food FOPs sold in Australia (breakfast cereals, chips, snack bars). Samples are collected and classified into product sub-categories defined by ingredients, consumer-audience and retail placement. A novel 10 × 10 coding grid is applied to each FOP to objectively analyse cue proportion, with statistical comparison undertaken between sub-categories.

Results reveal intrinsic cues are favoured over extrinsic cues, except for those in the eatertainment sub-category. Hierarchies are evidenced that treat product and branding cues as primary, with health cues secondary. Statistically significant differences in cue proportions are consistently evident across breakfast cereals, chips and snack-bar FOPs. Clear differentiation is evidenced through cue proportions on FOP for health/nutrition focused sub-categories and eatertainment foods.

“Cue utilization theory” research is extended to an evaluation of brand encoding (not consumer decoding). Design conventions reveal how cue proportions establish a dialogue of communicating brand/product image hierarchically, the trade-offs that occur, a “meso-level” to Gestalt theory, and achieving categorization through FOP cue proportions. Deeper understanding of packaging design techniques provides inter-disciplinary insights that extend consumer behaviour, retailing and design scholarship.

The advent of novel advanced packaging technologies such as multilayer thin‐film interconnect, combined with continuous improvements in IC clock speed and circuit performance, has placed extreme demands on electronics packaging and package materials. Aluminium nitride (AIN) ceramic offers significant opportunities and advantages for package design, particularly where the effective thermal management and overall reliability of large devices are a high priority. AIN has already been successfully employed at the substrate level for the enhanced thermal relief of power devices. Examples of these applications include heat sinks and device mounts for thyristor modules, power transistors, solid state relays, power SCRs, switching modules, LEDs and various RF package configurations. Both bare and metallised AIN substrates are beginning to find application as a substitute for beryllia (BeO) in mass market and high reliability automotive electronics applications. Successfully implementing AIN in a high level electronics packaging application requires a systems approach in which the intrinsic properties of AIN are considered as ‘first principles’ in shaping the package design process. The unique physicochemical and mechanical properties of AIN require the development of specialised metallisation and co‐firing processes to fabricate the advanced components necessary for hermetic packaging of complex devices and multichip modules. This paper presents a practical and mass manufacturable AIN‐based package tailored to these high level applications. The package design is unique in that it provides for the total separation of the electrical‐signal conduction from the mechanical support/mounting functions of the package. Such a separation of the functions improves both the package durability and reliability relative to currently available electronics packages of conventional designs.

To review the challenges confronting the electronics interconnection industry as it transitions into the gigahertz frequency range and to describe novel prospective solutions designed to circumvent the problems by means of alternative interconnection architectures while remaining within the confines of the existing manufacturing infrastructure.

The paper has been written in a manner so as to provide first a brief review of the history of interconnections as background reference, providing access and understanding to a broader readership of the significance of the area of investigation. From there, the paper describes the problems facing electronic circuit manufactures relative to the serious matter of assuring signal integrity of high speed interconnections. It then goes on to describe a general class of prospective solutions, which can be implemented through simple architectural changes in design and manufacture. Finally, the paper describes a prototype system which was fabricated using the concepts and the first‐order findings are provided.

From operation of the prototype system, it was found that the concepts, relative to PCB architectural changes prescribed in the paper are capable of delivering performance levels beyond what is accepted when using traditional interconnection modalities. The 10 Gbps backplane prototype has proved capable of sending a 100 mV peak‐to‐peak signal a distance of 75 cm through a two wire single differential pair which pass through two industry standard connectors. The signal generated has a ∼65 percent margin indicating it could go much further and determining the limits an object of future study. The modulation is standard NRZ. With only two wires there was no cross talk in the system, however, the next stage of investigation will consist of a multi‐device assembly to see what cross talk effect there might be, if any.

The chief value of the paper resides in its disclosure of novel approaches to electronic interconnection involving simple changes in circuit architectural structures which extend the signal performance limits of copper interconnections, well beyond present consensus expectations of industry. Moreover, the paper provides first experimental results of the technology in actual operation as proof of concept.

This paper aims to discuss the development and use of a green logistics performance index (GLPI) for easy comparison of performance among industries and countries. It uses the survey data collected from the home electronic appliance industry in China and Japan as an example to demonstrate the index development process and compare the performance of green logistics (GL) practices between the two countries using the proposed index.

Two‐sample t‐test and one‐way analysis of variance (ANOVA) were used to analyse the data collected from a questionnaire survey. Principal component analysis (PCA) was employed to derive the weights from the survey data for the GLPI.

The findings reveal that the GLPI derived using PCA is robust and gives similar results as obtained through two‐sample t‐test and ANOVA of the dataset in the comparison of performance among firms and between countries in the study.

This study lends insight into the use of an objectively derived composite index to measure and compare GL performance. To serve mainly as a proof of concept and to enhance response rate in the questionnaire survey, the scope of the study is limited to three major logistics functions in an industry in two countries.

Managers can use the GLPI to benchmark their performance in the respective logistics areas and revise their supply chain strategy accordingly. The proposed index may also assist governments in formulating policies on promoting their GL implementation.

A comprehensive composite index to benchmark GL performance can facilitate and encourage industries to invest in GL. This will help reduce negative impacts of logistics activities on the environment.

Research in GL to date has largely focused on theory and management approach. This paper fills the gap in the literature by empirically comparing GL performance among firms and countries through the use of a composite index. It also contributes to a better understanding of the association between GL performance and firm size as well as the driving factors behind it.

This paper presents the methods and results of load, deflection and electrical contact resistance experiments for reliable electronic module design using fuzz button technology. Both beryllium copper (BeCu) and molybdenum (Mo) fuzz button contacts were examined, as a function of wire diameter, button diameter and button density.