A Reliability Study of Fuzz Button Interconnects
D.B. Harris
(Pulse Embeded Computer Systems, Rockville, Maryland, USA)
M.G. Pecht
(CALCE Electronic Packaging Research Center, University of Maryland, College Park, Maryland, USA)
193
Abstract
This paper presents the methods and results of load, deflection and electrical contact resistance experiments for reliable electronic module design using fuzz button technology. Both beryllium copper (BeCu) and molybdenum (Mo) fuzz button contacts were examined, as a function of wire diameter, button diameter and button density.
Citation
Harris, D.B. and Pecht, M.G. (1995), "A Reliability Study of Fuzz Button Interconnects", Circuit World, Vol. 21 No. 2, pp. 12-18. https://doi.org/10.1108/eb046298
Publisher
:MCB UP Ltd
Copyright © 1995, MCB UP Limited