LTCC technology for cost‐effective packaging of photonic modules

Abstract

Purpose

The aim of the research was to evaluate the concept that utilizes structured planar substrates based on low temperature co‐fired ceramics (LTCC) as a precision platform for the passive alignment of a multimode fiber and wide‐stripe diode laser.

Design/methodology/approach

Presents the manufacturing process for realisation of 3D precision structures, heat dissipation structures and a cooling channel into the LTCC substrate. The developed methodology for 3D modelling and simulation of the system was used to optimize structures, materials and components in order to achieve optimal performance for the final product and still maintain reasonably low fabrication costs. The simulated optical coupling efficiency and alignment tolerances were verified by prototype realization and characterization.

Findings

The achieved passive alignment accuracy allows high coupling efficiency realisations of multimode fiber pigtailed laser modules and is suitable for mass production.

Research limitations/implications

Provides guidance in the design of LTCC precision platforms for passive alignment and presents a hybrid simulation method for photonics module concept analysis.

Practical implications

The three‐dimensional shape of the laminated and fired ceramic substrate provides the necessary alignment structures including holes, grooves and cavities for the laser to fiber coupling. Thick‐film printing and via punching can be incorporated in order to integrate electronic assemblies directly into the opto‐mechanical platform.

Originality/value

Introduces the LTCC 3D precision structures for photonics modules enabling passive alignment of multimode fiber pigtailed laser with high efficiency optical coupling. Demonstrates the hybrid simulation methodology for concept analysis.

Citation

Heilala, J., Keränen, K., Mäkinen, J.‐., Väätäinen, O., Kautio, K., Voho, P. and Karioja, P. (2005), "LTCC technology for cost‐effective packaging of photonic modules", Assembly Automation, Vol. 25 No. 1, pp. 30-37. https://doi.org/10.1108/01445150510578987