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This study aims to study the mechanical, photoelectric, and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip light-emitting diode (LED) package component during aging. By adding nanoparticles (Ni-multi-walled carbon nanotubes [MWCNTs]) to the solder paste, the shear strength and fatigue resistance of the brazed joint can be improved. However, the aging properties of Ni-modified MWCNTs composite solder joints have not been deeply studied. In this research, the mechanical, photoelectric and thermal reliability of SAC307 packaged flip-chip LEDs with Ni-MWCNTs added during aging were studied.

Compared with SAC solder alloys, the effects of different contents (0, 0.05, 0.1 and 0.2 Wt.%) of Ni-MWCNTs on the photoelectric and thermal properties of composite solder joints were examined. To study the aging characteristics of composite solder joints, the solder joints were aged at 85°C/85% relative humidity.

The addition of an appropriate amount of reinforcing agent Ni-MWCNTs reduces the density of the composite solder to 96% of the theoretical value of the SAC solder alloy. In addition, the microhardness increases and the wetting angle decreases. Two different phase compositions were observed in the solder joints with Ni-MWCNTs reinforcement: Cu₃Sn and (Cu, Ni)₆Sn₅. The solder joints of SAC307-0.1Ni-MWCNTs exhibit the highest luminous flux and luminous efficiency of flip-chip LED filaments, the lowest steady-state voltage and junction temperature. And with the extension of the aging time, its aging stability is the best. In short, when the addition amount of Ni-MWCNTs is 0.1 Wt.%, the solder joints exhibit the best wettability and the thinnest intermetallic compound layer. And the shear strength of the tested solder joints is the best, and the void ratio is the lowest. At this time, the enhancement effect of Ni-MWCNTs on the composite solder has been best demonstrated.

The content range of enhancer Ni-MWCNTs needs to be further reduced.

The authors have improved the performance of Ni-modified MWCNTs composite solder joints.

Composite solder with high performance has great practical application significance for improving the reliability and life of the whole device.

This paper aims to report a study of the influence of tungsten carbide (WC) nanoparticles on corrosion resistance properties of electroless nickel–phosphorus (Ni–P) coatings in NaCl solution.

The morphology of Ni–P–WC nanocomposite coatings was observed by scanning electron microscopy (SEM). The anodic polarization curves, electrochemical impedance spectra (EIS) and weight loss measurements were used to study the corrosion resistance properties of Ni–P–WC nanocomposite coatings in NaCl solution.

The WC nanoparticles content in the coatings increased with the increase of its concentration in the bath, and the WC nanoparticles are uniformly distributed in Ni–P alloy matrix. The results showed that the incorporation of WC nanoparticles elevated the corrosion resistance properties of Ni–P alloy matrix.

This study shows that the corrosion resistance was improved by the addition of WC nanoparticles to the Ni–P alloy matrix.

This paper aims to derive a model of growth kinetics of the intermetallic compound (IMC) layer formed in the reaction between liquid Sn-based solders and Ni particle reinforcements and to compare with the experimental data to verify the effects of Sn concentration and alloying element.

A composite solder was manufactured by mechanically introducing Ni particle reinforcements into a solder matrix. The effect of the non-reactive alloying elements, Ag, Pb and Bi, on the growth kinetics of the IMC formed between liquid Sn-based eutectic solders and Ni particles, reacting this composite solder at 250°C–280°C was studied.

Experimental results showed that only the IMC Ni₃Sn₄ was present as a reaction product. Using the diffusion-controlled reaction mechanism, a kinetic equation quantifying both Sn concentration and alloying element effects was derived and verified by comparing the kinetic data obtained using four different solders with different concentrations of Sn and the alloying elements.

The similarity between the activation energies of these four solders confirms that the diffusion of Sn atoms through the IMC is the rate-controlling step. Besides, the kinetic values are independent of the geometry of Ni, whether spherical particle or flat substrate.

The purpose of this paper is to develop a new composite solder to improve the reliability of composite solder joints. Nano-particles modified multi-walled carbon nanotubes (Ni-MWCNTs) can indeed improve the microstructure of composite solder joints and improve the reliability of solder joints. Although many people have conducted in-depth research on the composite solder of Ni-MWCNTs. However, no one has studied the performance of Ni-MWCNTs composite solder under different aging conditions. In this article, Ni-MWCNTs was added to Sn-Ag-Cu (SAC) solder, and the physical properties of composite solder, the microstructure and mechanical properties were evaluated.

In this study, the effect of different aging conditions on the intermetallic compound (IMC) layer growth and shear strength of Ni-modified MWCNTs reinforced SAC composite solder was studied. Compared with SAC307 solder alloy, the influence of Ni-MWCNTs with different contents (0, 0.1 and 0.2 Wt.%) on composite solder was examined. To study the aging characteristics of composite solder joints, the solder joints were aged at 80°C, 120°C and 150°C.

The experimental results show that the content of Ni-MWCNTs affects the morphology and growth of the IMC layer at the interface. The microhardness of the solder increases and the wetting angle decreases. After aging at moderate (120°C) and high temperature (150°C), the morphology of the Cu6Sn5 IMC layer changed from scallop to lamellar and the grain size became coarser. The following two different phase compositions were observed in the solder joints with Ni-MWCNTs reinforcement: Cu3Sn and (Cu, Ni)6Sn5. The fracture surface of the solder joints all appeared ductile dents, and the size of the pits increased significantly with the increase of the aging temperature. Through growth kinetic analysis, Ni-modified MWCNTs in composite solder joints can effectively inhibit the diffusion of atoms in solder joints. In short, when the addition amount of Ni-MWCNTs is 0.1 Wt.%, the solder joints exhibit the best wettability and the highest shear strength.

In this study, the effects of aging conditions on the growth and shear strength of the IMC layer of Ni modified MWCNTs reinforced SAC307 composite solder were studied. The effects of Ni MWCNTs with different contents (0, 0.1 and 0.2 Wt.%) on the composite solder were examined.

The paper aims to investigate the interfacial reactions between two Sn‐Cu based multicomponent Pb‐free solders, Sn‐2Cu‐0.5Ni and Sn‐2Cu‐0.5Ni‐0.5Au (wt per cent), and Ni substrates during soldering and aging.

Differential scanning calorimetry (DSC) was performed to measure the melting behaviors of the solders and determine the temperature of soldering. DSC tests showed that the onset temperature were 227.47 and 224.787°C for Sn‐2Cu‐0.5Ni and Sn‐2Cu‐0.5Ni‐0.5Au, respectively. Two intermetallic compounds (IMCs), Cu₆Sn₅ and (Cu,Ni)₆Sn₅, were formed in Sn‐2Cu‐0.5Ni solder. While the IMCs detected in Sn‐2Cu‐0.5Ni‐0.5Au matrix were (Cu,Ni)₆Sn₅, (Cu,Au)₆Sn₅ and (Cu,Ni)₆Sn₅. The IMC layer formed at the both solder/Ni interfaces was (Cu,Ni)₆Sn₅ with stick‐lick morphology after soldering at 260°C.

The interfacial IMC layers became planar when aged at 170°C for 500 h. However, cracks were found in the IMC layers at both joints when the aging time reached 1,000 h, that implies reliability problem may exist in the joints. Moreover, Au‐containing IMCs were found on the top of the IMC layer in Sn‐2Cu‐0.5Ni‐0.5Au/Ni joint after for 1,000 h.

This study focuses on the interfacial reactions of Sn‐2Cu‐0.5Ni/Ni and Sn‐2Cu‐0.5Au/Ni during soldering and isothermal aging.

The purpose of this paper is to elucidate the tribology behavior of polytetrafluoroethylene (PTFE) incorporated with three types of nickel–phosphorus (Ni-P) particles (i.e. low phosphorus [LP], medium phosphorus [MP] and high phosphorus [HP]) under dry sliding condition.

Ni-HP, Ni-MP and Ni-LP particles fabricated via an electroless plating process were incorporated into PTFE matrix with different additions to prepare Ni-P/PTFE composites (Ni-LP/PTFE, Ni-MP/PTFE and Ni-HP/PTFE). The tribology tests for these samples were carried out on a reciprocating ball-on-disc tribometer. The thermal stabilities, mechanical and tribological properties, morphologies and components of aforesaid Ni-P/PTFE composites were analyzed.

The marvelous effect of Ni-P incorporation on the simultaneous reduction in friction and wear of PTFE was corroborated.

Compared with that of pristine PTFE sample, the reduction on friction with a value of 27% and the reduction in wear about 94% for Ni-HP/PTFE composite is validated, which is probably related to the increased crystallinity and hardness due to the presence of Ni-P particles.

This paper aims to study the effect of SiO₂ nano‐particulates on the corrosion behaviour of Ni‐W/SiO₂ nanocomposite coatings.

Weight loss measurements, electrochemical measurements and scanning electron microscope were used to study the corrosion behaviour of Ni‐W/SiO₂ nanocomposite coatings in NaCl solution.

The incorporation of SiO₂ nano‐particulates into the Ni‐W alloy matrix significantly increased the corrosion resistance. The improvement in corrosion resistance was due to the SiO₂ nano‐particulates acting as physical barriers to the corrosion process by filling in crevices, gaps and microscopic holes on the surface of the Ni‐W alloy.

This study highlights the use of nano‐particulates for the control of Ni‐W alloy coating corrosion and opens a new route for industry in the anti‐corrosion field.

The reactions between Sn–Ag–Cu lead‐free solders of various compositions and Au/Ni surface finish in advanced electronic packages were studied. Three solder compositions, Sn–3.5Ag, Sn4Ag–0.5Cu, and Sn–3.5Ag‐0.75Cu were used, and their performance was compared. It was found that the Sn–4Ag–0.5Cu solder gave the worst results in terms of shear strength. The poor performance of the Sn–4Ag–0.5Cu solder can be explained based on its microstructure. The types of intermetallic compounds formed at the interface were different for different solder compositions. When there was no Cu the reaction product was Ni₃Sn₄. For the Sn–3.5Ag–0.75Cu solder, the reaction product was (Cu_1‐p‐qAu_pNi_q)₆Sn₅ immediately after reflow, and two intermetallic compounds (Cu_1‐p‐qAu_pNi_q)₆Sn₅ and (Ni_1‐yCu_y)₃Sn₄ formed after aging at 180°C for 250 and 500 h. For the Sn–4Ag–0.5Cu solder, both Ni₃Sn₄ and (Cu_1‐p‐qAu_pNi_q)₆Sn₅ were present near the interface right after reflow, and there was a layer of solder between these two intermetallic compounds.

The purpose of this paper is to comparatively investigate the microstructure and interfacial intermetallic compound (IMC) layer of Cu/SACPG/Ni and Cu/SAC0307/Ni solder joints after thermal aging.

The specimens were thermally aged at 150°C for 0, 24, 168 and 500 h. The microstructure and morphology of the interface IMC layer were observed by means of scanning electron microscope. The IMCs and the solder bump surface were analyzed by EDS. Moreover, the thickness of IMC layer was measured by using the image analysis software.

The morphology of IMC of Cu/SAC0307/Ni solder joint was consistent with that of the Cu/SACPG/Ni joint, which indicates that the addition of P and Ge had little effect on the IMC formation. The needle-like (Cu,Ni)6Sn5 was formed at the interface of solder/Ni solder joints. Meanwhile, the tiny particles inferred as Ag3Sn phase attached to the surface of (Cu,Ni)6Sn5. The growth rate of IMC layer of the Cu/SACPG/Ni joint was smaller than that of Cu/SAC0307/Ni joint with aging time increasing, which means the addition of trace P and Ge can slightly suppress the diffusion rate of the interfacial IMC.

There are no previous studies on the formation mechanism of the IMC layer of SAC0307 solder alloys with P and Ge addition.

The purpose of this paper is to investigate the hardness and elastic modulus on interfacial phases formed between Sn-3.5Ag solder and Ni-18 at. % W alloy film by nanoindentation. It has been found that a ternary amorphous Sn-Ni-W layer formed below Ni3Sn4 IMC at the interface. In this study, mechanical properties of the IMC formed between SA solder and Ni-18 at. % W film after six times reflows were performed by nanoindentation.

The characterization was carried at 25°C, and 100 indents were generated. The elastic modulus and hardness were investigated.

The results showed that hardness of Ni3Sn4 IMC was higher than amorphous Sn-Ni-W phase. A slight bigger indent was observed on the Sn-Ni-W layer compared with that on the Ni3Sn4 IMC. Lower topographical height in the Sn-Ni-W layer indicated that the Sn-Ni-W phase was softer compared with the Ni3Sn4 IMC. The lower hardness and soft Sn-Ni-W phase is significantly related to the amorphous structure that formed through solid-state amorphization.

There are no publications about the indentation on the interfacial between the Ni-W layer and the Sn-Ag solder.